| LAM 2300 Metal Etch Light Deposition PM Procedure: |
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| View “How to” instructional videos on http://foamtecintlwcc.com/video/ |
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| Step 1: |
Using proper procedures and safety guidelines, shutdown and prepare LAM2300 Metal ETCH Chamber for wet clean |
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| Step 2: |
Properly stage a container of DI water next to the chamber and place a Foamtec International HT4536D ScrubPAD and HT4754 UltraSOLV® Sponge into the container (See Fig 1) |
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Fig 1: Container of DI water with ScrubPAD and UltraSOLV Sponge |
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| Step 3: |
Take damp UltraSOLV® Sponge and begin wiping Metal ETCH Chamber and bottom of e-chuck allowing the water to react with the process induced residue. Remove as much of the deposition as possible with the sponge (See Fig 2 & 3)
This initial wipe portion of PM should take 15-20 minutes, and will remove 90% of the deposition with just the sponge and DI water |
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Fig 2: DI water from UltraSOLV® Sponge reacting with deposition |
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Fig 3: UltraSOLV® Sponge wiping Metal ETCH Chamber, 90% of deposition removed |
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| Step 4: |
It will be important to keep the UltraSOLV® Sponge moist and clear of excess deposition by replacing the sponge in the container of DI water and rinsing clear (See Fig 4) |
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| NOTE: |
The Metal ETCH Chamber will be very hot; therefore, it will require rinsing the sponge frequently in the container of DI water, in order to keep moist |
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Fig 4: Rinsing UltraSOLV® Sponge in container of DI water |
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| Step 5: |
After performing initial wipe with the UltraSOLV® Sponge for at least 15 minutes, take the moist 360 Grit Diamond ScrubPAD from the container of DI water and begin scrubbing the Metal ETCH Chamber and bottom of e-chuck (See Fig 5)
Ensure to keep the ScrubPAD moist during scrub portion of PM by returning to the container of DI water as necessary |
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Fig 5: 360 Grit Diamond ScrubPAD scrubbing bottom of e-chuck |
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| Step 6: |
Be prepared to wipe the scrubbed portion of the e-chuck with the dampened UltraSOLV® Sponge immediately after scrubbing with the 360 Grit Diamond ScrubPAD, ensuring not to let the wet deposition dry onto the chamber wall (See Fig 6) |
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Fig 6: UltraSOLV® Sponge wiping Metal ETCH Chamber during scrub portion of PM |
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| Step 7: |
Pull ScrubPAD across the UltraSOLV® Sponge in one direction to also free ScrubPAD of deposition (See Fig 7, 8 & 9) |
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Fig 7: ScrubPAD loaded with deposition |
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Fig 8: Pull ScrubPAD across UltraSOLV® Sponge |
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Fig 9: Unloaded ScrubPAD |
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| Step 8: |
Continue to return UltraSOLV® Sponge and 360 Grit Diamond ScrubPAD into the container of DI water to rinse free of deposition (See Fig 10 & 11) |
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Fig 10: UltraSOLV® Sponge loaded with deposition |
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Fig 11: UltraSOLV® Sponge free of deposition after rinse in DI water |
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| NOTE: |
Continue to repeat this SCRUB – WIPE – RINSE procedure outlined in steps 5 through 8 for the remainder of the Metal ETCH Chamber. KEY POINT is not to let the wet deposition dry onto the chamber wall |
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| Step 9: |
Using the same technique as described above, (SCRUB – WIPE – RINSE) clean all portions of Metal ETCH Chamber that are required; slit valve, pump ports, view ports, e-chuck, door mount…. |
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| NOTE: |
May remove deposition buildup on e-chuck ceramic ring, or additional parts if normally scrubbed using your current procedure (See Fig 12 & 13) |
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Fig 12: Clean ceramic ring |
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Fig 13: GDP assembly |
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| Step 10: |
After completing entire ETCH Chamber scrub, replace container with fresh DI water |
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| Step 11: |
Rinse out UltraSOLV® Sponge in fresh DI water and prepare Metal ETCH Chamber for FINAL WIPE PROCEDURE by again, wiping all areas of chamber with dampened UltraSOLV® Sponge |
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