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Vacuum Chamber: |
AMAT QUANTUM–X™ HIGH CURRENT |
| Vacuum Chamber Process Residue: |
PROCESS INDUCED RESIDUE |
| Vacuum Chamber Components: |
PROCESS CHAMBER |
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Old Procedure: |
8 hours, H2O2, Scotch-Brite™, DI water 300+ wipes and IPA |
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(WARNING: Use of Oxidizers such as Hydrogen Peroxide (H2O2) in Parts Cleaning will Increase the Risk of fires and/or the Release of Hazardous Chemical Fumes, Potentially resulting in Personal Injury and Property Damage!) |
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New Procedure: |
2.5 HOURS, Foamtec PM Kit with DI water |
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| Implant AMAT Quantum–X™ Process Chamber PM Procedure: |
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| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ |
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| Step 1: |
Using proper procedures and safety guidelines properly prepare AMAT Quantum–X™ process chamber for wet clean |
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| NOTE: |
Recommend placing a protective cover, or bag, over the ESC to help minimize particles on the ESC during the scrub portion of the PM (See Fig 1) |
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Fig 1: Protective cover over ESC for protection
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| Step 2: |
Stage a small container of DI water inside a large plastic bag next to process chamber |
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| Step 3: |
Attach HT4528DC3-1, 280 Grit Diamond ScrubDISK® onto FT901 Soft ErgoSCRUB® handle |
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| Step 4: |
Place HT4754 UltraSOLV® Sponge, ErgoSCRUB® w/ScrubDISK® and ScrubPAD in container of DI water to moisten products (See Fig 2) |
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Fig 2: Foamtec International products in small container of DI water |
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| Step 5: |
Take dampened UltraSOLV® Sponge and wipe out the process chamber, removing any loose deposition or flakes. Continue to re-moisten the UltraSOLV® Sponge in container of DI water as necessary |
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| Step 6: |
Take dampened 280 Grit Diamond ScrubDISK® attached to ErgoSCRUB® and proceed to scrub areas throughout the Quantum–X™ Process Chamber (See Fig 3) |
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Fig 3: ScrubDISK® attached to ErgoSCRUB®, scrubbing process chamber |
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| Step 7: |
As loose deposition begins to build up within the process chamber, take UltraSOLV® Sponge and wipe the area free of deposition (See Fig 4) |
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Fig 4: UltraSOLV® Sponge wiping area free of deposition |
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| Step 8: |
Continue to rinse out sponge in container of DI water, as necessary, to free UltraSOLV® Sponge of excess deposition (See Fig 5 & 6) |
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Fig 5: Loaded-up UltraSOLV® Sponge |
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Fig 6: UltraSOLV® Sponge AFTER rinse |
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| Step 9: |
As ScrubDISK® loads up with deposition, pull and twist ScrubDISK® across UltraSOLV® Sponge to unload ScrubDISK® (See Fig 7, 8 & 9) and then rinse UltraSOLV Sponge as in step 8 |
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Fig 7: ScrubDISK® loaded with deposition |
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Fig 8: Pull and Twist ScrubDISK® across UltraSOLV® Sponge |
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Fig 9: Unloaded ScrubDISK®
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| Step 10: |
Repeat steps 6 – 9, scrubbing the remaining areas of the Quantum–X™ process chamber as much as possible. Rinse out the UltraSOLV® Sponge and unload 280 Grit Diamond ScrubDISK® onto the UltraSOLV® Sponge as necessary |
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| Step 11: |
Moisten 360 Grit Diamond ScrubPAD in container of DI water and re-scrub all areas of the Quantum–X™ process chamber using the same technique described above, concentrating on the areas of heavier deposition buildup and hard to reach areas throughout the process chamber |
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| Step 12: |
When the process chamber has been entirely cleaned, remove protective cover on ESC and the back of the ESC using the 360 Grit Diamond ScrubPAD and the same technique described above (See Fig 10 & 11) |
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Fig 10: 360 Grit Diamond ScrubPAD cleaning back of ESC |
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Fig 11: Unloading 360 Grit Diamond ScrubPAD as necessary
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| Step 13: |
When deposition has been sufficiently removed throughout entire Quantum–X™ process chamber, rinse out UltraSOLV® Sponge with fresh DI water and re-wipe the entire Quantum–X™ Process Chamber in preparation for FINAL WIPE PROCEDURE (See Fig 12 & 13) |
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Fig 12 & 13: Quantum–X™ Process Chamber after scrub portion of PM |
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| FINAL WIPE PROCEDURE: |
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IMPORTANT NOTE |
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| AS THE QUANTUM–X™ PROCESS CHAMBER IS A VERY PARTICLE SENSITIVE AREA, IT IS CRITICAL TO FOLLOW THE FOAMTEC INTERNATIONAL FINAL WIPE PROCEDURE IN ITS ENTIRETY TO MAXIMIZE TOOL RECOVERY BENEFITS |
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| Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 14a & 14b) |
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Fig 14a: Current fab wiper after completely wiping the chamber |
Fig 14b: Particles picked up using HT5790S MiraWIPES ® after completely wiping with current fab wiper |
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| Step 14: |
Dampen the HT5790S MiraWIPES® with IPA and perform a THOROUGH AND EFFECTIVE FINAL WIPE-DOWN of the entire Quantum–X Process Chamber, including o-ring grooves and all vacuum sealing surfaces |
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| Step 15: |
Wipe down all shields and spare parts using additional IPA dampened HT5790S MiraWIPES® before replacing into chamber |
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QUANTUM–X™ PROCESS CHAMBER BEFORE |
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QUANTUM–X™ PROCESS CHAMBER AFTER |
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TOTAL AMOUNT OF HAZARDOUS WASTE ACCUMULATED
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Scotch-Brite™ is a trademark of 3M Corporation
