LAM 2300 Metal ETCH Chamber: Heavy Deposition PM Technique

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BEFORE		AFTER

Vacuum Chamber PM Technique
LAM 2300 Metal ETCH Chamber: Heavy Deposition

OBJECTIVE:
TO EFFECTIVELY PM THE LAM 2300 METAL ETCH CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE

	Vacuum Chamber:	LAM 2300 METAL ETCH
	Vacuum Chamber Process Residue:	PROCESS INDUCED RESIDUE
	Vacuum Chamber Components:	CHAMBER, SLIT VALVE, CHUCK AND PARTS


	Old Procedure:	6 HOURS, THREE TECHS, using Scotch-Brite™, DI water, 150+ wipes & IPA

	New Procedure:	2 HOURS, ONE TECH, Foamtec HT4500-LAM23-1 PM Kit, DI water & IPA


	Vacuum Chamber Products: LAM2300 METAL ETCH CHAMBER PM KIT PM Kit P/N: HT4500-LAM23-1 Heavy Deposition
		(1) HT4754 UltraSOLV^® Sponge (4) HT4536D-10-1 360 Grit Diamond ScrubPAD (1) HT5790S-25 MiraWIPES^®

Novellus INOVA PVD Process Chamber PM Procedure:

View “How to” instructional videos on http://foamtecintlwcc.com/video/

Step 1:

Using proper procedures and safety guidelines, shutdown and prepare LAM 2300 Metal ETCH Chamber for wet clean

Step 2:

Properly stage a container of DI water next to the chamber and place a HT4536D 360 Grit Diamond ScrubPAD and HT4754 UltraSOLV^® Sponge into the container (See Fig 1)



			Fig 1: Container of DI water with ScrubPAD and UltraSOLV^® Sponge

Step 3:

Take damp UltraSOLV^® Sponge and begin wiping Metal ETCH Chamber allowing the water to react with the process induced residue. Remove as much of the deposition as possible with the sponge (See Fig 2)

This initial wipe portion of PM will take 20-25 minutes, and if performed properly, will be able to remove much of the deposition with just the sponge



	Fig 2: Dampened UltraSOLV^® Sponge wiping Metal ETCH Chamber

Step 4:

It will be important to keep the UltraSOLV^® Sponge moist and clear of excess deposition by replacing the sponge into the container of DI water and rinsing clear (See Fig 3)

NOTE:

The Metal ETCH Chamber will be very hot; therefore, it will require rinsing the sponge frequently in the DI water in order to keep it moist

Fig 3: Rinsing UltraSOLV^® Sponge in container of DI water

Step 5:

After performing initial wipe with the UltraSOLV^® Sponge for at least 20 minutes, take the moist 360 Grit Diamond ScrubPAD from the container of DI water and begin scrubbing the Metal ETCH Chamber (See Fig 4)

Ensure to keep the ScrubPAD moist during scrub portion of PM by replacing it in the container of DI water as necessary



			Fig 4: 360 Grit Diamond ScrubPAD scrubbing chamber wall

Step 6:

Be prepared to wipe the scrubbed portion of the chamber with the dampened UltraSOLV^® Sponge immediately after scrubbing with the 360 Grit Diamond ScrubPAD, ensuring not to let the wet deposition dry onto the chamber wall (See Fig 5)



	Fig 5: UltraSOLV^® Sponge wiping Metal ETCH Chamber during scrub portion of PM

Step 7:

Pull ScrubPAD across the UltraSOLV^® Sponge in one direction to free ScrubPAD of deposition (See Fig 6, 7 & 8)

Fig 6: ScrubPAD loaded with deposition

Fig 7: Pull ScrubPAD across UltraSOLV^® Sponge

Fig 8: Unloaded ScrubPAD


Step 8:	Continue to return UltraSOLV^® Sponge and 360 Grit Diamond ScrubPAD to the container of DI water to rinse free of deposition (See Fig 9 & 10)

	Fig 9: Loaded-up UltraSOLV^® Sponge		Fig 10: UltraSOLV^® Sponge AFTER rinse

NOTE:

Continue to repeat this SCRUB – WIPE – RINSE procedure outlined in steps 5 - 8 for the remainder of the Metal ETCH Chamber. The KEY POINT is to not let the wet deposition dry onto the chamber wall

Step 9:

Replace container with fresh DI water after completing half of Metal ETCH Chamber scrub

Step 10:

Replace HT4536D 360 Grit Diamond ScrubPAD with a new one when ScrubPAD appears worn (expect to use three on chamber, one for e-chuck and door assembly

Step 11:

Using same procedure as described above, proceed to SCRUB – WIPE – RINSE the bottom portion of the e-chuck assembly and chamber door mount (See Fig 11 & 12)

Sponge removing scrubbed depostion from e-chuck

Fig 11: Diamond ScrubPAD removing deposition from bottom of e-chuck

Fig 12: UltraSOLV® Sponge removing scrubbed deposition from e-chuck

NOTE:

May remove deposition buildup on e-chuck ceramic ring if desired (See Fig 13)



	Fig 13: Clean ceramic ring

Step 12:

Rinse out UltraSOLV^® Sponge in fresh DI water. Prepare Metal ETCH Chamber for FINAL WIPE PROCEDURE by wiping all areas of chamber completely with dampened UltraSOLV^® Sponge

FINAL WIPE PROCEDURE:

IMPORTANT NOTE:

MUST USE HT5790S MiraWIPES^® DURING WIPE PORTION OF PROCEDURE TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM LAM 2300 METAL ETCH CHAMBER

Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 14a & 14b)


Fig 14a: Current fab wiper after completely wiping chamber		Fig 14b: Particles picked up using HT5790S MiraWIPES^® after completely wiping with current fab wiper


	MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY


Step 13:	Ensure to remove gloves and replace with a fresh set prior to FINAL WIPE PROCEDURE

Step 14:	Using 100% IPA, dampen the HT5790S MiraWIPES^® and perform a THOROUGH AND EFFECTIVE FINAL WIPE PROCEDURE of the entire LAM 2300 Metal ETCH Chamber, e-chuck, slit valve, pump ports, view ports, and all associated parts being replaced under the hi-vac within the chamber

TOOL RECOVERY:

Step 15:	Follow proper Tool Recovery guidelines as outlined by LAM Research Corporation

Scotch-Brite™ is a trademark of 3M Corporation