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Vacuum Chamber PM Technique
TEL Unity 2 DRM Chamber
OBJECTIVE:
TO EFFECTIVELY REMOVE POLYMER ON ESC AND OXIDE RESIDUES ON CHAMBER WALL IN A TIMELY MANNER WHILE MINIMIZING PARTICLE ISSUES AND IMPROVING TOOL PERFORMANCE
 
Vacuum Chamber: TEL DRM ETCH TOOL WITH CERAMIC, ANODIZED ALUMINUM AND POLYAMIDE SURFACES
Vacuum Chamber Process Residue: PROCESS INDUCED RESIDUE
Vacuum Chamber Components: DRM CHAMBER, EXIT AND ENTRY PORTS, COMPONENTS
Old Procedure:

Standard cleanroom polyester wipers and Scotch-Brite™ scrub pads
Solvent: DI water, IPA
Vacuum Chamber Products:
TEL Unity 2 DRM Chamber PM Procedure:
View “How to” instructional videos on http://www.foamtecintlwcc.com/video/
Step 1: After the chamber has been vacuumed, clean the chamber with a lightly dampened HT4754 UltraSOLV® Sponge in order to remove any loosely adhered residues
Step 2: Cover the ESC to prevent scratching. Lightly scrub the upper ceramic areas with the HT4540A-10 UltraSOLV® ScrubPAD to remove residue. Occasionally wipe scrubbed areas with HT4754 UltraSOLV® Sponge to remove loosened residue. The same sponge can also be used to “unload” the ScrubPAD for maximum effectiveness (See Fig 1, 2 & 3)
 
ScrubPAD loaded with deposition
Pull ScrubPAD across sponge
Unloaded ScrubPAD
Fig 1: ScrubPAD loaded with deposition
Fig 2: Pull ScrubPAD across UltraSOLV® Sponge
Fig 3: Unloaded ScrubPAD
Step 3: Unload UltraSOLV® as much as possible by placing it in container of DI water and RINSE-OUT thoroughly (See Fig 4 & 5)
 
Loaded UltraSOLV Sponge
Sponge after rinse
 
Fig 4: UltraSOLV® Sponge loaded with deposition
    
Fig 5: UltraSOLV® Sponge free of deposition after rinse in DI water
    
 
Step 4: Move the pedestal to process position to access areas below and around the ESC. Using a fresh UltraSOLV® ScrubPAD, lightly scrub the vertical walls of the pedestal to remove excess residue. As build-up is loosened, follow with Sponge wipe for maximum effectiveness. Remember to unload the UltraSOLV® ScrubPAD frequently to increase cleaning efficiency. Repeat above for remaining pedestal areas
 
NOTE:

FOR PEDESTAL WALLS WITH EXTREMELY HARD RESIDUE, IT IS RECOMMENDED TO USE AN HT4580D-10, 800 GRIT DIAMOND ULTRASOLV® SCRUBPAD. FOR HARD-TO-REACH AREAS AND SMALL VERTICAL SURFACES USE AN HT174813PD SCRUBTIP®. AN HT179060 SCRUBTIP® SHOULD BE USED TO CLEAN VERTICAL SURFACES. TO FINAL CLEAN THESE AREAS USE ENOUGH HT1748 AND HT1790 ULTRASOLV® SWABS UNTIL NO VISIBLE CONTAMINATION TRANSFERS OFF SURFACE TO THE SWAB
 
Step 5: Use an HT173280 ScrubTIP® to clean areas where the bafflers are fastened to the chamber. HT1732 UltraSOLV® Swabs should be used where residue has been deposited
 
Step 6: Vacuum the scrubbed areas to ensure final removal of loosened particles
 
Step 7: Finally, wipe down chamber with 25-40 HT4790 UltraSOLV® Wipers and isopropyl alcohol
 
NOTE: IF THE BAFFLE AND CERAMIC RINGS NEED TO BE CLEANED IN PLACE, THE FOLLOWING PROCEDURE SHOULD BE USED
 
  Step: A The ceramic focus ring can be cleaned with an HT4536D-10 UltraSOLV® Diamond ScrubPAD. To final clean ceramic, wipe with HT4790 UltraSOLV® Wipers until all residue is removed
 
  Step: B The baffle is easily cleaned with HT174813PD ScrubTIP®s. The ScrubTIPs® are also effective at cleaning loose residues from the tight spaces in the “fan sector” area. Remember to clean both sides of the baffle with a fresh UltraSOLV® ScrubPAD

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