LAM 9600 Metal Etch Super Clean #1 PM Technique



Vacuum Chamber PM Technique
LAM 9600 Metal ETCH Super Clean #1

OBJECTIVE:
TO EFFECTIVELY PM THE LAM 9600 METAL ETCH IN A TIMELY MANNER, WHILE MINIMIZING PARTICLE ISSUES, REDUCING HAZARDOUS WASTE AND IMPROVING TOOL PERFORMANCE

	Vacuum Chamber:	LAM 9600 METAL ETCH
	Vacuum Chamber Process Residue:	PROCESS INDUCED RESIDUE
	Vacuum Chamber Components:	CHAMBER, CHAMBER WALLS, CHAMBER DOOR, PUMP PORT


	Vacuum Chamber Products:
		(2) HT4528A-10 280 Grit UltraSOLV^® ScrubPAD (1) HT4754 UltraSOLV^® Sponge (1) HT5790S-25 MiraWIPES^®


NOTE: INITIAL CLEAN MAY REQUIRE THE USE OF ADDITIONAL PRODUCTS TO EFFECTIVELY CLEAN CHAMBER BACK TO BARE METAL

RECOMMEND: PERFORM A ROUND OF 2-3 PM'S ON SAME TOOL TO ESTABLISH SUFFICIENT DATA FOR EVALUATION

LAM 9600 Metal Etch Super Clean PM Procedure:


View “How to” instructional videos at http://www.foamtecintlwcc.com/video/

Step 1:	Using proper procedures and safety guidelines properly shutdown and vent entire Metal ETCH chamber

Step 2:	Reduce ETCH chamber heater settings to 35^oC to 40^oC

Step 3:	Place HT4754 UltraSOLV^® Sponge and UltraSOLV^® 280 Grit Diamond ScrubPAD in container with approximately 1 liter of DI water

Step 4:	Using the dampened UltraSOLV^® Sponge, proceed to wipe down all areas throughout Metal ETCH chamber as this will remove any flakes and gross deposition buildup. Continue to re-soak and dampen the UltraSOLV^® Sponge as necessary

Step 5:	With UltraSOLV^® Sponge, dampen and moisten a 6” to 8” scrubbing area within the chamber

Step 6:	With dampen UltraSOLV^® 280 Grit Diamond ScrubPAD, proceed to scrub off deposition from moistened area

Step 7:	To help unload ScrubPAD and UltraSOLV^® Sponge of deposition, continually return them back into container of DI water as necessary (See Fig 1 & 2)

	Fig 1: Loaded-up UltraSOLV^® Sponge			Fig 2: UltraSOLV^® Sponge AFTER rinse

NOTE:	It will also be effective to unload the ScrubPAD of deposition by pulling across the UltraSOLV^® Sponge in one direction (See Fig 3, 4 & 5)

Fig 3: ScrubPAD loaded with deposition

Fig 4: Pull ScrubPAD across UltraSOLV^® Sponge

Fig 5: Unloaded ScrubPAD

Step 8:	Continue to repeat process throughout entire chamber until all deposition is removed. It is important to keep the ScrubPAD and chamber moist with DI water during clean

Step 9:	As water becomes filled with deposition, recommend disposing dirty DI water in appropriate hazardous waste collection tank and replacing with fresh DI water

Step 10:	After all areas within entire chamber have been effectively cleaned, take freshly rinsed out UltraSOLV^® Sponge and thoroughly wipe out and prep the chamber for Final IPA Wipe-Down

FINAL WIPE PROCEDURE:

IMPORTANT NOTE

THIS IMPORTANT STEP MUST BE EFFECTIVELY FOLLOWED IN ORDER TO ACHIEVE THE MAXIMUM EFFICIENCY OF TOOL RECOVERY AND PERFORMANCE. CONTINUE TO WIPE-DOWN ALL OF THE EFFECTED PM AREAS WITHIN THE ETCH CHAMBER REPEATEDLY UNTIL ALL MIRAWIPES^® NO LONGER REMOVE ANY MORE DEPOSITION

Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 6a & 6b)


Fig 6a:Current fab wiper after completely wiping the LAM 9600		Fig 6b: Particles picked up using HT5790S MiraWIPES^® after completely wiping with current fab wiper


	MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY


Step 11:	Using 100% IPA, dampen the HT5790S MiraWIPES^® and perform a THOROUGH AND EFFECTIVE FINAL WIPE-DOWN of the ETCH chamber, chamber door, slit valve, o’ring grooves and all sealing surfaces

Step 12:	Ensure to wipe down all spare parts placed back into the chamber using IPA dampened HT5790S MiraWIPES^®

Scotch-Brite™ is a trademark of 3M Corporation