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| Vacuum Chamber PM Technique | ||||
| LAM 9600 PTX Metal Etch Chamber Clean | ||||
OBJECTIVE: |
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TO EFFECTIVELY PM THE METAL ETCH CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE |
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| Vacuum Chamber: | LAM METAL ETCHER (**THIS TECHNIQUE IS A SIMILAR METHOD USED FOR OTHER ETCH TOOLS) | |
| Vacuum Chamber Process Residue: | PROCESS INDUCED RESIDUE | |
| Vacuum Chamber Components: | METAL ETCH CHAMBER AND CHAMBER LID |
| Old Procedure: | Scotch-Brite™, 40 grit sand paper, wire mesh, scrapers, IPA and Texwipes |
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| Solvent: | DI water, IPA | |
| Time: | After initial clean is completed down to bare metal (see pictures below), future cleans take less than 20 minutes | |
| Vacuum Chamber Products: | |||
**Various diamond grit abrasives can be selected for this process depending on the amount of deposition build-up within the Metal Etch Chamber – Range from 140 to 800 diamond grit available. |
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| Metal Etch Chamber PM Procedure: | ||||||
| View “How to” instructional videos at http://www.foamtecintlwcc.com/video/ | ||||||
| Step 1: | Remove all necessary parts from within Metal Etch Chamber | |||||
| Step 2: | Thoroughly wipe-down inside of the chamber using a DI water dampened UltraSOLV® HT4754 Sponge. This will be necessary to remove any flaking or large deposits that would unnecessarily load up the ScrubPADs | |||||
| Step 3: | Using a DI water dampened HT4528D-10 ScrubPAD, scrub a 5”x5” area within the Metal Etch Chamber | |||||
| Step 4: | Wipe-down the effected chamber area using the DI water dampened UltraSOLV® HT4754 Sponge | |||||
| Step 5: | Unload the ScrubPAD of deposition by wiping the UltraSOLV® HT4754 Sponge with the ScrubPAD in one direction (See Fig 1, 2 & 3) | |||||
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Fig 1 : ScrubPAD loaded with deposition |
Fig 2 : Pull ScrubPAD across UltraSOLV® Sponge |
Fig 3 : Unloaded ScrubPAD |
| Step 6: | Unload the UltraSOLV® HT4754 Sponge by rinsing out with DI water and wringing out into a HazMat container. (See Fig 4 & 5) |
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Fig 4: Loaded-up UltraSOLV® Sponge |
Fig 5: UltraSOLV® Sponge AFTER rinse |
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| Step 7: | Repeat steps 3 – 5, using the HT4528D ScrubPAD and the HT179028D ScrubTIP® where necessary, until all deposition is removed |
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| Step 8: | After effectively cleaning the Metal Etch Chamber use the HT4580D ScrubPAD and the HT4754 UltraSOLV® Sponge in the same manner as the ScrubPADS used before to lightly scrub the fine scratches that may be left behind from using the 280 Grit Diamond ScrubPAD. This is a very important step to be performed on all of the vacuum sealed surfaces to ensure an effective pump-down is achieved | ||
| FINAL WIPE PROCEDURE: | ||
IMPORTANT NOTE |
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| MUST USE HT5790S MiraWIPES® DURING FINAL WIPE PORTION OF PROCEDURE TO EFFECTIVELY REMOVE PARTICLE DEFECTS | ||
| Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 6a & 6b) | ||
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Fig 6a: Current fab wiper after completely wiping the chamber |
Fig 6b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper |
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MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY |
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| Step 9: | Repeatedly wipe the inside of the Metal Etch Chamber using an IPA dampened HT5790S MiraWIPE®. Dampen the HT1000 CleanWIPE® Swab and effectively remove any deposition left in the hard to reach areas. Ensure to wipe entire chamber effectively until all areas are cleaned of deposition | ||
| Metal Etch Chamber – Pre-Clean | ||
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Metal Etch Chamber – Post-Clean |
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Scotch-Brite™ is a trademark of 3M Corporation
