Novellus INOVA PVD Process Chamber PM Technique


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Chamber		Chamber Ring

Vacuum Chamber PM Technique
Novellus INOVA PVD Process Chamber

OBJECTIVE:
TO EFFECTIVELY PM THE NOVELLUS INOVA PVD PROCESS CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE

	Vacuum Chamber:	NOVELLUS INOVA PVD
	Vacuum Chamber Process Residue:	PROCESS INDUCED RESIDUE
	Vacuum Chamber Components:	PROCESS CHAMBER


	Old Procedure:	3 to 4 hours using Scotch-Brite™ & IPA with 100+ wipes Tool Recovery: 6 to 8 hours conditioning wafers to pass particle specs

	New Procedure:	1 to 2 hours using ScrubPAD, UltraSOLV^® Sponge DI water & IPA with 25 MiraWIPES^® Tool Recovery: <4 hours conditioning wafers to pass particle specs


	Vacuum Chamber Products:
		(3) HT4536D-10-1 360 Grit Diamond ScrubPAD (1) HT174936D-1 360 Grit Diamond ScrubTIP^® (1) FTPEN-1 ScrubWRIGHT™ PEN (1) HT4580DW-1 800 Grit Diamond ScrubBELT^® (1) HT4754 UltraSOLV^® Sponge (4) HT1511FC-5 MiraSWABS^® (20 MiraSWABS^®) (1) HT5790S-25 MiraWIPES^® (25 MiraWIPES^®) (1) HT4790-5 UltraSOLV^® Foam Wipers (5 Wipers)

Novellus INOVA PVD Process Chamber PM Procedure:

View “How to” instructional videos on http://foamtecintlwcc.com/video/

Step 1:	Using proper procedures and safety guidelines, shutdown and prepare Novellus INOVA PVD process chamber for wet clean

INOVA Upper Chamber Ring Scrub:

Step 2:	Remove INOVA PVD ANODE ADAPTER from process chamber and stage on mounting assembly in preparation for wet clean (See Fig 1)


		Fig 1: PVD anode adapter on target change cart


Step 3:	Fill FT1301 plastic container with approximately 12oz of DI water and place on protective pad next to working area (See Fig 2


		Fig 2: FT1301 plastic container with DI water

Step 4:

Place HT4536D 360 Grit Diamond ScrubPAD and HT4754 UltraSOLV^® Sponge in container of DI water to moisten products (See Fig 3)

Fig 3: Placing Diamond ScrubPAD and UltraSOLV^® Sponge in container of DI water

Step 5:

Use lightly dampened UltraSOLV^® Sponge and wipe area of anode adapter that is to be cleaned (See Fig 4)





	Fig 4: Lightly dampened UltraSOLV^® Sponge wiping anode adapter

Step 6:

Take lightly dampened 360 Grit Diamond ScrubPAD and scrub deposition off of anode adapter (See Fig 5)


			Fig 5: Lightly dampened ScrubPAD scrubbing off deposition

NOTE:

REMEMBER IT IS NOT NECESSARY TO USE A LOT OF DI WATER DURING THIS SCRUB PORTION OF THE PM, ONLY ENOUGH TO KEEP DIAMOND SCRUBPAD MOIST

Step 7:

After scrubbing a small area with the 360 Grit Diamond ScrubPAD, use the lightly dampened UltraSOLV^® Sponge and wipe deposition from the scrubbed area (See Fig 6 & 7)



	Fig 6: UltraSOLV^® Sponge wiping off deposition		Fig 7: Deposition on UltraSOLV^® Sponge

NOTE:

THIS STEP WILL ELIMINATE THE USE OF 100+ WIPERS AS THE SPONGE CAN BE REUSED DURING THE SCRUB PORTION OF THE PM

Step 8:

As Diamond ScrubPAD loads-up with deposition, pull ScrubPAD across damp UltraSOLV^® Sponge to properly unload (See Fig 8, 9 & 10)

Fig 8: ScrubPAD loaded with deposition

Fig 9: Pull ScrubPAD across UltraSOLV^® Sponge

Fig 10: Unloaded ScrubPAD


Step 9:	Ensure to unload UltraSOLV^® Sponge as much as possible by placing it back in container of DI water and RINSE-OUT thoroughly (See Fig 11 & 12)

	Fig 11: Loaded-up UltraSOLV^® Sponge		Fig 12: UltraSOLV^® Sponge AFTER rinse

Step 10:	Repeat steps 4 – 9 for all remaining areas throughout PVD anode adapter. Unload ScrubPAD and UltraSOLV^® Sponge as necessary

Step 11:	When scrub portion of wet clean is complete, prepare anode adapter for Final Wipe by rinsing out UltraSOLV^® Sponge with fresh DI water and performing a complete final anode adapter wipe using the dampened UltraSOLV^® Sponge

IMPORTANT NOTE:

