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| BEFORE |
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AFTER |
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| Vacuum Chamber PM Technique |
| Implant Varian VIISta 80 Beamline Clean |
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| OBJECTIVE: |
| TO PM THE VARIAN VIISta 80 BEAMLINE IN AN EFFECTIVE AND TIMELY MANNER WHILE IMPROVING PARTICLE PERFORMANCE, TOOL RECOVERY AND MAXIMIZING TOOL UPTIME |
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Vacuum Chamber: |
VARIAN VIISTA 80 HIGH CURRENT |
| Vacuum Chamber Process Residue: |
PROCESS INDUCED RESIDUE |
| Vacuum Chamber Components: |
BEAMLINE CHAMBER |
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Old Procedure: |
2 hours, H2O2, Scotch-Brite™, DI water 100+ wipes and IPA |
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Recovery time: 4 to 6 hours |
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New Procedure: |
1 HOUR, Foamtec PM Kit with DI water |
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Recovery time: 1 to 2 hours |
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| DANGER: |
USE OF HYDROGEN PEROXIDE (H2O2) CAUSES A VARIETY OF ENVIRONMENTAL, HEALTH, AND SAFETY CONCERNS. CAN CAUSE PROLONGED PUMP DOWN TIMES AND HIGH VOLTAGE ARCING. BREATHING APPARATUS AND FULL ACID PPE IS RECOMMENDED WHILE SCRUBBING WITH H2O2. SCRUBBING PHOSPHORUS WHILE USING H2O2 INCREASES THE RISK OF FIRES AND/OR THE RELEASE OF HAZARDOUS CHEMICAL FUMES, POTENTIALLY RESULTING IN PERSONAL INJURY AND PROPERTY DAMAGE. |
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| Varian VIISta 80 Beamline Clean PM Procedure: |
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| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ |
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| Step 1: |
Using proper procedures and safety guidelines, properly prepare Varian VIISta 80 Beamline chamber for wet clean |
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| Step 2: |
Stage a small container of DI water inside a large plastic bag next to VIISta 80 Beamline |
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| Step 3: |
Attach HT4536DC3-1 360 Grit Diamond ScrubDISK® onto FT901 Soft ErgoScrub® |
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| Step 4: |
Place HT4754 UltraSOLV® Sponge, ErgoSCRUB® w/ScrubDISK® and ScrubPAD in container of DI water to moisten products (See Fig 1) |
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Fig 1: Foamtec International products in small container of DI water |
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| Step 5: |
Take dampened UltraSOLV® Sponge and wipe out Beamline, removing any loose deposition or flakes. Continue to re-moisten the UltraSOLV® Sponge in container of DI water as necessary |
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| Step 6: |
Take dampened 360 Grit Diamond ScrubDISK® attached to ErgoSCRUB® and scrub areas throughout the VIISta 80 Beamline |
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| Step 7: |
As loose deposition begins to build up within the Beamline, take UltraSOLV® Sponge and wipe the area free of deposition (See Fig 2) |
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Fig 2: UltraSOLV® Sponge used to wipe out loosened deposition
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| Step 8: |
Continue to rinse out sponge in container of DI water as necessary to free UltraSOLV® Sponge of excess deposition as necessary (See Fig 3 & 4) |
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Fig 3: Loaded-up UltraSOLV® Sponge |
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Fig 4: UltraSOLV® Sponge AFTER rinse |
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| Step 9: |
As ScrubDISK® loads up with deposition, pull & twist ScrubDISK® across UltraSOLV® Sponge to unload ScrubDISK® (See Fig 5, 6 & 7) |
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Fig 5: ScrubDISK® loaded with deposition |
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Fig 6: Pull and Twist ScrubDISK® across UltraSOLV® Sponge |
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Fig 7: Unloaded ScrubDISK®
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| Step 10: |
Repeat steps 6 – 9, scrubbing the remaining areas of the VIISta 80 Beamline as much as possible. Ensure to rinse out UltraSOLV® Sponge and unload 360 Grit Diamond ScrubDISK® as necessary |
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| Step 11: |
Moisten 280 Grit Diamond ScrubPAD in container of DI water and re-scrub all areas of the VIISta 80 Beamline using the same technique described above, concentrating on the areas of heavier deposition buildup and hard to reach areas throughout the Beamline (See Fig 8) |
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Fig 8: 280 Grit Diamond ScrubPAD scrubbing Beamline |
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| Step 12: |
When deposition has been sufficiently removed throughout the entire VIISta 80 Beamline, rinse out UltraSOLV® Sponge with fresh DI water and re-wipe the entire VIISta 80 Beamline in preparation for FINAL WIPE PROCEDURE (See Fig 9) |
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Fig 9: VIISta 80 Beamline after scrub portion of PM |
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| FINAL WIPE PROCEDURE: |
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IMPORTANT NOTE |
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| THE USE OF HT5790S MiraWIPES® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM VARIAN VIISta 80 BEAMLINE |
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Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 10a & 10b) |
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Fig 10a: Current fab wiper after completely wiping the chamber |
Fig 10b: Particles picked up using HT5790S MiraWIPES ® after completely wiping with current fab wiper |
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| Step 13: |
Dampen the HT5790S MiraWIPES® with IPA and perform a THOROUGH AND EFFECTIVE FINAL WIPE-DOWN of the entire VIISta 80 Beamline – including o-ring grooves and all vacuum sealing surfaces |
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| Step 14: |
Ensure to wipe down all shields and spare parts and place back into the Beamline using additional dampened HT5790S MiraWIPES® |
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Recommend removing all subassemblies to prevent any loose deposition from accumulating in o-ring grooves or leach-check ports |
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VIISta 80 BEAMLINE CHAMBER BEFORE |
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VIISta 80 BEAMLINE CHAMBER AFTER
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TOTAL AMOUNT OF HAZARDOUS WASTE ACCUMULATED
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Scotch-Brite™ is a trademark of 3M Corporation
