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| BEFORE | AFTER | |
| Vacuum Chamber PM Technique | ||
| AMAT XGEN 300 - CVD PolyChamber Wet Scrub | ||
| OBJECTIVE: | ||
TO EFFECTIVELY PM THE APPLIED MATERIALS XGEN CVD POLY CHAMBER IN A TIMELY MANNER WHILE MAINTAINING THE WAFER THINNESS, THE WAFER Rs NON-UNIFORMITIES WITHIN SPECIFICATIONS AND IMPROVING TOOL PERFORMANCE |
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| Vacuum Chamber: | APPLIED MATERIALS XGEN 300 CVD POLY | |
| Vacuum Chamber Process Residue: | PROCESS INDUCED RESIDUE | |
| Vacuum Chamber Components: | CHAMBER BODY |
| Old Procedure: | Wipe chamber body using standard fab wipers & IPA | |
| Recovery time: 24 hours + conditioning | ||
| New Procedure: | AMAT & Foamtec International designed cleaning technique | |
| Recovery time: <24 hours, no conditioning (Pass particles 1st run) | ||
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| Vacuum Chamber Products: | ||||
| LAM2300 EXELAN OXIDE ETCH PM KIT | ||||
PM Kit P/N: HT4500 – XGEN3 |
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| (2) HT4580D-10-1 800 Grit Diamond ScrubPAD | ||||
| (1) HT4518D-10-1 180 Grit Diamond ScrubPAD | ||||
| (1) HT179080D-1 800 Grit Diamond ScrubTIP® | ||||
| (1) HT179018D-1 180 Grit Diamond ScrubTIP® | ||||
| (1)HT174913PD-1 1350 Grit Diamond ScrubTIP | ||||
| (1) HT4754 UltraSOLV® Sponge | ||||
| (1) HT1713-5 UltraSOLV® Dual Tip Swab (5pc) | ||||
| (3) HT5790S-5 MiraWIPE® (15pc) | ||||
| (1) HT4375B-1 FirmWIPE™ Disk Foam Plate | ||||
| (1) HT6635B-1 Foam Plug | ||||
| (1) FT1301 Plastic Sealed Container | ||||
| AMAT XGEN 300 CVD POLY Chamber PM Procedure: | ||||||
ENSURE TO REVIEW APPLIED MATERIALS CHAMBER WET SCRUCLEAN DOCUMENT PRIOR TO PERFORMING CHAMBER PM |
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| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ | ||||||
| Step 1: | Using proper procedures and safety guidelines prepare AMAT XGEN 300 Poly Chamber for wet scrub. Remove pumping plate, lift pin, heater assembly, and manometer assembly (See Fig 1) | |||||
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Fig 1: XGEN Chamber prepped for wet scrub PM
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| Step 2: | Place HT4375B-1 FirmWIPE™ Disk Foam Plate in the bottom of the chamber to protect excess water from entering heater channel (See Fig 2 & 3) | ||
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Fig 2 & 3: Placing HT4375B-1 Foam Plate in bottom of chamber |
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| Step 3: | Place HT6635B-1 Foam Plug in pressure gage channel for protection (See Fig 4 & 5) |
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Fig 4 & 5: Placing HT6635B-1 Foam Plug in channel |
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| Step 4: | Fill FT1301 Plastic Sealed Container with approximately 3” to 4” of DI water | ||
| Step 5: | Place HT4754 UltraSOLV® Sponge and HT4580D-1 800 Grit Diamond ScrubPAD in container of DI water to moisten (See Fig 6) | ||
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Fig 6: UltraSOLV® Sponge and ScrubPAD in DI water
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| Step 6: | Use damp UltraSOLV® Sponge to wipe a small area within the XGEN Chamber that is to be scrubbed. Keep area moist with DI water during scrub | ||||
| NOTE: | MAY WANT TO REDUCE CHAMBER BODY TEMPERATURE TO HELP KEEP DI WATER FROM EVAPORATING QUICKLY (See Fig 7) | ||||
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Fig 7: Wiping a small area within XGEN Chamber |
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| Step 7: | Use HT4580D ScrubPAD lightly dampened with DI water to SCRUB the moistened area within XGEN Chamber to remove deposition buildup (See Fig 8) | |||
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Fig 8: Scrubbing a small area within XGEN Chamber |
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| Step 8: | WIPE with the UltraSOLV® Sponge while scrubbing to keep area moist and to remove deposition buildup from chamber body | ||
| Step 9: | Return UltraSOLV® Sponge and Diamond ScrubPAD to container of DI water periodically to help keep products moist | ||
| NOTE: | ENSURE NOT TO PUT EXCESSIVE DI WATER ON CHAMBER BODY, JUST ENOUGH TO KEEP SCRUBBED AREA MOIST | ||
| Step 10: | As Diamond ScrubPAD begins to load up with deposition, pull across UltraSOLV® Sponge to unload ScrubPAD (See Fig 9, 10 & 11) |
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Fig 9: ScrubPAD loaded with deposition |
Fig 10: Pull ScrubPAD across UltraSOLV® Sponge |
Fig 11: Unloaded ScrubPAD |