MUST USE HT5790S MiraWIPES^® AND HT1511FC MiraSWABS^® DURING WIPE PORTION OF PROCEDURE TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM NOVELLUS INOVA PVD PROCESS CHAMBER

INOVA ANODE ADAPTER WIPE:

NOTE:

Below is an example of the particles the HT1511FC MiraSWAB^® was able to remove from the adapter shield pin grooves in the NOVELLUS INOVA PVD ANODE Adapter (See Fig 13 & 14)




	Fig 13 & 14: What the HT1511FC MiraSWAB^® was able to effectively remove from upper chamber ring


	MiraSWABS^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY

NOTE:	Important to use HT1511FC MiraSWABS^® before HT5790S MiraWIPES^® as the MiraSWABS^® will be lifting particles out of the hard to reach areas and will have to be followed by wiping with the MiraWIPE^®

Step 12:	Dampen the HT1511FC MiraSWAB^® with IPA and wipe out the hard to reach areas, such as adapter shield pin grooves, o-ring grooves, screw holes and tight corners (See Fig 15)


		Fig 15: MiraSWAB^® wiping out adapter shield pin grooves


Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 16a & 16b)


Fig 16a: Current fab wiper after completely wiping chamber		Fig 16b: Particles picked up using HT5790S MiraWIPES^® after completely wiping with current fab wiper


	MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY

Step 13:

Fold the HT5790S MiraWIPE^® into quarters and dampen with IPA

NOTE:

IMPORTANT TO FULLY SATURATE THE MiraWIPE^® WITH IPA. THE MICROFIBER CHARACTERISTICS ARE MORE ABSORBENT AND WILL HOLD MORE IPA THAN ANY STANDARD FAB WIPER, HELPING TO PERFORM A MORE EFFECTIVE FINAL WIPE

Step 14:

Using the IPA dampened MiraWIPE^®, wipe down all areas of the anode adapter, be sure to refold the MiraWIPE^® as necessary to expose a clean side of the MiraWIPE^® as you wipe within the chamber

NOTE:

REPLACE WITH A NEW DAMPENED MiraWIPE^® AS NECESSARY

Step 15:

Repeat above MiraWIPE^® & MiraSWAB^® final wipe procedure on all remaining areas of Novellus INOVA Anode Adapter

INOVA PVD Chamber Scrub:

Step 16:

Empty container of DI water in approved waste disposal sink and replace with fresh DI water (See Fig 17)




	Fig 17: FT1301 plastic container with fresh DI water

Step 17:

Take 2nd HT4536D 360 Grit Diamond ScrubPAD and HT4754 UltraSOLV^® Sponge and place in container of fresh DI water (See Fig 18)




		Fig 18: Placing Diamond ScrubPAD and UltraSOLV^® Sponge in container of fresh DI water

NOTE:

If UPPER EDGE OF PVD CHAMBER DOES NOT CONTAIN A RING OF HARD WHITE BUILDUP THEN PROCEED TO STEP 20 (See Fig 19)




	Fig 19: Ring of hard white buildup along top edge of PVD process chamber

Step 18:

Take lightly dampened UltraSOLV^® Sponge and wipe ring of hard white buildup along top edge of PVD process chamber (See Fig 20)




		Fig 20: UltraSOLV^® Sponge wiping top edge of PVD process chamber

Step 19:

Use lightly dampened 360 Grit Diamond ScrubPAD and scrub off hard white buildup along top edge of chamber (See Fig 21)




	Fig 21: ScrubPAD scrubbing off buildup from top edge of chamber

Step 20:

When white ring on top edge of process chamber has been removed, use the same technique with the UltraSOLV^® Sponge and ScrubPAD to remove any process buildup throughout chamber (See Fig 22)




		Fig 22: UltraSOLV^® Sponge wiping process chamber in preparation for scrub

NOTE:

UNLOAD DIAMOND SCRUBPAD AND ULTRASOLV^® SPONGE USING THE SAME METHOD DESCRIBED ABOVE

Step 21:

For small areas and tight corners, such as the chamber flange, place the HT4580DW-1 800 Grit Diamond ScrubBELT^® onto the FTPEN-1 ScrubWRIGHT^®; Pen and scrub these areas with the tip of the ScrubWRIGHT^®; Pen. Use the same unloading procedure for the ScrubBELT^® as described above and ensure to rotate the ScrubBELT^® as necessary to prevent from breaking (See Fig 23, 24 & 25)




	Fig 23 & 24: ScrubWRIGHT^® PEN scrubbing along the chamber flange


	Fig 25: PVD chamber edge AFTER scrub

Step 22:

Use a 3rd 360 Grit Diamond ScrubPAD, lightly moistened with DI water, to scrub outer edge of the ceramic e-chuck (See Fig 26)




	Fig 26: Scrubbing the outer edge of ceramic e-chuck

Step 23:

Use the UltraSOLV^® Sponge, lightly dampened with DI water, in the same manner as described above to wipe the edge of the ceramic e-chuck

Step 24:

