| Click Here for Printer Friendly Version | ||
 |
 |
 |
| BEFORE | AFTER | |
| Vacuum Chamber PM Technique | ||
| Hitachi ETCH Parts Clean | ||
| OBJECTIVE: | ||
| TO EFFECTIVELY PM THE PARTS ASSOCIATED WITH THE HITACHI ETCH CHAMBER IN A TIMELY MANNER WHILE HELPING TO IMPROVE TOOL PERFORMANCE AND REDUCE PARTICLE DEFECTS | ||
| Vacuum Chamber: | HITACHI ETCH | |
| Vacuum Chamber Process Residue: | PROCESS INDUCED RESIDUE | |
| Vacuum Chamber Components: | VALVE VARIABLE FLAPPER & GATE VALVE CESS CHAMBER |
| Old Procedure: | Soak in ultrasonic sink for 30+minutes, wipe with IPA and place in oven to bake out | |
| PROBLEMS: Not able to remove by-product, causing particle issues and extended outgassing | ||
| New Procedure: | <20 minutes using 2000D Grit ScrubPAD, UltraSOLV® Sponge, MiraSWABS® & MiraWIPES® | |
| BENEFITS: ABLE TO REMOVE BY-PRODUCT COMPLETELY, HELPING REDUCE PARTICLE DEFECTS AND IMPROVE TOOL RECOVERY | ||
 |
||||
| Vacuum Chamber Products: | ||||
| (1) HT4520PD-10-1 2000 Grit Diamond ScrubPAD | ||||
| (1) HT4754 UltraSOLV® Sponge | ||||
| (3) HT1511FC-5 MiraSWABS® (15 MiraSWABS®) | ||||
| (3) HT5790S-5 MiraWIPES® (15 MiraWIPES®) | ||||
 |
||||
| Hitachi Etch Parts PM Procedure: | ||||||
| View “How to” instructional videos on http://foamtecintlwcc.com/video/ | ||||||
| Step 1: | Using proper procedures and safety guidelines, remove associated parts from Hitachi ETCH Chamber | |||||
| Step 2: | Properly stage a container of DI water next to the Hitachi ETCH parts and place the Foamtec International HT4520PD ScrubPAD and HT4754 UltraSOLV® Sponge into the container (See Fig 1 & 2) | |||||
 |
Fig 1: ScrubPAD and UltraSOLV® Sponge |
 |
||
Fig 2: ScrubPAD and UltraSOLV® Sponge in container of DI water |
||||
| Step 3: | Take lightly dampened UltraSOLV® Sponge and wipe Hitachi ETCH parts (See Fig 3) | |||
 |
 |
|||
Fig 3: UltraSOLV® Sponge wiping flapper valve |
||||
 |
||||
| Step 4: | Take lightly dampened 2000 Grit Diamond ScrubPAD scrub off deposition from Hitachi ETCH parts |
| Step 5: | As 2000 Grit Diamond ScrubPAD begins to load up with deposition, pull ScrubPAD across dampened UltraSOLV® Sponge to properly unload Diamond ScrubPAD (See Fig 4, 5 & 6) |
 |
 |
 |
||||||||||
Fig 4: ScrubPAD loaded with deposition |
Fig 5: Pull ScrubPAD across UltraSOLV® Sponge |
Fig 6: Unloaded ScrubPAD
|
| Step 6: | Unload UltraSOLV® as much as possible by placing it in container of DI water and RINSE-OUT thoroughly (See Fig 7 & 8) | ||
 |
 |
|||
Fig 7: Loaded-up UltraSOLV® Sponge |
Fig 8: UltraSOLV® Sponge AFTER rinse |
|||
| Step 7: | Using the dampened UltraSOLV® Sponge, wipe off deposition from Hitachi ETCH parts (See Fig 9 &10) | ||
| NOTE: | THIS IS AN IMPORTANT STEP TO HELP REDUCE THE AMOUNT OF WIPERS NEEDED TO COMPLETE PM | ||
 |
 |
|||
Fig 9 : UltraSOLV® Sponge wiping Hitachi ETCH part |
Fig 10 : Hitachi ETCH part free of deposition |
|||
| FINAL WIPE PROCEDURE: | ||
IMPORTANT NOTE |
||
| THE USE OF HT5790S MiraWIPES® AND HT1511FC MiraSWABS® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM HITACHI ETCH PARTS | ||
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 11a & 11b) |
||
 |
||
Fig 11a: Current fab wiper after completely wiping Hitachi parts |
Fig 11b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper |
|
 |
|
|
MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY |
||
| Step 8: | After scrubbing Hitachi ETCH parts, fold the HT5790S MiraWIPE® into quarters and dampen with IPA |
| Step 9: | With the dampened MiraWIPE® wipe down all areas of the Hitachi ETCH parts, ensuring to refold the MiraWIPE® as necessary to expose a clean side of the MiraWIPE® as you are wiping the parts |
| NOTE: | REPLACE WITH A NEW DAMPENED MiraWIPE® AS NECESSARY |
| Step 10: | Dampen the HT1511FC MiraSWAB® with IPA and wipe out the hard to reach areas, such as o-ring grooves and screw holes (See Fig 12 & 13) |
| MiraSWABS® are the KEY STEP for DEFECT REDUCTION | ||
 |
 |
|||
Fig 12: HT1511FC MiraSWAB® effectively wiping screw holes on flapper valve |
Fig 13: HT1511FC MiraSWAB® effectively wiping o-ring groove on gate valve |
|||
| Step 11: | Repeat above Hitachi ETCH chamber parts PM procedure and FINAL WIPE PROCEDURE for all associated Hitachi ETCH parts and MiraWIPE® FINAL WIPE PROCEDURE on all remaining areas of the process chamber and associated parts |
| Step 12: | Using proper procedures and safety guidelines reinstall Hitachi ETCH parts back into Hitachi ETCH chamber |
