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| BEFORE |
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AFTER |
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| Vacuum Chamber PM Technique |
| AMAT QUANTUM X Process Chamber |
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| OBJECTIVE: |
| TO EFFECTIVELY PM THE AMAT QUANTUM X PROCESS CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE |
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Vacuum Chamber: |
AMAT QUANTUM–X™ IMPLANTER |
| Vacuum Chamber Process Residue: |
PROCESS INDUCED RESIDUE |
| Vacuum Chamber Components: |
PROCESS CHAMBER & DECEL COLUMN |
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Old Procedure: |
4+ hours using Scotch-Brite™ with 200+ wipes |
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Tool recovery: 6 to 8 Hours conditioning wafers to pass particle specs |
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New Procedure: |
<2 hour using 360 Grit Diamond ScrubPAD, UltraSOLV® Sponge, DI water & IPA with 25 MiraWIPES® |
| Tool recovery: <4 Hours CONDITIONING WAFERS TO PASS PARTICLE SPECS |
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Vacuum Chamber Products: |
| AMAT Quantum–X™ PM Kit |
| PM Kit P/N: HT4500 - QUAN4 |
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(2) HT4536D-10-1 360 Grit Diamond ScrubPAD |
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(1) HT4528D82-1 280 Grit Diamond ScrubPAD For ErgoWRENCH® |
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(1) HT4754 UltraSOLV® Sponge |
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(4) HT1511FC-5 MiraSWABS® (20 MiraSWABS®) |
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(1) HT5790S-25 MiraWIPES® (25 MiraWIPES®) |
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(1) HT4790-5 UltraSOLV® Wipers |
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| Implant AMAT Quantum–X™ Process Chamber PM Procedure: |
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| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ |
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| Step 1: |
Using proper procedures and safety guidelines properly prepare AMAT Quantum–X™ process chamber for wet clean |
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| Step 2: |
Fill FT1301 plastic container with approximately 12oz of DI water and place on protective pad next to process chamber (See Fig 1) |
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Fig 1: FT1301 plastic container with DI water
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| Step 3: |
Place HT4536D 360 Grit Diamond ScrubPAD and HT4754 UltraSOLV® Sponge in container of DI water to moisten products |
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| Step 4: |
Take lightly dampened UltraSOLV® Sponge and wipe area of process chamber and decel column to be cleaned |
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| Step 5: |
Take lightly dampened 360 Grit Diamond ScrubPAD and proceed to scrub off deposition from Decel Column (See Fig 2 & 3) |
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Fig 2 & 3: Lightly dampened 360 Grit Diamond ScrubPAD scrubbing areas within Decel Column
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Fig 3b: UltraSOLV® Sponge placed at bottom of bushing to collect any excess water |
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| NOTE: |
WHEN SCRUBBING AREA ABOVE DECEL COLUMN, RECOMMEND PLACING UltraSOLV® SPONGE AT BOTTOM OF BUSHING TO ABSORB ANY EXCESS WATER DRAINING FROM THE 360 GRIT DIAMOND ScrubPAD (See Fig 3b) |
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| Step 6: |
After scrubbing a small area with the 360 Grit Diamond ScrubPAD, take the lightly dampened UltraSOLV® Sponge and wipe deposition from the scrubbed area (See Fig 4) |
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Fig 4: Lightly dampened UltraSOLV® Sponge wiping deposition from process chamber
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| Step 7: |
As Diamond ScrubPAD loads-up with deposition, pull ScrubPAD across damp UltraSOLV® Sponge to properly unload (See Fig 5, 6 & 7) |
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Fig 5: ScrubPAD loaded with deposition |
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Fig 6: Pull ScrubPAD across UltraSOLV® Sponge |
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Fig 7: Unloaded ScrubPAD
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| Step 8: |
Unload UltraSOLV® Sponge as much as possible by placing it back in container of DI water, and RINSE-OUT thoroughly (See Fig 8 & 9) |
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Fig 8: Loaded-up UltraSOLV® Sponge |
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Fig 9: UltraSOLV® Sponge AFTER rinse |
