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| BEFORE |
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AFTER |
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| Vacuum Chamber PM Technique |
| LAM 2300 Exelan Flex Oxide Etch Hot Plate |
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| OBJECTIVE: |
| TO EFFECTIVELY PM THE LAM OXIDE ETCH HOT PLATE IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND REDUCING PARTICLE PROBLEMS ASSOCIATED WITH TRYING TO CLEAN WITH SCOTCH-BRITE™ |
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Vacuum Chamber: |
LAM 2300 EXELAN FLEX OXIDE ETCH |
| Vacuum Chamber Process Residue: |
ACCUMULATED RESIDUE FROM BACKSIDE OF ELECTRODE |
| Vacuum Chamber Components: |
HOT PLATE |
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Old Procedure: |
1+ hours using Scotch-Brite™, IPA and fab wipers |
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Recovery time: Varies with particle issues |
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Interval: PM Hot Plate on every LAM OXIDE ETCH PM every two weeks |
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New Procedure: |
1 hour using Diamond ScrubPAD, ScrubWRIGHT™ Pen, MiraWIPE® and MiraSWABS® |
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Recovery time: Improved recovery time with particle reduction |
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Vacuum Chamber Products: |
| LAM 2300 OXIDE ETCH HOT PLATE PM KIT |
| PM Kit P/N: HT4500-LAMHP1 |
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(1) HT9423 CushionPAD 24” X 24” |
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(1) HT4536D-10-1 360 Grit Diamond ScrubPAD |
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(1) HT4536DW-1 360 Grit Diamond ScrubBELT® |
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(1) FTPEN-1 ScrubWRIGHT™ PEN |
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(1) HT4754 UltraSOLV® Sponge |
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(2) HT1511FC-5 MiraSWABS® (10 MiraSWABS®) |
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(2) HT5790S-5 MiraWIPES® (10 MiraWIPES®) |
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| LAM 2300 Exelan Flex Hot Plate PM Procedure: |
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| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ |
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| Step 1: |
Using proper procedures and safety guidelines remove LAM OXIDE ETCH Hot Plate from ETCH Chamber and prepare for PM |
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| Step 2: |
Place HT9423 Foam CushionPAD onto a flat solid work area, this will protect the hot plate during the cleaning procedure (See Fig 1) |
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Fig 1: Foam CushionPAD to be placed on flat work area
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| Step 3: |
Safely place hot plate on top of CushionPAD (See Fig 2) |
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Fig 2: Hot plate placed on top of Foam CushionPAD |
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| Step 4: |
Take the HT4754 UltraSOLV® Sponge and lightly dampen with DI water (See Fig 3) |
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Fig 3: Lightly dampen UltraSOLV® Sponge with DI water
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| Step 5: |
Using the lightly dampened UltraSOLV® Sponge, pre-wipe the entire hot plate to remove any flaking or loose buildup (See Fig 4) |
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Fig 4: UltraSOLV® Sponge pre-wiping the hot plate |
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| Step 6: |
Lightly dampen the HT4536D 360 Grit Diamond ScrubPAD with DI water and proceed to gently scrub off the buildup on top of the hot plate (See Fig 5 & 6) |
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Fig 5: Lightly dampen ScrubPAD with DI water
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Fig 6: Gently scrub off buildup throughout ETCH hot plate
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| Step 7: |
Using the lightly dampened UltraSOLV® Sponge wipe away the buildup as it becomes loose on top of the hot plate (See Fig 7) |
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Fig 7: Lightly dampened UltraSOLV® Sponge removing loose buildup on top of hot plate |
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| Step 8: |
As Diamond ScrubPAD begins to load up with deposition, pull ScrubPAD across UltraSOLV® Sponge to unload (See Fig 8, 9 & 10) |
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Fig 5: ScrubPAD loaded with deposition |
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Fig 6: Pull ScrubPAD across UltraSOLV® Sponge |
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Fig 7: Unloaded ScrubPAD
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| Step 9: |
Continue to rinse UltraSOLV® Sponge with DI water as sponge begins to load up with deposition (See Fig 11 & 12) |
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Fig 11: UltraSOLV® Sponge loaded with deposition
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Fig 12: UltraSOLV® Sponge free of deposition after rinse in DI water
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| Step 10: |
Repeat steps 4 – 9, scrubbing the remaining areas of the LAM ETCH Hot Plate, ensuring to rinse UltraSOLV® Sponge and unload 360 Grit Diamond ScrubPAD, as necessary |
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| Step 11: |
Use HT4536DW 360 Grit Diamond ScrubBELT® with FTPEN-1 ScrubWRIGHT™ Pen to clean around any hard to reach areas, such as the “guide pins” that normally get very dirty (See Fig 13) |
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Fig 13: Tip of FTPEN-1 scrubbing off buildup from hard to reach areas |
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| NOTE: |
WHEN USING THE FTPEN-1, ENSURE TO ROTATE THE ScrubBELT® AROUND THE PEN AS NECESSARY TO KEEP A FRESH PORTION OF THE ScrubBELT® AVAILABLE AT THE TIP OF THE FTPEN. THIS IS THE AREA YOU ARE USING WHEN GENTLY SCRUBBING ANY DETAILED AREAS |
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| FINAL WIPE PROCEDURE: |
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IMPORTANT NOTE |
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| THE USE OF HT5790S MiraWIPES® AND HT1511FC MiraSWABS® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM THE HOT PLATE |
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Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 10a & 10b) |
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Fig 10a: Current fab wiper after completely wiping the hot plate |
Fig 10b: Particles picked up using HT5790S MiraWIPES ® after completely wiping with current fab wiper |
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| Step 12: |
Once scrubbing off buildup throughout hot plate is complete, saturate the HT5790S MiraWIPE® with IPA and perform an initial wipe down of hot plate (See Fig 15 & 16) |
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Fig 15: Saturate MiraWIPES® with IPA for initial wipe down |
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Fig 16: Perform an initial wipe down of hot plate using MiraWIPES®
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| Step 13: |
Replace MiraWIPE® with a fresh MiraWIPE® as necessary, and continue wiping hot plate until MiraWIPE® is no longer able to remove visible film |
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| Step 14: |
When initial wipe down of hot plate is complete, place the HT1511FC MiraSWABS® into a MiraWIPE® and saturate with IPA (See Fig 17) |
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Fig 17: Placing MiraSWABS® into a MiraWIPE® and saturating with IPA |
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| Step 15: |
Take saturated MiraSWABS® and wipe off build up from all the hard to reach areas throughout hot plate assembly (See Fig 18 & 19) |
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Fig 18 & 19: Saturated MiraSWABS® removing film from hard to reach areas throughout hot plate |
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| NOTE: |
IMPORTANT TO USE MiraWIPES® ALONG WITH THE MiraSWABS® AS THE SWABS WILL REMOVE LOOSE DEPOSITION FROM THE HARD TO REACH AREAS THROUGHOUT THE ETCH HOT PLATE |
Scotch-Brite™ is a trademark of 3M Corporation
