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Vacuum Chamber PM Technique
Hitachi STR M712 Non-Metal ETCH
OBJECTIVE:
TO EFFECTIVELY PM THE AMAT ETCH IN A TIMELY MANNER, WHILE HELPING TO MINIMIZE PARTICLE ISSUES, IMPROVE TOOL PERFORMANCE AND REDUCE HAZARDOUS WASTE
 
Vacuum Chamber: HITACHI STR M712 ETCH
Vacuum Chamber Process Residue: BY PRODUCT OF STR ETCH
Vacuum Chamber Components: CHAMBER, CHAMBER WALLS, TUNNEL, TURBO TOP PLATE, AND TUNNEL DOOR
Old Procedure: Silicon carbide 600 grit, 1200 grit & wipers
Using the old procedure, the PM is taking 4 to 6 hours to complete with an abundance of 200+ Alpha wipes and 10 to 12 SiC pads
Solvent: DI water, IPA (only)
Safety: Breathing apparatus to prevent breathing in dangerous fumes upon initial entry of chamber and proper exhaust stationed
New Procedure: Diamond ScrubPAD, DI water, MiraWIPES®, IPA and UltraSOLV® Sponge
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Vacuum Chamber Products:
(1) HT4754 UltraSOLV® Sponge
(1) FT901 ErgoSCRUB® soft handle (with hook and loop)
(1) HT4580DC3-1 800 Grit Diamond ScrubDISK®
(1) HT4580D-10-1 800 Grit Diamond ScrubPAD
(1) HT5790S-25 MiraWIPE® 9X9 wide-sealed edge
DI water & IPA
HITACHI NON-METAL ETCHER PM PROCEDURE:
View “How to” instructional videos on http://foamtecintlwcc.com/video/
Step 1: Using all safety procedures and guidelines, remove the parts that are required to be removed from within the tool to prepare for PM
Step 2: Dampen the HT4754 UltraSOLV® Sponge with DI water and effectively wipe the inside of the chamber to remove excess deposition
Step 3: Appropriately place the HT4580DC3-1 800 Grit Diamond ScrubDISK® onto the FT901 ErgoSCRUB® soft handle w/hook & loop
Step 4: Using a DI water lightly dampened HT4580DC3-1 ScrubDISK®, proceed to scrub approximately 12”x12” area within the chamber walls
Step 5: Wipe-down the effected chamber area using the DI water dampened HT4754 UltraSOLV® sponge
Step 6: As necessary, unload the ScrubDISK® of deposition by wiping the ScrubDISK® with HT4754 UltraSOLV® Sponge in one direction (See Fig 1, 2 & 3)
Loaded ScrubDISK
Pull ScrubDISK across Sponge
Unloaded ScrubDISK
Fig 1: ScrubDISK® loaded with deposition
Fig 2: Pull and twist ScrubDISK® across UltraSOLV® Sponge
Fig 3: Unloaded ScrubDISK®
Step 7: Unload the HT4754 UltraSOLV® Sponge by moistening with DI water and ringing out into a properly labeled HazMat container (See Fig 4 & 5)
Loaded UltraSOLV Sponge
Fig 4: Loaded-up UltraSOLV® Sponge
UltraSOLV after rinse
Fig 5: UltraSOLV® Sponge AFTER rinse
Step 8: Using the HT4580DC3-1 800 Grit Diamond ScrubDISK® and the HT4754 UltraSOLV® sponge, continue to remove deposition from affected areas throughout the chamber. Use same method described in steps 4 – 7
Step 9: Using the HT4580D-10-1 800 Grit Diamond ScrubPAD continue to remove deposition from the remaining areas throughout the chamber using the same method described in steps 4 – 7. May be necessary to fold ScrubPAD to reach tight corners
Step 10: Continue scrubbing method into the remaining areas; including tunnel, tunnel door and top turbo plate; re-fully clean chamber wall area near electrode with ScrubPAD (See Fig 9)
FINAL WIPE PROCEDURE:
IMPORTANT NOTE
THE USE OF HT5790S MiraWIPES® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS
 
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 6a & 6b)
MiraWIPES are more effective
Fig 6a: Current fab wiper after completely wiping Hitachi Non-Metal Etch
Fig 6b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper
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MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY
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Step 11: Using IPA, dampen the HT5790S MiraWIPES® and perform a thorough and effective final wipe-down of the entire chamber area; including tunnel, tunnel door and top turbo plate
NOTE: This important step must be effectively followed in order to achieve the maximum efficiency of tool recovery and performance. Continue to wipe all of the effected PM areas within the Hitachi Non-Metal Etcher repeatedly until all MiraWIPES® have been effectively used
Step 12: For added efficiency wipe down all spare parts to be placed back into the Hitachi Non-Metal Etcher using additional IPA dampened HT5790S MiraWIPES®