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Before Foamtec Logo
After
BEFORE AFTER
Vacuum Chamber PM Technique
AMAT WXP Buffer
OBJECTIVE:
TO PM THE AMAT WXP BUFFER IN AN EFFECTIVE AND TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE
 
Vacuum Chamber: AMAT WxP
Vacuum Chamber Process Residue: HeWEB PROCESS INDUCED RESIDUE
Vacuum Chamber Components: BUFFER LID & BUFFER REGION
Old Procedure: Scotch-Brite™, hydrogen peroxide (not recommended) DI water, wipers and IPA
New Procedure: Diamond ScrubPAD, DI water, MiraWIPES® and IPA
DANGER:
USE OF HYDROGEN PEROXIDE (H2O2) CAUSES A VARIETY OF ENVIRONMENTAL, HEALTH, AND SAFETY CONCERNS. CAN CAUSE PROLONGED PUMP DOWN TIMES AND HIGH VOLTAGE ARCING. BREATHING APPARATUS AND FULL ACID PPE IS RECOMMENDED WHILE SCRUBBING WITH H2O2. SCRUBBING WHILE USING H2O2 INCREASES THE RISK OF FIRES AND/OR THE RELEASE OF HAZARDOUS CHEMICAL FUMES, POTENTIALLY RESULTING IN PERSONAL INJURY AND PROPERTY DAMAGE
Vacuum Chamber Products:
(3) HT4580D-10-1 800 Grit Diamond ScrubPAD
(1) HT4513PD-10-1 1350 Grit Diamond ScrubPAD
(1) HT4754 UltraSOLV® Sponge
(1) HT5790S-25 MiraWIPES®
AMAT WxP Buffer PM Procedure:
View “How to” instructional videos on http://www.foamtecintlwcc.com/video/
BUFFER LID
Step 1: Using proper procedures and safety guidelines shutdown, vent and prep buffer lid for PM
Step 2: Place HT4754 UltraSOLV® Sponge & 800 Grit Diamond ScrubPAD into container with approximately 1 liter of DI water (See Fig 1)
Place in container of DI water
Fig 1: Diamond ScrubPAD & Sponge in 1-liter DI water
Step 3: Using the dampened UltraSOLV® Sponge, wipe down all areas throughout buffer lid
NOTE: Continue to re-soak and dampen the UltraSOLV® Sponge as necessary
Step 4: With a dampened UltraSOLV® Sponge wipe a 6” to 8” scrubbing area on the buffer lid
Step 5: Using the dampened 800 Grit Diamond ScrubPAD, scrub deposition from moistened area on buffer lid (See Fig 2)
Scrubbing buffer
Fig 2: Dampened 800 Grit Diamond ScrubPAD
NOTE: REMEMBER IT IS NOT NECESSARY TO USE A LOT OF DI WATER DURING THIS SCRUB PORTION OF THE PM, ONLY ENOUGH TO KEEP DIAMOND ScrubPAD MOIST
Step 6: Before area being scrubbed dries out, take the dampened UltraSOLV® Sponge and wipe off deposition from buffer lid (See Fig 3)
UltraSOLV Sponge wiping buffer
Fig 3: Dampened UltraSOLV® Sponge wiping off deposition
Step 7: As 800 Grit Diamond ScrubPAD becomes loaded with deposition, pull in one motion across UltraSOLV® Sponge (See Fig 4, 5 & 6)
Loade ScrubPAD
Pull ScrubPAD across Sponge
Unloaded ScrubPAD
Fig 4: ScrubPAD loaded with deposition
Fig 5: Pull ScrubPAD across UltraSOLV® Sponge
Fig 6: Unloaded ScrubPAD
Step 8: Unload UltraSOLV® as much as possible by placing it in container of DI water and RINSE-OUT thoroughly. Repeat steps 7 and 8 as necessary (See Fig 7 & 8)
Loaded UltraSOLV Sponge
Fig 7: Loaded-up UltraSOLV® Sponge
UltraSOLV after rinse
Fig 8: UltraSOLV® Sponge AFTER rinse
Slotted Areas on Buffer Lid:
Step 9: As 800 Grit Diamond ScrubPAD becomes softer throughout PM fold in half and gently clean slotted areas on buffer lid (See Fig 9a & 9b)
Red Arrow
Buffer slots
Fig 9a: Slot cleaned with 800 Grit ScrubPAD
Fig 9b: Slot NOT cleaned with 800 Grit ScrubPAD
Red Arrow
QUARTZ WINDOWS:
Step 10: Using same technique used to clean buffer lid, take a moistened 1350 Grit Diamond ScrubPAD and clean off deposition from quartz window
NOTE: DO NOT USE DRY ScrubPAD ON QUARTZ WINDOWS AS SCRATCHING MAY OCCUR
Step 11: Take 1350 Grit Diamond ScrubPAD and polish all vacuum sealed areas on buffer lid
Step 12: Repeat steps 5 – 11 until entire buffer lid assembly has been effectively cleaned
BUFFER LID FINAL IPA WIPE PROCEDURE:
IMPORTANT NOTE
THE USE OF HT5790S MiraWIPES® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM THE AMAT WxP BUFFER
 
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 10a & 10b)
MiraWIPES are more effective
Fig 10a: Current fab wiper after completely wiping WxP Buffer
Fig 10b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper
Red Arrow
Red Arrow
MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY
Step 13: Dampen the HT5790S MiraWIPES® with IPA and perform a THOROUGH AND EFFECTIVE FINAL WIPE-DOWN of the entire buffer lid assembly – including quartz windows, slots and all vacuum sealing surfaces
IMPORTANT:
This important step must be effectively followed in order to achieve the maximum efficiency of tool recovery and performance. Continue to wipe-down all of the affected PM areas on Buffer lid until all MiraWIPES® no longer remove any more deposition
Step 14: Ensure to wipe down all shields and spare parts placed back on the buffer lid using additional IPA dampened HT5790S MiraWIPES®
BUFFER REGION:
Step 15: Using the remainder 800 Grit Diamond ScrubPADS available, and the same technique outlined above, effectively clean all areas and parts throughout buffer region
This will include actuator pistons, slit valves and covers within buffer region (See Fig 11a - 11d)
Clean and unclean areas of the buffer region
Fig 11a: CLEANED area within buffer region
Fig 11b: DIRTY area within buffer region

Fig 11d: DIRTY actuator piston

Fig 11c: CLEANED actuator piston
BUFFER REGION FINAL IPA WIPE-DOWN:
Step 16: Ensure to effectively wipe down the entire buffer region using the Foamtec HT5790S MiraWIPES®
NOTE: When entire buffer PM is completed and just before the buffer lid is closed, perform one last FINAL WIPE of all critical areas and vacuum sealing surfaces with the HT5790S MiraWIPES®

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