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| BEFORE | AFTER | |
| Vacuum Chamber PM Technique | ||
| TFT-LCD G5 TEL RIE-PC Chamber | ||
| Plate & Wall Clean | ||
| OBJECTIVE: | ||
| TO EFFECTIVELY PM THE TFT-LCD G5 TEL RIE-PC CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE | ||
| Vacuum Chamber: | TEL RIE (G5) / ETCH LAYER-AST | |
| Vacuum Chamber Process Residue: | PROCESS INDUCED RESIDUE | |
| Vacuum Chamber Components: | CHAMBER WALL |
| Old Procedure: | Never clean before | |
| Tool Recovery: Extended recovery time out gassing Defects: Significant particle issues |
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| New Procedure: | DI water, Foamtec Products, 3.5 hours, 2-3 technicians | |
| Tool Recovery： Reduced recovery time Defects: Significant reduction in particle issue |
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| Vacuum Chamber Products: | ||||
| (14) HT4528D-1 280 Grit ScrubPAD | ||||
| (4) HT4536D-1 360 Grit ScrubPAD | ||||
| (1) FTPEN-1 ScrubWRIGHT™ Pen | ||||
| (1) HT4536DW-5 360 Grit ScrubBELT® | ||||
| (4) HT4754 UltraSOLV® Sponge | ||||
| (1) HT5790S-25 MiraWIPES® (25 wipes) | ||||
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| TFT-LCD G5 TEL RIE-PC Chamber Plate & Wall Clean PM Procedure: | ||||||
| PARTS TAKE-OFF AND SHIELDING | ||||||
| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ | ||||||
| Step 1: | Remove the chamber lid and lower electrode before scrubbing (Fig 1-4) | |||||
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| Fig 1 | Fig 2 |
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| Fig 3 | Fig 4 |
| Step 2: | Using a wiper and plastic bag, cap the pump tube and openings to avoid particle and moisture drop down contamination issues (Fig 5-7) | |||||
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| Fig 5 | Fig 6 | |||||
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| Fig 7 | ||||||
| CHAMBER PLATE & WALL ASSEMBLY PM | ||||||
| Step 1: | Using proper procedures and safety guidelines properly prepare TEL RIE-PC for the chamber scrub | |||||
| Step 2: | Using DI water, moisten the UltraSOLV® Sponge and Diamond ScrubPAD. Ring-out Sponge ensuring foam is moist all throughout the sponge. Keep the Sponge slightly damp with DI water (See Fig 8) | ||
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Fig 8: Dampen UltraSOLV®
Sponge and Diamond ScrubPAD with DI water
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| Step 3: | To remove surface residue and to prevent particles from contaminating other parts of the chamber, use a dampened UltraSOLV® Sponge and wipe chamber plate and wall (See Fig 9 & 10) | ||
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Fig 9 & 10: UltraSOLV® Sponge wiping chamber plate & wall |
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| Step 4: | Use dampened 280 Grit Diamond ScrubPad to scrub chamber wall and plate. Keep the Diamond ScrubPAD slightly moist with DI water | ||
| Step 5: | As loosened deposition begins to build up on chamber wall and plate, take UltraSOLV® Sponge and wipe the area free of deposition | ||
| Step 6: | When ScrubPAD loads up with deposition, pull across UltraSOLV® Sponge to unload ScrubPAD to keep the function and efficiency (See Fig 11, 12 & 13) | ||
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Fig 11: ScrubPAD loaded with deposition |
Fig 12: Pull ScrubPAD across UltraSOLV® Sponge |
Fig 13: Unloaded ScrubPAD |
| Step 7: | As UltraSOLV® Sponge becomes loaded with deposition, rinse in container of DI water (See Fig 14 & 15) | ||
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| Step 8: | Repeat steps 3 – 7, scrubbing the remaining areas of the chamber plate & wall assembly. Rinse UltraSOLV® Sponge and unload 280 Grit Diamond ScrubPAD as necessary | ||
| Step 9: | Use the ScrubWRIGHT® PEN combined with Diamond ScrubBELT® (HT4536DW-5) to scrub the trend, corner and sealing side for film removing (Fig 16-19) | ||
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| Fig 16 | Fig 17 |
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| Fig 18 | Fig 19 |
| Step 10: | Use dampened 280 Grit Diamond ScrubPad to scrub pump tube and stand pins. Keep the Diamond ScrubPAD slightly moist with DI water (Fig 20-23) | ||
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| Fig 20 | Fig 21 |
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| Fig 22 | Fig 23 |
| Step11: | Use dampened 280 Grit Diamond ScrubPAD to scrub around the slit valve door. Keep the Diamond ScrubPAD slightly moist with DI water (Fig 24 & 25) |
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| Fig 24 | Fig 25 |
| Step 12: | Use dampened 360 Grit Diamond ScrubPAD to scrub the film around the chamber lid, but be careful of the o-ring seal (Fig 26 & 27) |
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| Fig 26 | Fig 27 |
| Step 13: | Use dampened 360 Grit Diamond ScrubPAD to execute the chamber plate & wall final polishing |
| Step 14: | When deposition has been sufficiently removed throughout the entire chamber assembly, change gloves in preparation for final wipe |
| FINAL WIPE PROCEDURE: | ||
IMPORTANT NOTE |
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| THE USE OF HT5790S MiraWIPES® DURING FINAL WIPE PORTION OF PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVING PARTICLE DEFECTS | ||
Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 28a & 28b) |
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Fig 28a: Current fab wiper after completely wiping the chamber |
Fig 28b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper |
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MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY |
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| Step 15: | Use a MiraWIPE® dampened with IPA and wipe up all of the moisture and/or loosened deposition that surfaces from blowing N2, or CDA into the sealing areas and screw holes (Fig 29-32) |
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| Fig 29 | Fig 30 |
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| Fig 31 | Fig 32 |
| Step 16: | Use a HT5790S MiraWIPE®, apply IPA and proceed to wipe entire RIE-PC chamber plate & wall assembly |
| Step 17: | Prior to closing chamber, use a clean MiraWIPE® dampen with IPA and perform a final, complete chamber wipe-down (Fig 33) |
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Fig 33:
COMPLETED RIE-PC CHAMBER PLATE & WALL ASSEMBLY SCRUB
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| REFERENCE FOR PARTICLE TREND CHART |
| Customer A: |
| 1. There was the particle issue before 9/15 on tool. |
| 2. After implementing the FOAMTEC products during 9/16-9/26, you can see the increase in performance under the base line and the constant stability. |
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