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Alcatel Before PM
BEFORE
Foamtec Logo Alcatel After PM
AFTER

Vacuum Chamber PM Technique
Alcatel Comptech 2460 Process Chamber



OBJECTIVE:

TO PM THE ALCATEL COMPTECH 2460 PROCESS CHAMBER IN AN EFFECTIVE AND TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE


Note: The tool that was PM' d had never had all of the deposition removed. In order to keep the chamber in optimum condition a regularly scheduled chamber PM is recommended

Vacuum Chamber: ALCATEL COMPTECH 2460
Vacuum Chamber Process Residue: PROCESS INDUCED RESIDUE (AL2O3)
Vacuum Chamber Components: PROCESS CHAMBER

Old Procedure: Scrape/vacuum out excess build-up deposition
(NOT ENTIRELY REMOVED)
Recovery time: 12 to 16 hours
New Procedure: 3 hours using 140D/280D ScrubPADS, UltraSOLV® Sponge,
and MiraWIPES®
Recovery time: TBD
Foamtec Products

Vacuum Chamber Products:
Note: Products used for initial clean. Once regular PM cycle is developed, products may change
(3) HT4514D-10-1 140 Grit Diamond ScrubPAD
(1) HT4528D-10-1 280 Grit Diamond ScrubPAD
(1) HT4754 UltraSOLV® Sponge
(3) HT5790S-5 MiraWIPES®

Alcatel 2460 Process Chamber PM Procedure:

View “How to” instructional videos on http://www.foamtecintlwcc.com/video/

Step 1:
Using proper procedures and safety guidelines, shutdown and prepare Alcatel 2460 Process Chamber for wet clean
Step 2:
Fill FT1301 plastic container with approximately 12oz of DI water and place next to process chamber (See Fig 1)

Fig 1: FT1301 plastic container with DI water
FT1301 - Plastic Container
Step 3:
Place HT4514D 140 Grit Diamond ScrubPAD and HT4754 UltraSOLV® Sponge in container of DI water to moisten products (See Fig 2)

Place in container of DI water
Fig 2: Place Diamond ScrubPAD and UltraSOLV® Sponge in container of DI water
Step 4:
Take lightly dampened UltraSOLV® Sponge and wipe area of process chamber that is to be cleaned in order to remove flaking deposition from chamber
Step 5:
Take lightly dampened 140 Grit Diamond ScrubPAD and scrub a small area of the process chamber (See Fig 3)

Fig 3: Scrubbing process chamber with Diamond ScrubPAD
Scrubbing with ScrubPAD
NOTE:
REMEMBER IT IS NOT NECESSARY TO USE A LOT OF DI WATER DURING THIS SCRUB PORTION OF THE PM, ONLY ENOUGH TO KEEP DIAMOND ScrubPAD MOIST
Step 6:
After scrubbing a small area with the 140 Grit Diamond ScrubPAD, take the lightly dampened UltraSOLV® Sponge and wipe deposition from the scrubbed area
Step 7:
As Diamond ScrubPAD loads-up with deposition, pull ScrubPAD across damp UltraSOLV® Sponge to properly unload (See Fig 4, 5 & 6)

ScrubPAD loaded with deposition

Fig 4: ScrubPAD loaded with deposition

Pull ScrubPAD across UltraSOLV Sponge

Fig 5: Pull ScrubPAD across UltraSOLV® Sponge

Unloaded ScrubPAD

Fig 6: Unloaded ScrubPAD

Step 8:
Unload UltraSOLV® as much as possible by placing it in container of DI water and RINSE-OUT thoroughly (See Fig 7 & 8)

Loaded UltraSOLV Sponge

Fig 7: Loaded-up UltraSOLV® Sponge



Fig 8: UltraSOLV® Sponge AFTER rinse

UltraSOLV after rinse
Step 9:
As the HT4514D 140 Grit Diamond ScrubPAD becomes worn, replace with a second 140 Grit Diamond ScrubPAD
Step 10:
Repeat steps 4 – 9 for all remaining areas throughout process chamber. Remember to unload ScrubPAD and UltraSOLV® Sponge as necessary
Step 11:
Carefully clean chamber wall area near electrode with ScrubPAD (See Fig 9)

Fig 9: Area on chamber wall near electrode
Area near eletrode
Step 12:
Place HT4528D 280 Grit Diamond ScrubPAD in container of DI water to moisten product
Step 13:
Take lightly dampened 280 Grit Diamond ScrubPAD and scrub a small area of the chamber lid (See Fig 10)

Fig 10: Scrub chamber lid with 280 Grit Diamond ScrubPAD
Alcatel chamber lid
Step 14:
After scrubbing a small area with the 280 Grit Diamond ScrubPAD use the lightly dampened UltraSOLV® Sponge to wipe deposition from the scrubbed area
Step 15:
As ScrubPAD loads-up with deposition, pull ScrubPAD across damp UltraSOLV® Sponge to properly unload (See Step 7 and Step 8)
Step 16:
Continue scrub-wipe-unload procedure until all process residue is removed from chamber lid (See Fig 11)

Fig 11: Clean chamber lid Clean chamber lid
Step 17:
When scrub portion of wet clean is complete, prepare chamber for FINAL WIPE PROCEDURE by rinsing out UltraSOLV® Sponge with fresh DI water and performing a complete final process chamber wipe using the dampened UltraSOLV® Sponge


FINAL WIPE PROCEDURE:


IMPORTANT NOTE

THE USE OF HT5790S MiraWIPES® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM ALCATEL COMPTECH 2460 PROCESS CHAMBER


Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 12a & 12b)

Fig 12a: Current fab wiper after completely wiping process chamber
MiraWIPES are more effective
Fig 12b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper

MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY

Step 18:
After scrubbing Alcatel 2460 Process Chamber remove and replace your gloves with a clean pair
Step 19:
If available, use clean dry N2 to blow out the small areas and tight corners where DI water may have accumulated during the wet clean
Step 20:
Fold the HT5790S MiraWIPE® into quarters and dampen with IPA
Step 21:
With the dampened MiraWIPE® wipe down all areas of the process chamber, ensuring to refold the MiraWIPE® as necessary to expose a clean side of the MiraWIPE® as you wipe all areas within the chamber
NOTE:
Replace with a new IPA dampened MiraWIPE® as necessary
Step 22:
Repeat above MiraWIPE® FINAL WIPE PROCEDURE on all remaining areas of the process chamber and associated parts
Step 23:
Using proper procedures and safety guidelines and return Alcatel 2460 Process Chamber back to production