NOVA GSD - HE High Energy Source PM Technique

Fig 20A: Technician wiped out entire Source Chamber with fab wiper

Fig 20B: MiraWIPE^® was able to remove much more deposition left within chamber

Home > Documents > Application Notes > Nova GSD Chamber


Click Here for Printer Friendly Version

BEFORE		AFTER

Vacuum Chamber PM Technique
NOVA GSD - HE High Energy Source

OBJECTIVE:
TO EFFECTIVELY PM THE NOVA GSD HE HIGH ENERGY SOURCE IN A TIMELY MANNER MINIMIZING TOOL DOWNTIME AND IMPROVING TOOL AVAILABILITY

	Vacuum Chamber:	NOVA NV GSD HE HIGH ENERGY IMPLANTER
	Vacuum Chamber Process Residue:	PROCESS INDUCED RESIDUE
	Vacuum Chamber Components:	SOURCE


	Old Procedure:	Using Scotch-Brite™, DI water, ethanol & 100+ wipes Not able to effectively clean source in a timely manner Recovery time: 4 to 6 Hours

	New Procedure:	30 minutes using Foamtec International products with DI water Recovery time: 1 to 2 hours


	Vacuum Chamber Products:
	GSD HE SOURCE CHAMBER PM PM Kit P/N: HT4500 – NOVA1
		(2) HT4536D-10-1 360 Grit Diamond ScrubPAD (1) FTPEN-1 ScrubWRIGHT™ PEN (1) HT4536DW-1 360 Grit Diamond ScrubBELT^® (1) HT4754 UltraSOLV^® Sponge (1) HT4790-5 UltraSOLV^® Foam Wipers (1) HT1511FC-10 MiraSWABS^® (10 swabs) (1) HT5790S-25 MiraWIPES^® (25 MiraWIPES^®)

NOVA NV GSD HE SOURCE PM Procedure:

View “How to” instructional videos on http://foamtecintlwcc.com/video/

Step 1:

Using proper procedures and safety guidelines, properly prepare GSD HE High Energy Source for wet clean

Step 2:

Stage a small container of DI water over a protective plastic sheet next to the GSD Source Chamber

Step 3:

Place HT4754 UltraSOLV^® Sponge and ScrubPAD in container of DI water to moisten products (See Fig 1)



	Fig 1: Foamtec International products in small container of DI water over plastic sheet

Step 4:

Take dampened UltraSOLV^® Sponge and pre-wipe GSD source, removing any loose deposition or flakes. Continue to re-moisten the UltraSOLV^® Sponge in container of DI water as necessary (See Fig 2)



	Fig 2: Foamtec International UltraSOLV^® Sponge pre-wiping GSD Source

Step 5:

Use dampened 360 Grit Diamond ScrubPAD and scrub GSD source chamber (See Fig 3 & 4)


	Fig 3: Dampened 360 Grit ScrubPAD		Fig 4: Scrubbing GSD Source Chamber with ScrubPAD

Step 6:

As loose deposition begins to build up within the GSD source chamber, use dampened UltraSOLV^® Sponge to wipe the area free of deposition (See Fig 5 & 6)


	Fig 5: Dampened UltraSOLV^® Sponge preparing to wipe chamber		Fig 6: UltraSOLV^® Sponge used to wipe out loosened deposition

Step 7:

When placing UltraSOLV^® Sponge in DI water, always RINSE-OUT as much deposition as possible from sponge (See Fig 7 & 8)

	Fig 7: Loaded-up UltraSOLV^® Sponge		Fig 8: UltraSOLV^® Sponge AFTER rinse


Step 8:	As ScrubPAD loads up with deposition, pull ScrubPAD across a damp UltraSOLV^® Sponge to unload ScrubPAD (See Fig 9, 10 &11)

