Alcatel 2460 Process Chamber PM Technique

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BEFORE

AFTER

Vacuum Chamber PM Technique
Alcatel Comptech 2460 Process Chamber

OBJECTIVE:

TO PM THE ALCATEL COMPTECH 2460 PROCESS CHAMBER IN AN EFFECTIVE AND TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE

Note: The tool that was PM' d had never had all of the deposition removed. In order to keep the chamber in optimum condition a regularly scheduled chamber PM is recommended

	Vacuum Chamber:	ALCATEL COMPTECH 2460
	Vacuum Chamber Process Residue:	PROCESS INDUCED RESIDUE (AL2O3)
	Vacuum Chamber Components:	PROCESS CHAMBER

	Old Procedure:	Scrape/vacuum out excess build-up deposition
		(NOT ENTIRELY REMOVED)
		Recovery time: 12 to 16 hours

	New Procedure:	3 hours using 140D/280D ScrubPADS, UltraSOLV^® Sponge,
		and MiraWIPES^®
		Recovery time: TBD


	Vacuum Chamber Products:
	Note: Products used for initial clean. Once regular PM cycle is developed, products may change
		(3) HT4514D-10-1 140 Grit Diamond ScrubPAD
		(1) HT4528D-10-1 280 Grit Diamond ScrubPAD
		(1) HT4754 UltraSOLV^® Sponge
		(3) HT5790S-5 MiraWIPES^®

Alcatel 2460 Process Chamber PM Procedure:

View “How to” instructional videos on http://www.foamtecintlwcc.com/video/

Step 1:

Using proper procedures and safety guidelines, shutdown and prepare Alcatel 2460 Process Chamber for wet clean

Step 2:

Fill FT1301 plastic container with approximately 12oz of DI water and place next to process chamber (See Fig 1)

Fig 1: FT1301 plastic container with DI water

Step 3:

Place HT4514D 140 Grit Diamond ScrubPAD and HT4754 UltraSOLV^® Sponge in container of DI water to moisten products (See Fig 2)

Fig 2: Place Diamond ScrubPAD and UltraSOLV^® Sponge in container of DI water

Step 4:

Take lightly dampened UltraSOLV^® Sponge and wipe area of process chamber that is to be cleaned in order to remove flaking deposition from chamber

Step 5:

Take lightly dampened 140 Grit Diamond ScrubPAD and scrub a small area of the process chamber (See Fig 3)

Fig 3: Scrubbing process chamber with Diamond ScrubPAD

NOTE:

REMEMBER IT IS NOT NECESSARY TO USE A LOT OF DI WATER DURING THIS SCRUB PORTION OF THE PM, ONLY ENOUGH TO KEEP DIAMOND ScrubPAD MOIST

Step 6:

After scrubbing a small area with the 140 Grit Diamond ScrubPAD, take the lightly dampened UltraSOLV^® Sponge and wipe deposition from the scrubbed area

Step 7:

As Diamond ScrubPAD loads-up with deposition, pull ScrubPAD across damp UltraSOLV^® Sponge to properly unload (See Fig 4, 5 & 6)

Fig 4: ScrubPAD loaded with deposition

Fig 5: Pull ScrubPAD across UltraSOLV^® Sponge

Fig 6: Unloaded ScrubPAD

Step 8:

Unload UltraSOLV^® as much as possible by placing it in container of DI water and RINSE-OUT thoroughly (See Fig 7 & 8)

Fig 7: Loaded-up UltraSOLV^® Sponge

Fig 8: UltraSOLV^® Sponge AFTER rinse

Step 9:

As the HT4514D 140 Grit Diamond ScrubPAD becomes worn, replace with a second 140 Grit Diamond ScrubPAD

Step 10:

Repeat steps 4 – 9 for all remaining areas throughout process chamber. Remember to unload ScrubPAD and UltraSOLV^® Sponge as necessary

Step 11:

Carefully clean chamber wall area near electrode with ScrubPAD (See Fig 9)

Fig 9: Area on chamber wall near electrode

Step 12:

Place HT4528D 280 Grit Diamond ScrubPAD in container of DI water to moisten product

Step 13:

Take lightly dampened 280 Grit Diamond ScrubPAD and scrub a small area of the chamber lid (See Fig 10)

Fig 10: Scrub chamber lid with 280 Grit Diamond ScrubPAD

Step 14:

After scrubbing a small area with the 280 Grit Diamond ScrubPAD use the lightly dampened UltraSOLV^® Sponge to wipe deposition from the scrubbed area

Step 15:

As ScrubPAD loads-up with deposition, pull ScrubPAD across damp UltraSOLV^® Sponge to properly unload (See Step 7 and Step 8)

Step 16:

Continue scrub-wipe-unload procedure until all process residue is removed from chamber lid (See Fig 11)

Fig 11: Clean chamber lid

Step 17:

When scrub portion of wet clean is complete, prepare chamber for FINAL WIPE PROCEDURE by rinsing out UltraSOLV^® Sponge with fresh DI water and performing a complete final process chamber wipe using the dampened UltraSOLV^® Sponge

FINAL WIPE PROCEDURE:

IMPORTANT NOTE

THE USE OF HT5790S MiraWIPES^® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM ALCATEL COMPTECH 2460 PROCESS CHAMBER

Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 12a & 12b)

Fig 12a: Current fab wiper after completely wiping process chamber

Fig 12b: Particles picked up using HT5790S MiraWIPES^® after completely wiping with current fab wiper

MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY

Step 18:

After scrubbing Alcatel 2460 Process Chamber remove and replace your gloves with a clean pair

Step 19:

If available, use clean dry N₂ to blow out the small areas and tight corners where DI water may have accumulated during the wet clean

Step 20:

Fold the HT5790S MiraWIPE^® into quarters and dampen with IPA

Step 21:

With the dampened MiraWIPE^® wipe down all areas of the process chamber, ensuring to refold the MiraWIPE^® as necessary to expose a clean side of the MiraWIPE® as you wipe all areas within the chamber

NOTE:

Replace with a new IPA dampened MiraWIPE^® as necessary

Step 22:

Repeat above MiraWIPE^® FINAL WIPE PROCEDURE on all remaining areas of the process chamber and associated parts

Step 23:

Using proper procedures and safety guidelines and return Alcatel 2460 Process Chamber back to production