LAM 2300 EXELAN FLEX OXIDE ETCH CHAMBER PM TECHNIQUE

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CHAMBER LINER		CHAMBER

Vacuum Chamber PM Technique
LAM 2300 Exelan Flex Oxide Etch Chamber

OBJECTIVE:
TO EFFECTIVELY PM THE LAM 2300 EXELAN FLEX OXIDE ETCH CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE

	Vacuum Chamber:	LAM 2300 EXELAN FLEX OXIDE ETCH
	Vacuum Chamber Process Residue:	PROCESS INDUCED RESIDUE
	Vacuum Chamber Components:	CHAMBER, CHAMBER LINERS AND ASSOCIATED PARTS


	Old Procedure:	2+ hours using silicon carbide scrubbing pads with ethanol (or equivalent final wipe solvent) 100+ wipes
		Tool recovery: 6 to 8 hours conditioning wafers

	New Procedure:	1 hour using 800D ScrubPAD, DI water & ethanol (or equivalent final wipe solvent)
		Tool recovery: <4 Hours conditioning wafers


LAM 2300 Exelan Flex Oxide Etch PM Procedure:

View “How to” instructional videos on http://www.foamtecintlwcc.com/video/

Step 1:	Using proper procedures and safety guidelines, shutdown and prepare LAM 2300 Exelan Flex Chamber for wet clean

Step 2:	Properly stage a container of DI water next to the chamber and place a Foamtec International HT4580D ScrubPAD and HT4754 UltraSOLV^® Sponge into the container (See Fig 1)

Fig 1: ScrubPAD and UltraSOLV^® Sponge in container of DI water

NOTE:

MAY SUBSTITUTE A SMALL AMOUNT OF DI WATER TO MOISTEN UltraSOLV^® SPONGE AND ScrubPAD AS NECESSARY (See Fig 2 & 3)


	Fig 2: UltraSOLV^® Sponge, ScrubPAD and small amount of DI water		Fig 3: Dampening UltraSOLV^® Sponge with DI water

Step 3:	Use the lightly dampened UltraSOLV^® Sponge and wipe Oxide ETCH Chamber liners (See Fig 4)


		Fig 4: Dampened UltraSOLV^® Sponge wiping chamber liners


Step 4:	Use a lightly dampened 800 Grit Diamond ScrubPAD and scrub off deposition from Oxide ETCH Chamber liner. It is important to keep area a little moist with DI water (See Fig 5 & 6)



		Fig 5 & 6: Lightly dampened 800 Grit Diamond ScrubPAD scrubbing chamber liner; keep slightly moist with DI water

Step 5:	Before oxide deposition has a chance to dry back onto the chamber liner, use lightly dampened UltraSOLV^® Sponge and wipe deposition from chamber liner (See Fig 7 & 8)


	Fig 7: Lightly dampened UltraSOLV^® Sponge preparing to wipe chamber liner		Fig 8: Clean chamber liner after UltraSOLV^® Sponge

Step 6:	As Diamond ScrubPAD appears to load up with deposition, pull ScrubPAD across damp UltraSOLV Sponge. This will help keep ScrubPAD effectively removing oxide deposition from chamber liner (See Fig 9, 10 & 11)

Fig 9: ScrubPAD loaded with deposition

Fig 10: Pull ScrubPAD across UltraSOLV^® Sponge

Fig 11: Unloaded ScrubPAD


Step 7:	Continue to rinse UltraSOLV^® Sponge in container of DI water as necessary to keep UltraSOLV^® Sponge slightly moist and free of deposition (See Fig 12 & 13)


	Fig 12: UltraSOLV^® Sponge loaded with deposition		Fig 13: UltraSOLV^® Sponge free of deposition after rinse in DI water

Step 8:	Continue to repeat this SCRUB – WIPE – RINSE procedure outlined in steps 4 through 7 for the remainder of the LAM 2300 Oxide ETCH parts (See Fig 14, 15 & 16)


	Fig 14, 15 & 16: Continuing SCRUB – WIPE – RINSE procedure on remaining Oxide ETCH Chamber parts

Step 9:	Using same technique described above, take 800 Grit Diamond ScrubPAD and gently remove dark build-up on heater coils (See Fig 17)


		Fig 17: 800 Grit Diamond ScrubPAD removing build-up on heater coils

FINAL WIPE PROCEDURE:

IMPORTANT NOTE

IN ORDER TO HELP WITH AN EFFECTIVE TOOL RECOVERY, FOAMTEC INTERNATIONAL WIPE DOWN PROCEDURE MUST BE FOLLOWED WITH ALL HT5790S MiraWIPES^® AND HT1511FC MiraSWABS^®. THE MICRO-FIBER CHARACTERISTICS OF THESE PRODUCTS HELP REMOVE MORE DEPOSITION FROM THE PARTS THAN ANY OTHER STANDARD FAB WIPER

Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 18a & 18b)


Fig 18a: Current fab wiper after completely wiping the LAM 2300		Fig 18b: Particles picked up using HT5790S MiraWIPES^® after completely wiping with current fab wiper


	MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY


Step 10:	After scrubbing heater coils use the HT1511FC MiraSWAB^® dampened with alcohol and clear out all openings on heater plate (See Fig 19 & 20)


	Fig 19: HT1511FC MiraSWAB^® clearing out openings on heater plate		Fig 20: Additional deposition MiraSWAB^® was able to remove from openings

Step 11:	While using the HT1511FC MiraSWABS^® to clear out all the openings within the heater coils, also use the HT5790S MiraWIPES^® dampened with alcohol and proceed to wipe the entire heater plate, concentrating on the tight corners throughout the heater plate (See Fig 21 & 22)


		Fig 21: Wiping heater plate with HT5790S MiraWIPE^® and alcohol


	Fig 22: Clean heater plate coils after gentle scrub and wipe

Step 12:	Following the same procedure with the HT1511FC MiraSWABS^® and HT5790S MiraWIPES^® with alcohol, perform an entire wipe of the remaining Oxide ETCH parts prior to placing back into the Oxide ETCH Chamber (See Fig 23)


		Fig 23: HT5790S MiraWIPE^® performing final wipe on all chamber parts


NOTE:	THE FOLLOWING SHOWS HOW MUCH MORE DEPOSITION THE MiraWIPE^® WAS ABLE TO REMOVE FROM A SMALL SECTION OF THE SILICONE RING AFTER A COMPLETE WIPED DOWN WITH THE STANDARD FAB WIPER (See Fig 24 & 25)


		Fig 24 & 25: THE IMPORTANCE OF USING THE HT5790S MiraWIPES^®




CHAMBER CLEAN:

Step 13:	Take the additional 800 Grit Diamond ScrubPAD and using the same technique described above proceed to perform a chamber scrub on the LAM 2300 Exelan Flex Oxide Chamber

NOTE:	Ensure to concentrate on the heavy deposition areas that are not covered by the chamber liners, such as the sides of the e-chuck (See Fig 26)



	Fig 26: 800 Grit Diamond ScrubPAD gently scrubbing edge of e-chuck


Step 14:	When entire chamber scrub is complete, use the same technique described above and use remaining HT1511FC MiraSWABS^® and HT5790S MiraWIPES^® with alcohol and perform a complete chamber wipe down (See Fig 27 & 28)


	Fig 27: Applying alcohol to HT5790S MiraWIPE^®	Fig 28: Performing final wipe of LAM Oxide Chamber

TOOL RECOVERY:

Step 15:	Follow proper tool recovery guidelines as outlined by LAM Research Corporation