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AMAT CMP
TUNGSTEN AND OXIDE SLURRY CLEAN

OBJECTIVE:
TO ELIMINATE THE PROBLEMS ASSOCIATED WITH USING SCOTCH-BRITE™ AND CERAMIC SCRAPPERS TO REMOVE TUNGSTEN AND OXIDE SLURRY FROM CMP EQUIPMENT

PROBLEM:
  • Using Scotch-Brite™ and/or ceramic scrappers to clean CMP tool
  • Drying CMP pedestal with non-absorbent fab polyester wipes
RISK:
  • Risk of Scotch-Brite™ residuals left inside CMP tool causing scratches on processed wafers
  • Difficult to remove slurry built-up on Lexan panels without scratching panel
  • Difficult to glue down new polishing pad onto wet surface
SOLUTION:
  • Diamond ScrubPAD - Eliminates the use of Scotch-Brite™ and/or ceramic scrappers to remove slurry build up from CMP equipment
  • ScrubCLEAN™ Sponge - Effectively cleans Lexan panels without scratching surface
  • UltraSOLV® Sponge - Effectively dries CMP pedestal
Scotch-Brite Residual
Scotch-Brite™ Residual		 ScrubPAD Residual
Diamond ScrubPAD Residual

Scotch-Brite vs ScrubPAD
Why risk the dangers of using Scotch-Brite™?

TUNGSTEN SLURRY CLEAN: Diamond Grit ScrubPAD

Diamond ScrubPAD
   Scotch-Brite™

Diamond ScrubPAD Gently Removing Slurry Build-Up
Diamond ScrubPAD Gently
Removing Slurry Build-Up		 Clean CMP Part
Clean CMP Part

OXIDE SLURRY CLEAN: Diamond Grit ScrubPAD

ScrubPAD for cleaning slurry ScrubPAD cleaning slurry
Before
BEFORE 		After
AFTER

CMP POLISHING HEAD CLEAN: Diamond Grit ScrubPAD

CMP Polishing Head Before
BEFORE 		CMP Polishing Head After
AFTER

LEXAN PANEL CLEAN: FS206 ScrubCLEAN® Sponge

CMP Lexan Panel Coated With Slurry
CMP Lexan Panel Coated With Slurry

ScrubCLEAN Gently Removing CMP Slurry
ScrubCLEAN® Gently
Removing CMP Slurry		 Clean Lexan Panel
Clean Lexan Panel

Scotch-Brite™ is a trademark of 3M Corporation