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| BEFORE |
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AFTER |
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| Vacuum Chamber PM Technique |
| LAM 490 Auto Etch Chamber |
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| OBJECTIVE: |
| TO EFFECTIVELY PM THE LAM 490 CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL PERFORMANCE AND REDUCING PARTICLE DEFECTS |
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Vacuum Chamber: |
LAM 490 AUTO ETCH |
| Vacuum Chamber Process Residue: |
PROCESS INDUCED RESIDUE |
| Vacuum Chamber Components: |
PROCESS CHAMBER AND CERAMIC RING |
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Old Procedure: |
> 4 hours with Scotch-Brite™ & DI water |
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PROBLEMS: Not able to remove by-product in a timely manner and particle issues due to the use of Scotch-Brite™ |
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New Procedure: |
2 hours using 280 Grit Diamond ScrubPAD, UltraSOLV® Sponge, MiraSWABS® & MiraWIPES® |
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BENEFITS: ABLE TO REMOVE MORE BY-PRODUCTS AND NOT LEAVE BEHIND SCOTH-BRITE™ PARTICLES HELPING REDUCE PARTICLE DEFECTS AND IMPROVE TOOL RECOVERY |
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Vacuum Chamber Products: |
| PM Kit P/N: HT4500-LAM490 |
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(1) HT4528D-10-1 280 Grit Diamond ScrubPAD |
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(1) HT4754 UltraSOLV® Sponge |
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(2) HT5790S-5 MiraWIPES® (10 MiraWIPES®) |
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| Not included in PM Kit |
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(1) HT1511FC-5 MiraSWABS® (5 MiraSWABS®) |
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(1) HT179028D-1 280 Grit ScrubTIP® Swab |
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| LAM 490 Chamber PM Procedure: |
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| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ |
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| Step 1: |
Using proper procedures and safety guidelines, remove associated parts from LAM ETCH chamber |
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| Step 2: |
Stage a container of DI water next to the process tool and place the HT4528D 280 Grit Diamond ScrubPAD and HT4754 UltraSOLV® Sponge into the container (See Fig 1) |
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Fig 1: Placing UltraSOLV® Sponge and 280 Grit Diamond ScrubPAD into DI water |
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| Step 3: |
Place clean room wipes dampened with DI water in the chamber. Let chamber soak while taking shower head off of chamber lid, approx. 15 minutes (See Fig 2) |
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Fig 2: Standard fab wipes soaked with DI water
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| Step 4: |
Remove shower head and ceramic ring from chamber lid. Soak ceramic ring in DI water (See Fig 3) |
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Fig 3: Remove shower head and ceramic ring
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| Step 5: |
Take the UltraSOLV® Sponge from the DI water and wring out most of the water. Wipe the chamber down to start removing the process residue (See Fig 4) |
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Fig 4: Wipe chamber with UltraSOLV® Sponge |
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| Step 6: |
Take lightly dampened 280 Grit Diamond ScrubPAD and begin to scrub the process residue from the chamber (See Fig 5) |
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Fig 5: Start scrubbing process build up from the process chamber |
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| Step 7: |
As the HT4528D 280 Grit Diamond ScrubPAD begins to load up with deposition, pull ScrubPAD across dampened UltraSOLV® Sponge to properly unload ScrubPAD (See Fig 6, 7 & 8) |
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Fig 6: ScrubPAD loaded with deposition |
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Fig 7: Pull ScrubPAD across UltraSOLV® Sponge |
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Fig 8: Unloaded ScrubPAD
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| Step 8: |
For the corners and areas with heavy build up use the HT179028D 280 Grit ScrubTIP® Swab lightly dampened with DI water (See Fig 9) |
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Fig 9: Diamond ScrubTIP® used to scrub heavy build up |
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| Step 9: |
Wipe the chamber periodically with the UltraSOLV® Sponge during the scrub process. When the sponge becomes loaded up with process residue wring it out in the DI water (See Fig 10 & 11) |
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Fig 10: Loaded-up UltraSOLV® Sponge |
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Fig 11: UltraSOLV® Sponge AFTER rinse |
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| Step 10: |
Follow steps 5 through 9 to continue scrubbing all parts of the chamber until all process residue has been removed. Ensure port areas are cleaned well (See Fig 12 & 13) |
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Fig 12 & 13: Ensure chamber port areas are cleaned |
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| Before |
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After |
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| Step 11: |
Remove ceramic ring from the DI water it has been soaking in and scrub the remaining process residue off of it using the HT4528D 280 Grit Diamond ScrubPAD |
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| FINAL WIPE PROCEDURE: |
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IMPORTANT NOTE |
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| THE USE OF HT5790S MiraWIPES® AND HT1511FC MiraSWABS® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS FROM THE LAM ETCH CHAMBER |
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Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 14a & 14b) |
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Fig 14a: Current fab wiper after completely wiping the chamber |
Fig 14b: Particles picked up using HT5790S MiraWIPES ® after completely wiping with current fab wiper |
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| Step 12: |
Fold the HT5790S MiraWIPE® into quarters and dampen with IPA |
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| Step 13: |
With the IPA dampened MiraWIPE® wipe down all areas of the chamber, ensuring to refold the MiraWIPE® as necessary to expose a clean side of the MiraWIPE® as you are wiping the parts (See Fig 15) |
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Fig 15: Use the MiraWIPE® Wiper to wipe out the process chamber
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| Step 14: |
After initial wipe down of the process chamber use the HT1511FC MiraSWABS®, dampened with IPA, to clean out holes in the pump plate. Ensure all holes are cleaned out (See Fig 16 & 17) |
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Fig 16: Use the MiraSWABS® to clean residue from holes in pump plate |
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Fig 17: Amount of residue left behind from the use of Scotch-Brite™ in the past the MiraSWABS® are able to clean from holes in pump plate |
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| Step 15: |
Perform final wipe down of the process chamber and any part installed back into the Chamber using MiraWIPE® dampened with IPA |
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| NOTE: |
Replace with a new dampened MiraWIPE® as necessary |
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| Step 16: |
Follow steps to reinstall chamber parts and bring process tool back into production |
Scotch-Brite™ is a trademark of 3M Corporation
