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| BEFORE | AFTER | |
| Vacuum Chamber PM Technique | ||
| Hitachi Metal Etcher | ||
| OBJECTIVE: | ||
| TO EFFECTIVELY PM THE HITACHI METAL ETCHER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE | ||
| Vacuum Chamber: | HITACHI METAL ETCHER | |
| Vacuum Chamber Process Residue: | PROCESS INDUCED RESIDUE | |
| Vacuum Chamber Components: | CHAMBER, CHAMBER WALLS, VIEWPORT, PUMP PORT |
| Old Procedure: | Silicon carbide 600 grit & standard fab wipers
(From the build up found on the tool, it was evident that this method was not effective to get the surface back to bare metal) |
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| New Procedure: | Diamond ScrubPAD, UltraSOLV® Sponge, DI water, and IPA for final wipe with MiraWIPES® | |
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| Vacuum Chamber Products: | ||||
| (1) HT4754 UltraSOLV® Sponge | ||||
| (1) FT901 ErgoSCRUB® Handle (with hook and loop) | ||||
| (2) HT4528DC3-1 280 Grit Diamond ScrubDISK® | ||||
| (2) HT4528D-10 280 Grit Diamond ScrubPAD | ||||
| (5) HT175036D-5 360 Grit Diamond ScrubTIP® | ||||
| (5) HT4790-5 UltraSOLV® Wipers | ||||
| (1) HT4580D-10 800 Grit Diamond ScrubPAD | ||||
| (5) HT1702-5 UltraSOLV® Swab | ||||
| (4) HT5790S-5 MiraWIPE® 9x9 wide sealed edge | ||||
| Hitachi Metal Etch PM Procedure: | ||||||
| View “How to” instructional videos on http://foamtecintlwcc.com/video/ | ||||||
| NOTE: | INITIAL CLEAN MAY REQUIRE THE USE OF ADDITIONAL PRODUCTS TO EFFECTIVELY CLEAN CHAMBER BACK TO BARE METAL, IT IS RECOMMENDED TO PERFORM A ROUND OF 2-3 PM'S ON SAME TOOL TO ESTABLISH SUFFICIENT DATA FOR EVALUATION | |||||
| Step 1: | Using proper procedures and safety guidelines, shutdown and prepare Hitachi Metal Etch Chamber for wet clean | |||||
| Step 2: | Effectively place 4 or 5 MiraWIPES® over vacuum pump to protect from DI water | |||||
| Step 3: | Properly stage a container of DI water next to the chamber and place a HT4528D 280 Grit Diamond ScrubPAD and a HT4754 UltraSOLV® Sponge into the container (See Fig 1) | |||||
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Fig 2: Place Diamond ScrubPAD and UltraSOLV® Sponge in container of DI water |
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| Step 4: | While wearing breathing apparatus, take the HT4754 UltraSOLV® Sponge and wipe the inside of the chamber to remove excess process residue | |||
| Step 5: | Take the dampened 280 Grit Diamond ScrubPAD and scrub a 6” x 6” area within the chamber wall. Scrub this area until deposition is effectively removed lightly dampened 140 Grit Diamond ScrubPAD and scrub a small area of the process chamber (See Fig 3) | |||
| Step 6: | Wipe-down the affected chamber area using the DI water dampened UltraSOLV® sponge | |||
| Step 7: | As necessary, unload the ScrubPADS of deposition by wiping the ScrubPADS with HT4754 UltraSOLV® Sponge in one direction (See Fig 2, 3 & 4) |
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Fig 4: ScrubPAD loaded with deposition |
Fig 5: Pull ScrubPAD across UltraSOLV® Sponge |
Fig 6: Unloaded ScrubPAD
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| NOTE: | REMEMBER TO UNLOAD UltraSOLV® SPONGE WHEN IT BECOMES LOADED WITH DEPOSITION BY RINSING SPONGE IN CONTAINER OF DI WATER (See Fig 5 & 6) | ||
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Fig 7: Loaded-up UltraSOLV® Sponge |
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Fig 8: UltraSOLV® Sponge AFTER rinse |
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| Step 8: | Repeat steps 5 – 7 to remove remaining process residue from affected area in the chamber, tunnel, and vacuum chamber walls using the same method as described above | ||
| Step 9: | In order to remove deposition from the remaining hard to reach areas (such as the o-ring grooves and corners), use the HT175036D 360 Grit Diamond ScrubTIP® to effectively reach these areas (See Fig 7 & 8) | ||
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Fig 7 & 8: Using Diamond ScrubTIP® to clean hard to reach areas and o-ring grooves |
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| NOTE: | Unload the ScrubTIP® as necessary, using the same method as described above in step 7 to unload the ScrubPADS | ||
| Step 10: | For the flatter surfaces, of the chamber, tunnel or vacuum chamber, apply the HT4528DC3 280 Grit Diamond ScrubDISK® to the FT901 ErgoSCRUB® Handle. Dampen the ScrubDISK® with DI water and scrub affected area. Unload excess deposition from the ScrubDISK®, using the same method as the ScrubPADS described in step 7 above | ||
| Step 11: | Use the HT4580D 800 Grit Diamond ScrubPAD to effectively polish all of the previously scrubbed surfaces within the chamber. Unload the ScrubPAD as described in step 7 as necessary | ||
| Step 12: | Using IPA with the HT4790 UltraSOLV® Wipers and HT1702 UltraSOLV® Swab, perform a THOROUGH AND EFFECTIVE WIPE-DOWN of the main chamber, vacuum chamber and tunnel, so that all remaining flakes are removed | ||
| FINAL WIPE PROCEDURE: | ||
IMPORTANT NOTE |
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| THE USE OF HT5790S MIRAWIPES® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM THE HITACHI METAL ETCHER | ||
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 12a & 12b) |
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Fig 12a: Current fab wiper after completely wiping Hitachi Metal Etcher |
Fig 12b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper |
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MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY |
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| Step 13: | Using the HT5790S MiraWIPES®, moistened with IPA, wipe the entire Hitachi Chamber |
| Step 14: | Ensure to wipe down the main chamber, vacuum chamber, and tunnel area with the MiraWIPES®. Be sure to include all pump ports, view ports, vacuum seal surfaces, o-rings and any parts to be placed back into the Hitachi Chamber |
| Step 15: | Perform Hitachi Metal Etch tool recovery as outlined by manufacturer |