Take a HT174936D-1 360 Grit Diamond ScrubTIP^® to clean the lift pin holes around the edge of the e-chuck (See Fig 27)




	Fig 27: 360 Grit Diamond ScrubTIP^® cleaning lift pin holes

Step 25:

In preparation for the final wipe, take a certified house vacuum and vacuum out all the areas throughout the PVD process chamber where DI water and/or particles may have accumulated (See Fig 28)




		Fig 28: Using house vacuum to pull moisture and particles out of tight areas

IMPORTANT NOTE

MUST USE HT5790S MiraWIPES^® AND HT1511FC MiraSWABS^® DURING FINAL WIPE PORTION OF PROCEDURE TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM NOVELLUS INOVA PVD PROCESS CHAMBER

INOVA PVD Process Chamber Wipe:

NOTE:

Below is an example of the particles the HT1511FC MiraSWAB^® was able to remove from the hard to reach tight areas in the Novellus INOVA PVD Process Chamber (See Fig 29)




	Fig 29: What the HT1511FC MiraSWAB^® was able to effectively remove from PVD process chamber

	MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY

NOTE:

Important to use HT1511FC MiraSWABS^® before HT5790S MiraWIPES^® as the MiraSWABS^® will be lifting particles out of the hard to reach areas and will have to be followed by wiping with the MiraWIPE^®

Step 26:

Dampen the HT1511FC MiraSWAB^® with IPA and wipe out the hard to reach areas, such as ESC lift pin holes, holes at the bottom of the chamber, PVD changer flange and o-ring grooves (See Fig 30, 31, 32, 33 & 34)






		Fig 30, 31, 32, 33 & 34: MiraSWAB^® wiping out ESC lift pin holes, holes on bottom of chamber and PVD changer flange

NOTE:

Figure below shows how much more deposition the Foamtec International MiraWIPE^® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE^® Final IPA Wipe the most CRITICAL STEP of the PM procedure (See Fig 35a & 35b)




Fig 35a: Current fab wiper after completely wiping process chamber		Fig 35b: Particles picked up using HT5790S MiraWIPES after completely wiping with current fab wiper

	MiraWIPES^® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY

Step 27:

Fold the HT5790S MiraWIPE^® into quarters and dampen with IPA

NOTE:

IMPORTANT TO FULLY SATURATE THE MiraWIPE^® WITH IPA. THE MICROFIBER CHARACTERISTICS ARE MORE ABSORBENT AND WILL HOLD MORE IPA THAN ANY STANDARD FAB WIPER HELPING TO PERFORM A MORE EFFECTIVE FINAL WIPE

Step 28:

With the IPA dampened MiraWIPE^®, wipe down all areas of the PVD process chamber, including chamber pass-through; be sure to refold the MiraWIPE^® as necessary to expose a clean side of the MiraWIPE^® as you wipe within the chamber (See Fig 36 & 37)





	Fig 36 & 37: Using IPA saturated MiraWIPE^® to completely wipe out PVD process chamber

NOTE:

REPLACE WITH A NEW DAMPENED MiraWIPE^® AS NECESSARY

Step 29:

Repeat above MiraWIPE^® & MiraSWAB^® final wipe procedure on all remaining areas of Novellus INOVA PVD Process Chamber

NOTE:

IT IS EXTREMELY CRITICAL TO WIPE THE PVD PROCESS CHAMBER CERAMIC E-CHUCK WITH THE UltraSOLV^® FOAM WIPER, TO PREVENT FROM GENERATING AND LEAVING FIBERS IN THE PROCESS CHAMBER (SEE FIG 38)




	Fig 38: Fiber generated from wiping e chuck with standard fab wiper

NOTE:

USING THE UltraSOLV^® FOAM WIPERS IS AN EXCELLENT TECHNIQUE TO HELP MINIMIZE BACKSIDE PARTICLES

Step 30:

Take the UltraSOLV^® foam wiper and fold into quarters (See Fig 39 & 40)



	Fig 39: UltraSOLV^® Foam Wiper		Fig 40: UltraSOLV^® Foam Wiper folded into quarters

Step 31:

Dampen the UltraSOLV^® foam wiper with IPA and wipe the top and sides of the e-chuck by PULLING the foam wiper across the e-chuck (See Fig 41)




	Fig 41: UltraSOLV^® Foam Wiper being PULLED across e-chuck

NOTE:

IT IS NECESSARY TO PULL THE FOAM WIPER ACROSS THE chuck AS THE CHARACTERISTICS OF THE FOAM WIPER WILL NOT ALLOW THE WIPER TO BE PUSHED

NOTE:

REFOLD FOAM WIPER AS NECESSARY TO EXPOSE A NEW AREA OF THE WIPER AFTER EACH SECTION HAS BEEN USED

Step 32:

Using proper procedures and safety guidelines bring PVD Process Chamber back up to production

Scotch-Brite™ is a trademark of 3M Corporation