Fig 9: ScrubPAD loaded with deposition

Fig 10: Pull ScrubPAD across UltraSOLV^® Sponge

Fig 11: Unloaded ScrubPAD


NOTE:	REMEMBER TO UNLOAD UltraSOLV^® SPONGE WHEN IT BECOMES LOADED WITH DEPOSITION BY RINSING SPONGE IN CONTAINER OF DI WATER

Step 9:

Repeat steps 5 – 8, scrubbing the remaining areas of the GSD Source Chamber (See Fig 12 – 16)


	Fig 12		Fig 13



Fig 14	Fig 15	Fig 16

Step 10:

When the scrub is complete on GSD source chamber using the ScrubPAD, take ScrubWRIGHT™ PEN and gently scrub off the deposition from the hard to reach areas and corners throughout GSD source chamber (See Fig 17)



	Fig 17: ScrubWRIGHT™ Pen scrubbing corners in Source Chamber

NOTE:

ENSURE TO ROTATE ScrubBELT^® ON ScrubWRIGHT™ PEN AS THE ScrubBELT^® BEGINS TO WEAR AGAINST THE TIP OF THE PEN

Step 11:

When deposition has been completely removed throughout entire chamber, scrub the areas where the ScrubWRIGHT™ Pen was used with Diamond ScrubPAD for final polish of chamber

Step 12:

Replace DI water in container with fresh DI water

Step 13:

Rinse UltraSOLV^® Sponge in container of fresh DI water and wipe out entire source chamber in preparation for Final Chamber Wipe Down

Step 14:

Take the vacuum approved for implant use and vacuum the moisture from within the source chamber concentrating on the tight corners and screw ports where DI water may have accumulated (See Fig 18)


			VERY IMPORTANT STEP TO HELP WITH TOOL RECOVERY



			Fig 18: Vacuuming moisture from tight corners throughtout Source Chamber

FINAL WIPE PROCEDURE:

IMPORTANT NOTE:

IN ORDER TO ACHIEVE A FOAMTEC INTERNATIONAL TOOL RECOVERY, THE FINAL WIPE PROCEDURE MUST BE FOLLOWED USING THE FOAMTEC INTERNATIONAL PRODUCTS!!

		CHARACTERISTICS OF MiraWIPE AND UltraSOLV FOAM WIPERS HELP PROVIDE A CLEANER CHAMBER HELPING WITH TOOL RECOVERY



		Fig 19: Foamtec International products used for FINAL WIPE PROCEDURE

Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 20a & 20b)

MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY

Step 15:

Take HT5790S MiraWIPES^® and fold into quarters, apply IPA (or recommended final wipe solvent) and wipe out entire GSD source chamber. Refold MiraWIPE^® as necessary, exposing a clean surface of the MiraWIPE^® while wiping out source chamber (See Fig 21)



	Fig 21: MiraWIPE^® folded in 1/4's with IPA

NOTE:

IT IS IMPORTANT TO CONTINUE WIPING OUT CHAMBER UNTIL NO MORE VISIBLE DEPOSITION CAN BE SEEN ON THE MiraWIPE^®

Step 16:

Take HT1511FC MiraSWABS^®, apply IPA (or recommended final wipe solvent) and wipe out the tight corners and holes throughout source chamber (See Fig 22)



			Fig 22: MiraSWAB^® wiping corners in Source Chamber

SOURCE PARTS WIPE DOWN:

Step 17:

Use HT4790 UltraSOLV^® Foam Wipers and wipe down all bead-blasted parts to be returned back into source chamber (See Fig 23 & 24)


	Fig 23: Clean Source Liner from parts clean		Fig 24: UltraSOLV^® Foam Wiper removes more deposition

Step 18:

Take remaining MiraWIPES^®, dampen with IPA (or recommended final wipe solvent) and wipe all the remaining parts that are not bead blasted, prior to being placed back into GSD source chamber

Fig 25: WASTE ACCUMULATED

Scotch-Brite™ is a trademark of 3M Corporation