AMAT High Current Implant Decel Column PM Technique

Fig 4: UltraSOLV® Sponge used to wipe out loosened deposition

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BEFORE		AFTER

Vacuum Chamber PM Technique
AMAT High Current Implant Decel Column

OBJECTIVE:
TO EFFECTIVELY PM THE APPLIED MATERIALS HIGH CURRENT IMPLANT DECEL COLUMN IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE

	Vacuum Chamber:	APPLIED MATERIALS HIGH CURRENT IMPLANT
	Vacuum Chamber Process Residue:	PROCESS INDUCED RESIDUE
	Vacuum Chamber Components:	DECEL COLUMN


	Old Procedure:	2+ hours using Scotch-Brite™, DI water, 100+ wipes
		Recovery time: 4 to 6 Hours

	New Procedure:	45 minutes using Foamtec International's products with DI water
		Recovery time: 1 to 2 Hours


	Vacuum Chamber Products:
	High Current Implant Decel PM Kit PM
	PM Kit P/N: HT4500-DECL PM KIT
			(1) HT4754 UltraSOLV^® Sponge
			(1) HT4528DC3-1 280 Grit Diamond ScrubDISK^®
			(1) HT4536D-10-1 360 Grit Diamond ScrubPAD
			(1) HT901 ErgoSCRUB^® w/hook
			(1) HT1790-5 UltraSOLV^® Foam Swab
			(5) HT4790-5 UltraSOLV^® Wipers
			(1) HT5790S-25 MiraWIPES^®


AMAT High Current Implant Decel Column PM Procedure:

View “How to” instructional videos on http://www.foamtecintlwcc.com/flash/

Step 1:	Using proper procedures and safety guidelines prepare AMAT High Current Decel Column for wet clean

Step 2:	Stage a small container of DI water inside a large plastic bag next to AMAT Decel Column

Step 3:	Attach HT4528DC3-1, 280 Grit Diamond ScrubDISK^® onto FT901 Soft ErgoSCRUB^®

Step 4:	Place HT4754 UltraSOLV^® Sponge, ErgoSCRUB^® w/ScrubDISK^® and ScrubPAD in container of DI water to moisten products (See Fig 1)


		Fig 1: Foamtec International products in small container of DI water


Step 5:	Take dampened UltraSOLV^® Sponge and pre-wipe decel column, removing any loose deposition or flakes. Continue to re-moisten the UltraSOLV^® Sponge in container of DI water as necessary


	Fig 2: Foamtec International UltraSOLV^® Sponge pre-wiping decel column


Step 6:	Take dampened 280 Grit Diamond ScrubDISK^® attached to ErgoSCRUB^® and scrub decel column within high current implanter (See Fig 3)


		Fig 3: ErgoSCRUB^® w/280 Grit Diamond ScrubDISK^® scrubbing decel column


Step 7:	As loose deposition begins to build up within the decel column, take UltraSOLV^® Sponge and wipe the area free of deposition (See Fig 4 & 5)


			Fig 5: UltraSOLV^® Sponge wiped away loosened deposition

Step 8:	Continue to rinse out sponge in container of DI water as necessary to free UltraSOLV^® Sponge of excess deposition

Step 9:	As ScrubDISK^® loads up with deposition, pull & twist ScrubDISK^® across dampened UltraSOLV^® Sponge to unload ScrubDISK^® (See Fig 6, 7 & 8)

Fig 6: ScrubDISK loaded with deposition

Fig 7: Pull and twist ScrubDISK across UltraSOLV^® Sponge

Fig 8: Unloaded ScrubDISK


Step 10:	Unload the UltraSOLV^® HT4754 Sponge by rinsing out with DI water and ringing out into a HazMat container (See Fig 9 & 10)

	Fig 9: Loaded-up UltraSOLV^® Sponge			Fig 10: UltraSOLV^® Sponge AFTER rinse

Step 11:	Repeat steps 6 – 10, scrubbing the remaining areas of the decel column as much as possible. Rinse out UltraSOLV^® Sponge and unload 280 Grit Diamond ScrubDISK^® as necessary

Step 12:	Moisten the 360 Grit Diamond ScrubPAD in container of DI water and re-scrub all areas of the decel column using the same technique described above (UNLOAD ScrubPAD AS NECESSARY), concentrating on the areas of heavier deposition buildup and hard to reach areas throughout the decel column (See Fig 11)


		Fig 11: 360 Grit Diamond ScrubPAD scrubbing decel column


Step 13:	When deposition has been removed sufficiently throughout entire decel column, rinse out UltraSOLV^® Sponge with fresh DI water and re-wipe the entire decel column in preparation for FINAL WIPE PROCEDURE (See Fig 12 & 13)



		Fig 12: Decel Column after being wiped with UltraSOLV^® Sponge


			Fig 13: Foamtec International products used for FINAL WIPE PROCEDURE

FINAL WIPE PROCEDURE:

IMPORTANT NOTE

THE USE OF HT5790S MiraWIPES^® DURING THE FINAL WIPE PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM IMPLANT DECEL COLUMN

Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 14a & 14b)


Fig 14a: Current fab wiper after completely wiping the chamber		Fig 14b: Particles picked up using HT5790S MiraWIPES^® after completely wiping with current fab wiper


	MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY


Step 14:	Fold an UltraSOLV^® Foam Wiper into quarters, apply IPA to one side and pull the Foam Wiper across one entire section of ceramic decel column (See Fig 15)


		Fig 15: UltraSOLV^® Foam Wiper folded in ¼’s with IPA


Step 15:	Continue the same technique using a new section of the UltraSOLV^® Foam Wiper for each wipe across the decel column. Refold wiper and replace wiper as necessary

Step 16:	When the entire ceramic decel column has been wiped with UltraSOLV^® Foam Wiper, dampen the HT5790S MiraWIPES^® with IPA and perform a THOROUGH AND EFFECTIVE FINAL WIPE-DOWN of the entire decel column, concentrating on the metal areas not wiped with the UltraSOLV^® Foam Wiper

Step 17:	Use HT1790 UltraSOLV^® Foam Swabs, dampened with IPA, and swab out all the tight areas that were not reached with the HT5790S MiraWIPES^®. This is very critical as you will need to reach all areas not normally wiped with a standard fab wiper

Step 18:	Prior to closing the chamber, take the remaining MiraWIPES^® dampened with IPA, and re-wipe all areas within the process chamber and any parts that need to be returned to the chamber


Waste Accumulated

Scotch-Brite™ is a trademark of 3M Corporation