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| Step 11: | Continue to rinse UltraSOLV® Sponge in container of DI water as necessary to keep UltraSOLV® Sponge slightly moist and free of deposition (See Fig 12 & 13) | ||
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Fig 12: UltraSOLV® Sponge loaded with deposition
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Fig 13: UltraSOLV® Sponge free of deposition after rinse in DI water
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| Step 12: | Using the same technique described above, use the HT179080D-1 ScrubTIP® to scrub the deposition off of all the hard to reach areas and tight corners | |||
| Step 13: | Use the HT174913PD-1 ScrubTIP® 1350 Grit Diamond to polish out any scratches in the o-ring grove and to remove deposition from other hard to reach areas (See Fig 14) | |||
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Fig 14: Area where deposition may be built-up |
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| Step 14: | Repeat steps 6 – 13, scrubbing the remaining areas of the XGEN Poly Chamber, rinsing UltraSOLV® Sponge and unloading 800 Grit Diamond ScrubPAD as necessary | |||
| Step 15: | Concentrate on the areas where there is deposition buildup, may not be necessary to scrub all areas of chamber, such as pump channel (See Fig 15) | |||
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| Step 16: | When HT4580D 800 Grit Diamond ScrubPAD appears worn, replace with second HT4580D ScrubPAD and continue chamber scrub | ||
| Step 17: | XGEN Chamber scrub portion of PM should take 30 to 45 minutes to complete | ||
| Step 18: | When scrub portion of PM is complete, replace DI water with fresh DI water and rinse-out UltraSOLV® Sponge in fresh DI water | ||
| Step 19: | Take UltraSOLV® Sponge and perform an entire XGEN Chamber wipe in preparation to perform FINAL SCRUB with HT4518D-1 180 Grit Diamond ScrubPAD | ||
IMPORTANT NOTE FINAL SCRUB PORTION OF PROCEDURE IS A VERY CRITICAL STEP AND MUST BE PERFORMED ACCORDINGLY. USING THE 180 GRIT DIAMOND SCRUBPAD GIVES THE XGEN POLY CHAMBER THE REQUIRED RA (ROUGHNESS AVERAGE) WHICH CORRELATES TO THE SPECIFIED EMISSIVITY NEEDED FOR PROPER TOOL PERFORMANCE |
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| Step 20: | Using the same technique as described above in steps 6 – 13, take the HT4518D ScrubPAD and HT179018D-1 180 Diamond Grit ScrubTIP®, and roughen all of the chamber surface areas that were scrubbed earlier with the 800 Grit Diamond ScrubPAD & ScrubTIPS® |
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| Step 21: | When roughing up XGEN Chamber is complete, take UltraSOLV® Sponge and perform an entire XGEN Chamber wipe in preparation to perform FINAL WIPE | ||
| FINAL WIPE PROCEDURE: | ||
IMPORTANT NOTE |
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| IN ORDER TO ACHIEVE AN EFFICIENT TOOL RECOVERY, THE FINAL WIPE PORTION OF THIS PROCEDURE MUST BE FOLLOWED USING THE FOAMTEC INTERNATIONAL HT5790S MiraWIPES®. THE CHARACTERISTICS OF THE MICROFIBER MiraWIPE® WILL REMOVE MORE DEPOSITION THAN ANY STANDARD FAB WIPER, HELPING TO REDUCE PARTICLE LEVELS DURING RECOVERY | ||
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 16a & 16b) |
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Fig 16a: Current fab wiper after completely wiping the XGEN Chamber |
Fig 16b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper |
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MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY |
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| Step 22: | Remove foam plug from pressure gage channel and foam plate from bottom of XGEN Chamber | |||
| Step 23: | Fold the HT5790S MiraWIPES® into quarters and apply IPA to the MiraWIPES®, then wipe entire XGEN 300 Poly Chamber – Continue wiping using 5 to 7 MiraWIPES®. The final MiraWIPE® should show no more deposition left throughout chamber | |||
| Step 24: | In addition to using the MiraWIPES® apply IPA to the HT1713-5 UltraSOLV® Foam Swab and wipe all of the hard to reach areas, o-ring grooves and pressure gage channel (See Fig 17) | |||
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Fig 17: UltraSOLV® Foam Swab reaching into pressure gage channel to clean |
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| Step 25: | Shown below is the HT1511FC MiraSWAB® (MiraSWABs® must be ordered separately) which gives the opportunity to reach into the tight corners and hard to reach areas, but is laminated with the MiraWIPE® so provides the micro fiber characteristics of the MiraWIPE® removing more deposition from these areas! | |||
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| LOOK! Particles! | |
