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| Vacuum Chamber PM Technique | |||
| Implant Parts Clean | |||
| OBJECTIVE: | |||
TO PM THE IMPLANT PARTS IN AN EFFECTIVE AND TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE |
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| Vacuum Chamber: | IMPLANT PARTS |
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| Vacuum Chamber Process Residue: | BF3, P, Sb, In, AsH3 BEAM DEPOSITION |
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| Vacuum Chamber Components: | ALL PARTS ASSOCIATED WITH APPLIED, AXCELIS AND, VARIAN: MEDIUM CURRENT, HIGH CURRENT AND HIGH ENERGY ION IMPLANTERS THAT ARE REMOVED AND CLEANED DURING PREVENTATIVE MAINTENANCE | |
| Old Procedure: | Scotch-Brite™ w/H2O2, 40 grit sand paper, wire mesh, bead blast, air sanders |
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| Solvent: | DI water, IPA (only) | |
| DANGER: Use of H2O2 causes a variety of environmental, health, and safety concerns. Can cause prolonged pump down times and high voltage arcing. Breathing apparatus and full acid PPE is recommended while scrubbing with H2O2. Scrubbing Phosphorus while using H2O2 increases the risk of fires and/or the release of hazardous chemical fumes, potentially resulting in personal injury and property damage |
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Standard Products Needed for Cleaning Various Implanter Parts: source liners, source bushings, source can, electrode plates, baffles, ceramic insulators, graphite pieces, etc. |
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| Vacuum Chamber Products: | |
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| Implant Parts Clean PM Procedure: | |
| View “How to” instructional videos on http://foamtecintlwcc.com/video/ | |
| Step 1: | Place part inside a certified parts clean hood |
| Step 2: | Vacuum the inside of the selected part using an approved arsenic vacuum system removing any loose flakes |
| Step 3: | Wipe-down selected part using a DI water dampened UltraSOLV® HT4754 Sponge |
| Step 4: | Using a DI water dampened HT45XXDC-1 ScrubDISK®, attached to the FT901 ErgoSCRUB®, or a DI water dampened HT45XXD-10 ScrubPAD, scrub an 8”x 8” area within the selected part |
| Step 5: | Wipe-down the affected area using the DI water dampened UltraSOLV® HT4754 Sponge removing the loose deposition |
| Step 6: | Unload the ScrubDISK® of deposition by wiping the UltraSOLV® HT4754 Sponge with the ScrubDISK® in one direction (See Fig 1, 2 & 3) |
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Fig 1: ScrubPAD loaded with deposition |
Fig 2: Pull ScrubPAD across UltraSOLV® Sponge |
Fig 3: Unloaded ScrubPAD |
| Step 7: | Unload the UltraSOLV® HT4754 Sponge by moistening with DI water and ringing out into a HazMat container (See Fig 4 & 5) | ||
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Fig 4: Loaded-up UltraSOLV® Sponge |
Fig 5: UltraSOLV® Sponge AFTER rinse |
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| Step 8: | Repeat steps 4 – 7 until as much deposition is removed as possible |
| Step 9: | Using the HT1790XXD-1 Diamond ScrubTIP® continue to scrub the hard to reach areas (i.e. view ports, pump ports, deep angles . . .etc.) within the selected part |
| Step 10: | Wipe the affected hard to reach areas using a DI water dampened HT1700-5 UltraSOLV® Swab removing the loose deposition |
| Step 11: | Repeat steps 9 & 10 until all deposition is removed |
| FINAL WIPE PROCEDURE: | ||
IMPORTANT NOTE |
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| THE USE OF HT5790S MiraWIPES® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS | ||
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 6a & 6b) |
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Fig 6a: Current fab wiper after completely wiping the chamber |
Fig 6b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper |
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MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY |
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| Step 12: | Repeatedly wipe the inside of the selected part using an IPA dampened HT5790S MiraWIPE®. Ensure to wipe entire part effectively until all areas are removed of deposition |
| Step 13: | Recommend placing selected part in oven to bake out until ready to be replaced back into system |
Scotch-Brite™ is a trademark of 3M Corporation
