Home > Documents > Application Notes > Etch Multiplex Icp
Click Here for Printer Friendly Version
Before Foamtec Logo After
BEFORE   AFTER
Vacuum Chamber PM Technique
MultiPlex ICP STS-RIE Chamber Wall Clean
OBJECTIVE:
TO EFFECTIVELY PM THE ETCH STS-RIE CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE
 
Vacuum Chamber:
STS-RIE / ETCH CAVITY
Vacuum Chamber Process Residue:

PROCESS INDUCED RESIDUE
Vacuum Chamber Components:
CHAMBER WALL
 
  Old Procedure:
5 to 6 days
 
Tool Recovery: Extended recovery time, outgassing and particle issues
  New Procedure:
DI water, Foamtec Products, 1 hour, 1 technician
Tool Recovery: Reduced recovery time and no particle issues

Vacuum Chamber Products:

  • (3) HT4536D-1 360 Grit Diamond ScrubPAD
  • (1) FTPEN-1 ScrubWRIGHT™ Pen
  • (1) HT4536DW-5 360 Grit Diamond ScrubBELT®
  • (2) HT4754 UltraSOLV® Sponge
  • (1) HT5790S-25 MiraWIPES® (25 wipes)
  • (1) HT4794 UltraSOLV® Foam Wiper
  • (1) HT1502-10 MiraSWAB® 3" Rigid Tip
  • (1) HT1511-10 MiraSWAB® 4" Flexible Oval Head Tip

View "How to" instructional videos on http://www.foamtecintlwcc.com/video/

Step 1: Using proper procedures and safety guidelines properly prepare STS-RIE for chamber scrub
Step 2: Using DI water, moisten an UltraSOLV® Sponge and a Diamond ScrubPAD. Ring-out sponge to ensure foam is moist throughout the sponge. Keep the sponge slightly damp with DI water (See Fig 1)
Dampen Sponge and ScrubPAD in DI water
Fig 1: Dampen UltraSOLV® Sponge and Diamond ScrubPAD with DI water
 
 
Step 3: Using a dampened UltraSOLV® Sponge, wipe chamber plate and wall removing the surface particles and avoiding the powder fly around the chamber (See Fig 2)
Step 4: Using a dampened 360 Grit Diamond ScrubPAD, scrub chamber wall and outlet side of turbo pump. Keep the Diamond ScrubPAD slightly moist with DI water (See Fig 2 & 3)
Sponge wiping chamber
ScrubPAD scrubbing chamber and chamber wall
Fig 2: UltraSOLV® Sponge wiping chamber wall
Fig 3: 360 Diamond ScrubPAD scrubbing entire chamber and chamber wall
Step 5: As loosened deposition begins to build up on chamber wall, take UltraSOLV® Sponge and wipe the area free of deposition
Step 6: When ScrubPAD loads up with deposition, pull across UltraSOLV® Sponge to unload ScrubPAD. This ensures the function and efficiency of the sponge (See Fig 4 & 5)
Pull ScrubPAD across Sponge
Unloaded ScrubPAD
 
Fig 4: Pull ScrubPAD across UltraSOLV® Sponge
    
Fig 5: Unloaded ScrubPAD
  
Step 7: Rinse sponge as necessary by rinsing with DI water to free UltraSOLV® Sponge of excess deposition (See Fig 6 & 7)
 
Loaded UltraSOLV Sponge
UltraSOLV after rinse
  
Fig 7: Loaded-up UltraSOLV® Sponge
Fig 8: UltraSOLV® Sponge AFTER rinse
 
Step 8: Repeat steps 3 ? 7, scrubbing the remaining areas of the chamber plate & wall assembly. Rinse UltraSOLV® Sponge and unload 360 Grit Diamond ScrubPAD as necessary
 
Step 9: When deposition has been sufficiently removed throughout the entire chamber assembly, remove gloves and replace with a new set in preparation for Final Wipe Procedure
FINAL WIPE PROCEDURE:
 
IMPORTANT NOTE
THE USE OF HT5790S MiraWIPES® AND HT1511FC MiraSWABS® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM THE CHAMBER
 
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 11a & 11b)
Mirawipes are more effective
Fig 11a: Current fab wiper after completely wiping chamber
Fig 11b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper
MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY
Step 10: Use a MiraWIPE® dampened with IPA and wipe up all of the moisture and/or loosened deposition that surfaces from N2 gun blowing N2, or CDA into the sealing areas and screw holes (See Fig 9)
Use N2 Gun to blow out loose build-up
Fig 9: Use N2 gun to blow out the moisture and loosened deposition inside sealing, screw holes and corners
 
Step 11: Use a HT5790S MiraWIPE®, apply IPA and proceed to wipe entire RIE-PC chamber wall assembly
Step 12: Prior to closing chamber, use a clean MiraWIPE® dampen with IPA and perform a final complete chamber wipe-down

Completed chamber assembly

FIG 10: COMPLETED STS-RIE CHAMBER WALL ASSEMBLY SCRUB

PARTS CLEANING

Step 13: Use the FTPEN, combined with the Diamond ScrubBELT® (HT4536DW-5), scrub inside the chamber cover to remove film. Keep slightly dampened with DI water, and remove the deposition by wiping with UltraSOLV® Sponge (See Fig 11)
FTPEN scrubbing chamber cover
Fig 11: FTPEN and 360 Grit Diamond ScrubBELT® scrubbing inside chamber cover
 
Step 14: Use MiraSWABS® (HT1502 MiraSWAB® 3" Rigid Tip & HT1511 MiraSWAB® 4" Flexible Oval Head Tip) dampened with IPA to clean the parts screw holes and o-ring trench (See Fig 12)
MiraSWAB gathering particles
  
 
Fig 12: MiraSWAB® cleaning the screw holes and o-ring trench
  
 
Step 15: Use a HT5790S MiraWIPE®, apply IPA and proceed to wipe entire STS-RIE chamber cover (See Fig 13)
  MiraWIPE wiping chamber cover
 
Fig 13: Apply IPA to MiraWIPE®, and proceed to wipe chamber cover
  
 
Step 16: Use the UltraSOLV® foam wiper dampened with IPA to clean the ceramic & bead blasted parts (See Fig 14 & 15)
Cleaning parts with UltraSOLV foam wiper
Particles picked up by UltraSOLV foam wiper
Fig 14 &15: Use UltraSOLV® foam wiper dampened with IPA to clean the ceramic and bead blasted parts