Home > Documents > Application Notes > Nova GSD Chamber
Click Here for Printer Friendly Version
Before Foamtec Logo After
BEFORE AFTER
Vacuum Chamber PM Technique
NOVA GSD - HE High Energy Source
OBJECTIVE:

TO EFFECTIVELY PM THE NOVA GSD HE HIGH ENERGY SOURCE IN A TIMELY MANNER MINIMIZING TOOL DOWNTIME AND IMPROVING TOOL AVAILABILITY
 
Vacuum Chamber: NOVA NV GSD HE HIGH ENERGY IMPLANTER
Vacuum Chamber Process Residue: PROCESS INDUCED RESIDUE
Vacuum Chamber Components: SOURCE
Old Procedure: Using Scotch-Brite™, DI water, ethanol & 100+ wipes
Not able to effectively clean source in a timely manner Recovery time: 4 to 6 Hours
New Procedure: 30 minutes using Foamtec International products with DI water
Recovery time: 1 to 2 hours
Foamtec products
Vacuum Chamber Products:
GSD HE SOURCE CHAMBER PM
PM Kit P/N: HT4500 – NOVA1
  • (2) HT4536D-10-1  360 Grit Diamond ScrubPAD
  • (1) FTPEN-1 ScrubWRIGHT™ PEN
  • (1) HT4536DW-1  360 Grit Diamond ScrubBELT®
  • (1) HT4754 UltraSOLV® Sponge
  • (1) HT4790-5 UltraSOLV® Foam Wipers
  • (1) HT1511FC-10 MiraSWABS® (10 swabs)
  • (1) HT5790S-25 MiraWIPES® (25 MiraWIPES®)
 
 
NOVA NV GSD HE SOURCE PM Procedure:
 
View “How to” instructional videos on http://foamtecintlwcc.com/video/
Step 1: Using proper procedures and safety guidelines, properly prepare GSD HE High Energy Source for wet clean
 
Step 2: Stage a small container of DI water over a protective plastic sheet next to the GSD Source Chamber
 
Step 3: Place HT4754 UltraSOLV® Sponge and ScrubPAD in container of DI water to moisten products (See Fig 1)
ScrubPAD and Sponge
Step 4: Take dampened UltraSOLV® Sponge and pre-wipe GSD source, removing any loose deposition or flakes.  Continue to re-moisten the UltraSOLV® Sponge in container of DI water as necessary (See Fig 2) 
 
Pre-wiping GSD source
 
Step 5: Use dampened 360 Grit Diamond ScrubPAD and scrub GSD source chamber (See Fig 3 & 4)
Dampened ScrubPAD. Scrubbing chamber.
Step 6: As loose deposition begins to build up within the GSD source chamber, use dampened UltraSOLV® Sponge to wipe the area free of deposition (See Fig 5 & 6)
 
UltraSOLV Sponge. Wiping out loose deposition.
Step 7: When placing UltraSOLV® Sponge in DI water, always RINSE-OUT as much deposition as possible from sponge (See Fig 7 & 8)
 
Loaded UltraSOLV Sponge
UltraSOLV after rinse
Fig 7: Loaded-up UltraSOLV® Sponge
Fig 8: UltraSOLV® Sponge AFTER rinse
 
Step 8: As ScrubPAD loads up with deposition, pull ScrubPAD across a damp UltraSOLV® Sponge to unload ScrubPAD (See Fig 9, 10 &11)
 
ScrubPAD loaded with deposition
Pull ScrubPAD across sponge
Unloaded ScrubPAD
Fig 9: ScrubPAD loaded with deposition
Fig 10: Pull ScrubPAD across UltraSOLV® Sponge
Fig 11: Unloaded ScrubPAD
NOTE: REMEMBER TO UNLOAD UltraSOLV® SPONGE WHEN IT BECOMES LOADED WITH DEPOSITION BY RINSING SPONGE IN CONTAINER OF DI WATER
Step 9: Repeat steps 5 – 8, scrubbing the remaining areas of the GSD source chamber (See Fig 12 – 16)
 
GSD Chamber
 
Step 10: When the scrub is complete on GSD source chamber using the ScrubPAD, take ScrubWRIGHT™ PEN and gently scrub off the deposition from the hard to reach areas and corners throughout GSD source chamber (See Fig 17)
 
ScrubWRIGHT Pen
 
NOTE: ENSURE TO ROTATE ScrubBELT® ON ScrubWRIGHT™ PEN AS THE ScrubBELT® BEGINS TO WEAR AGAINST THE TIP OF THE PEN
 
Step 11: When deposition has been completely removed throughout entire chamber, scrub the areas where the ScrubWRIGHT™ Pen was used with Diamond ScrubPAD for final polish of chamber
 
Step 12: Replace DI water in container with fresh DI water
 
Step 13: Rinse UltraSOLV® Sponge in container of fresh DI water and wipe out entire source chamber in preparation for Final Chamber Wipe Down
 
Step 14: Take the vacuum approved for implant use and vacuum the moisture from within the source chamber concentrating on the tight corners and screw ports where DI water may have accumulated (See Fig 18) 
 
Vacuuming moisture
 
FINAL WIPE PROCEDURE:
 
IMPORTANT NOTE:
 
IN ORDER TO ACHIEVE A FOAMTEC INTERNATIONAL TOOL RECOVERY, THE FINAL WIPE PROCEDURE MUST BE FOLLOWED USING THE FOAMTEC INTERNATIONAL PRODUCTS!!
 
Final wipe procedure products
 
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 20a & 20b)
MiraWIPES are more effective
 
MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY
Step 15: Take HT5790S MiraWIPES® and fold into quarters, apply IPA (or recommended final wipe solvent) and wipe out entire GSD source chamber.  Refold MiraWIPE® as necessary, exposing a clean surface of the MiraWIPE® while wiping out source chamber (See Fig 21)
 
MiraWIPE and IPA
 
NOTE: IT IS IMPORTANT TO CONTINUE WIPING OUT CHAMBER UNTIL NO MORE VISIBLE DEPOSITION CAN BE SEEN ON THE MiraWIPE®
 
Step 16: Take HT1511FC MiraSWABS®, apply IPA (or recommended final wipe solvent) and wipe out the tight corners and holes throughout source chamber (See Fig 22)
 
MiraSWAB
 
SOURCE PARTS WIPE DOWN:
 
Step 17: Use HT4790 UltraSOLV® Foam Wipers and wipe down all bead-blasted parts to be returned back into source chamber (See Fig 23 & 24)
 
Part declared clean. Deposition removed by Foam Wiper
 
Step 18: Take remaining MiraWIPES®, dampen with IPA (or recommended final wipe solvent) and wipe all the remaining parts that are not bead blasted, prior to being placed back into GSD source chamber
 
Accumulated waste

Scotch-Brite™ is a trademark of 3M Corporation