LAM 9600 Metal Etch Super Clean #2 PM Technique

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BEFORE		AFTER

Vacuum Chamber PM Technique
LAM 9600 Metal ETCH Super Clean #2

OBJECTIVE:
TO EFFECTIVELY PM THE LAM 9600 METAL ETCH IN A TIMELY MANNER, WHILE MINIMIZING PARTICLE ISSUES, REDUCING HAZARDOUS WASTE AND IMPROVING TOOL PERFORMANCE

	Vacuum Chamber:	LAM 9600 METAL ETCH
	Vacuum Chamber Process Residue:	PROCESS INDUCED RESIDUE
	Vacuum Chamber Components:	CHAMBER, PUMP PORT, TURBO TUNNEL, SLIT VALVE


	Old Procedure:	Scotch-Brite™, DI water, wipers and IPA


	New Procedure:	Foamtec products, DI water, MiraWIPES^® and IPA


	Vacuum Chamber Products:
		(2) HT4528A-10 280 Grit UltraSOLV^® ScrubPAD (1) HT4754 UltraSOLV^® Sponge (1) HT5790S-25 MiraWIPES^®

NOTE: INITIAL CLEAN MAY REQUIRE THE USE OF ADDITIONAL PRODUCTS TO EFFECTIVELY CLEAN CHAMBER BACK TO BARE METAL

RECOMMEND: PERFORM A ROUND OF 2-3 PM'S ON SAME TOOL TO ESTABLISH SUFFICIENT DATA FOR EVALUATION

LAM 9600 Metal Etch Super Clean #2 PM Procedure:

View “How to” instructional videos at http://www.foamtecintlwcc.com/video/

Step 1:

Using proper procedures and safety guidelines properly shutdown and vent entire Metal ETCH chamber

Step 2:

Reduce ETCH chamber heater settings to 35^oC to 40^oC

Step 3:

Place HT4754 UltraSOLV^® Sponge, UltraSOLV^® 280 Grit Diamond ScrubPAD in container with approximately 1 liter of DI water (See Fig 1)



	Fig 1: 280 Grit Diamond ScrubPAD, Sponge & 1 liter DI water Note Time: 9:35

Step 4:

Using the dampened UltraSOLV^® Sponge, proceed to wipe down all areas throughout Metal ETCH chamber, slit valve and turbo tunnels as this will remove any flakes and gross deposition buildup (See Fig 2 & 3)

NOTE:

CONTINUE TO RE-SOAK AND DAMPEN THE ULTRASOLV^® SPONGE AS NECESSARY



	Fig 2: Dampened UltraSOLV^® Sponge initial wipe of chamber		Fig 3: ETCH Chamber following initial wipe with UltraSOLV^® Sponge

Step 5:

With UltraSOLV^® Sponge, dampen and moisten a 6” to 8” scrubbing area within the chamber

Step 6:

With dampened UltraSOLV^® 280 Grit Diamond ScrubPAD, proceed to scrub off deposition from moistened area

Step 7:	To help unload ScrubPAD and UltraSOLV^® Sponge of deposition, continually return them back into container of DI water as necessary. It will also be effective to unload the ScrubPAD of deposition by pulling across the UltraSOLV^® Sponge in one direction (See Fig 4, 5 & 6)

Fig 4: ScrubPAD loaded with deposition

Fig 5: Pull ScrubPAD across UltraSOLV^® Sponge

Fig 6: Unloaded ScrubPAD

Step 8:

Continue to repeat process throughout entire chamber until all deposition is removed. It is important to keep the ScrubPAD and chamber moist with DI water during clean

Step 9:

As water becomes filled with deposition, recommend disposing dirty DI water in appropriate hazardous waste collection tank and replacing with fresh DI water

Step 10:

After all areas within entire chamber have been effectively cleaned, take freshly rinsed out UltraSOLV^® Sponge and thoroughly wipe out and prep the chamber for FINAL IPA WIPE PROCEDURE (See Fig 7)



	Fig 7: Chamber Scrub CompleteDiamond ScrubPAD & UltraSOLV® Sponge ONLY products used for scrub portion of PM. Note time: 10:06 Less than 1 hour to complete scrub

FINAL WIPE PROCEDURE:

IMPORTANT NOTE

THE USE OF HT5790S MiraWIPES^® DURING THE FINAL WIPE PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM THE LAM 9600. CONTINUE TO WIPE-DOWN ALL OF THE AFFECTED PM AREAS WITHIN THE ETCH CHAMBER REPEATEDLY UNTIL ALL MIRAWIPES^® NO LONGER REMOVE ANY MORE DEPOSITION

Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 8a & 8b)


Fig 8a:Current fab wiper after completely wiping the LAM 9600		Fig 8b: Particles picked up using HT5790S MiraWIPES^® after completely wiping with current fab wiper


	MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY


Step 11:	Using 100% IPA, dampen the HT5790S MiraWIPES^® and perform a THOROUGH AND EFFECTIVE FINAL WIPE-DOWN of the ETCH Chamber, chamber door, slit valve, turbo tunnel, o-ring grooves and all sealing surfaces

Step 12:	Ensure to wipe down all spare parts placed back into the LAM 9600 Metal ETCH chamber using additional IPA dampened HT5790S MiraWIPES^®

Scotch-Brite™ is a trademark of 3M Corporation