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| Step 9: |
For areas of heavy deposition build-up, attach a 280 Grit Diamond HT4528D82-1 ScrubPAD to a FT832 ErgoWRENCH® and using the same technique outlined above scrub deposition from those areas (See Fig 10) |
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| Fig 10: ErgoWRENCH® scrubbing heavy deposition build-up |
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| Step 10: |
Repeat steps 4 – 9 for all remaining areas throughout Quantum X Process Chamber |
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| Step 11: |
When scrub portion of wet clean is complete, prepare chamber for FINAL WIPE PROCEDURE by rinsing out UltraSOLV® Sponge with fresh DI water and perform a complete final process chamber wipe using the dampened UltraSOLV® Sponge |
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| Step 12: |
Take clean N2 or He and blow out all tight areas and corners where DI water may have accumulated during the wet clean, ensure to have a wiper next to the area being blown in order to catch any spraying water that might be dispersed (See Fig 11 & 12) |
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Fig 11 & 12: Clean He blowing out the tight corners where DI water may have accumulated |
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| FINAL WIPE PROCEDURE: |
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IMPORTANT NOTE |
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MUST USE HT5790S MiraWIPES® AND HT1511FC MiraSWABS® DURING FINAL WIPE PORTION OF PROCEDURE TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM QUANTUM X PROCESS CHAMBER |
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| Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 13a & 13b) |
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Fig 13a: Current fab wiper after completely wiping the chamber |
Fig 13b: Particles picked up using HT5790S MiraWIPES ® after completely wiping with current fab wiper |
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| NOTE: |
Below is an example of the particles left behind in the Quantum X Decel Column after the FINAL WIPE PORTION of the PM was performed with current fab wiper (See Fig 14) |
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Fig 14: Particles picked up using HT5790S MiraWIPE ® after completely wiping with current fab wiper |
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| Step 13: |
After scrubbing Quantum X Process Chamber, remove and replace your gloves with a clean pair of gloves |
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| Step 14: |
Fold the HT5790S MiraWIPE® into quarters and dampen with IPA |
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| Step 15: |
With the dampened MiraWIPE®, wipe down all areas of the process chamber. Refold the MiraWIPE® as necessary to expose a clean side of the MiraWIPE® as you wipe all areas of the chamber (See Fig 15 & 16) |
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Fig 15 & 16: HT5790S MiraWIPE ® effectively wiping all areas throughout process chamber |
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| NOTE: |
REPLACE WITH A NEW DAMPENED MiraWIPE® AS NECESSARY |
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| Step 16: |
Dampen the HT1511FC MiraSWAB® with IPA and wipe out the hard to reach areas, such as o-ring grooves, screw holes and tight corners (See Fig 17 & 18) |
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Fig 17 & 18: HT1511FC MiraSWAB ® effectively wiping tight areas throughout process chamber |
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| NOTE: |
Below is an example of the particles the HT1511FC MiraSWAB® was able to remove from the hard to reach, tight areas in the Quantum X Decel Column (See Fig 19 & 20) |
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Fig 19 & 20: Additional contamination the HT1511FC MiraSWAB ® effectively removed from Quantum X Decel Column |
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| Step 17: |
Repeat above MiraWIPE® & MiraSWAB® FINAL WIPE PROCEDURE on all remaining areas of Quantum X process chamber and associated parts |
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| Step 18: |
Wipe down all bead blasted parts with IPA and HT4790 UltraSOLV® wipers. Wipe all non-bead blasted parts going back into the process chamber with HT5790S MiraWIPES® and IPA (See Fig 21) |
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Fig 21: Particles the UltraSOLV® Foam wiper was able to remove from a supposed clean bead-blasted part |
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| Step 19: |
Using proper procedures and safety guidelines return Quantum X Process Chamber to production |
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Scotch-Brite™ is a trademark of 3M Corporation
