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| BEFORE | AFTER | |
| Vacuum Chamber PM Technique | ||
| AMAT WxZ/WxP | ||
| OBJECTIVE: | ||
| TO EFFECTIVELY PM THE AMAT WxZ/WxP CHAMBER IN A TIMELY MANNER, WHILE HELPING TO MINIMIZE PARTICLE ISSUES, IMPROVE TOOL PERFORMANCE AND REDUCE HAZARDOUS WASTE | ||
| Vacuum Chamber: | AMAT WxP | |
| Vacuum Chamber Process Residue: | HeWEB PROCESS INDUCED RESIDUE | |
| Vacuum Chamber Components: | CHAMBER REGION |
| Old Procedure: | Scotch-Brite™, hydrogen peroxide DI water, wipers and IPA | |
| New Procedure: | Diamond ScrubPAD, DI water, MiraWIPES® and IPA | |
| DANGER: | ||
| USE OF HYDROGEN PEROXIDE (H2O2) CAUSES A VARIETY OF ENVIRONMENTAL, HEALTH, AND SAFETY CONCERNS. CAN CAUSE PROLONGED PUMP DOWN TIMES AND HIGH VOLTAGE ARCING. BREATHING APPARATUS AND FULL ACID PPE IS RECOMMENDED WHILE SCRUBBING WITH H2O2. SCRUBBING WHILE USING H2O2 INCREASES THE RISK OF FIRES AND/OR THE RELEASE OF HAZARDOUS CHEMICAL FUMES, POTENTIALLY RESULTING IN PERSONAL INJURY AND PROPERTY DAMAGE | ||
| Vacuum Chamber Products: | ||||
| (2) HT4536D-10-1 360 Grit Diamond ScrubPAD | ||||
| (1) HT4580D-10-1 800 Grit Diamond ScrubPAD | ||||
| (1) HT4754 UltraSOLV® Sponge | ||||
| (2) HT5790S-5 MiraWIPES® | ||||
| AMAT WxZ/WxP Chamber PM Procedure: | ||||||
| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ | ||||||
| Step 1: | Using proper procedures and safety guidelines shutdown, vent and prep WxP chamber for PM | |||||
| Step 2: | Place HT4754 UltraSOLV® Sponge & 360 Grit Diamond ScrubPAD into container with approximately 1 liter of DI water (See Fig 1) | |||||
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Fig 1: 360 Grit Diamond ScrubPAD & UltraSOLV® Sponge in 1-liter DI water |
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| Step 3: | Immediately after opening WxP chamber, wipe down entire chamber area with dampened UltraSOLV® Sponge. Concentrate on edge of e-chuck, as this area will begin to react when it is opened to atmosphere (See Fig 2) | |||||
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Fig 2: Dampened UltraSOLV® Sponge wiping e-chuck |
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| Step 4: | With a dampened UltraSOLV® Sponge, wipe a 6” to 8” scrubbing area on WxP chamber wall | |||
| NOTE: | DI WATER IS THE ONLY SOLVENT USED DURING THE SCRUB PORTION OF WXP CHAMBER PM | |||
| Step 5: | Using the dampened 360 Grit Diamond ScrubPAD, scrub deposition from moistened area on WxP chamber wall (See Fig 3) | |||
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Fig 3: Dampened 360 Grit Diamond ScrubPAD scrubbing chamber wall |
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| Step 6: | Before area being scrubbed dries out, take the dampened UltraSOLV® Sponge and wipe off deposition from WxP chamber (See Fig 4) | |||
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Fig 4: Dampened UltraSOLV® Sponge wiping off deposition from WxP chamber wall |
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| NOTE: | IT IS CRITICAL TO WIPE THE CHAMBER IMMEDIATELY AFTER COMPLETING THE SCRUB, AS THE DEPOSITION WILL QUICKLY DRY. IT WILL HAVE TO BE RE-SCRUBBED TO BE REMOVED | |||
| Step 7: | As 360 Grit Diamond ScrubPAD becomes loaded with deposition, pull in one motion across UltraSOLV® Sponge to unload (See Fig 5, 6 & 7) | |||
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Fig 5: ScrubPAD loaded with deposition |
Fig 6: Pull ScrubPAD across UltraSOLV® Sponge |
Fig 7: Unloaded ScrubPAD
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| Step 8: | Unload UltraSOLV® as much as possible by placing it in container of DI water and RINSE-OUT thoroughly (See Fig 8 & 9) | ||
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Fig 8: Loaded-up UltraSOLV® Sponge
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Fig 9: UltraSOLV® Sponge AFTER rinse |
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| CHAMBER CATHODE | |||
| Step 9: | Use a dampened 800 Grit Diamond ScrubPAD and gently scrub off deposition from cathode area. Use UltraSOLV® Sponge to wipe area after scrubbing (See Fig 10) | ||
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Fig 10: Cleaned cathode area |
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| Step 10: | Use an 800 Grit Diamond ScrubPAD to polish all vacuum sealed areas throughout WxP chamber | ||
| Step 11: | Repeat steps 5 – 10 until entire WxP chamber has been effectively cleaned | ||
| FINAL WIPE PROCEDURE: | ||
IMPORTANT NOTE |
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| THE USE OF HT5790S MiraWIPES® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM THE CHAMBER | ||
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 11a & 11b) |
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Fig 11a:Current fab wiper after completely wiping chamber |
Fig 11b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper |
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MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY |
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| Step 12: | Dampen the HT5790S MiraWIPES® with IPA and perform a THOROUGH AND EFFECTIVE FINAL WIPE-DOWN of the entire chamber assembly, including cathode, slit valves and all vacuum sealing surfaces |
| IMPORTANT: | |
| This important step must be effectively followed in order to achieve the maximum efficiency of tool recovery and performance. Continue to wipe-down all of the affected PM areas on buffer lid until all MiraWIPES® no longer remove any more deposition | |
| Step 13: | Wipe down all shields and spare parts placed back into the WxP chamber using additional IPA dampened HT5790S MiraWIPES® |
Scotch-Brite™ is a trademark of 3M Corporation
