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| BEFORE | AFTER | |
| Vacuum Chamber PM Technique | ||
| Tok Photo Top Plate | ||
| OBJECTIVE: | ||
TO EFFECTIVELY REMOVE THE CONDENSED PHOTO RESIST FILM FROM THE TOK PHOTO TOP PLATE IN A TIMELY MANNER, ELIMINATE PEELING DEFECTS AND IMPROVE TOOL PERFORMANCE |
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| Vacuum Chamber: | TOK PHOTO | |
| Vacuum Chamber Process Residue: | CONDENSED PHOTO RESIST FILM | |
| Vacuum Chamber Components: | TOP PLATE |
| Old Procedure: | IPA & GENERAL WIPER | |
| PROBLEM: |
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| New Procedure: | FOAMTEC INTERNATIONAL’S PRODUCTS WITH DI WATER & IPA |
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| RESULTS: |
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| Vacuum Chamber Products: | |||
| TOK PHOTO TOP PLATE PM Kit | |||
PM Kit P/N: HT4500-TOKTP1 |
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| TOK Photo Top Plate PM Procedure: | ||||||
| View “How to” instructional videos on http://www.foamtecintlwcc.com/video/ | ||||||
| Step 1: | Using proper procedures and safety guidelines prepare TOK Photo Top Plate for wet clean | |||||
| Step 2: | Stage a small container of DI water inside a large plastic bag next to TOK Photo Top Plate | |||||
| Step 3: | Attach HT4536DC3-1, 360 Grit Diamond ScrubDISK® onto FT901 Soft ErgoSCRUB® | |||||
| Step 4: | Place HT4754 UltraSOLV® Sponge, ErgoSCRUB® w/ScrubDISK® and ScrubPAD in container of DI water to moisten products (See Fig 1) |
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Fig 1: Foamtec International products in container of DI water
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| Step 5: | Take dampened UltraSOLV® Sponge and pre-wipe top plate, removing any loose deposition or flakes. Continue to re-moisten the UltraSOLV® Sponge in container of DI water as necessary | |||||
| Step 6: | Take dampened 360 Grit Diamond ScrubDISK® attached to ErgoSCRUB® and scrub TOK Top Plate (See Fig 2) | ||||
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Fig 2: ErgoSCRUB® w/360 Grit Diamond ScrubDISK® scrubbing top plate |
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| Step 7: | As loose deposition begins to build up on the top plate, take UltraSOLV® Sponge and wipe the area free of deposition | ||||
| Step 8: | Continue to rinse out sponge in container of DI water as necessary to free UltraSOLV® Sponge of excess deposition | ||||
| Step 9: | As ScrubDISK® loads up with deposition, pull & twist ScrubDISK® across dampened UltraSOLV® Sponge to unload ScrubDISK® (See Fig 3, 4 & 5) | ||||
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Fig 3: ScrubDISK® loaded with deposition |
Fig 4: Pull and Twist ScrubDISK® across UltraSOLV® Sponge |
Fig 5: Unloaded ScrubDISK®
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| Step 10: | As UltraSOLV® Sponge becomes loaded with deposition, rinse in container of DI water (See Fig 6 & 7) | ||||
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Fig 6: Loaded-up UltraSOLV® Sponge |
Fig 7: UltraSOLV® Sponge AFTER rinse |
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| Step 11: | Repeat steps 6 – 10, scrubbing the remaining areas of the top plate. Rinse out UltraSOLV® Sponge and unload 360 Grit Diamond ScrubDISK® as necessary | |||
| Step 12: | Moisten the HT4536D 360 Grit Diamond ScrubPAD in container of DI water and re-scrub all areas of the top plate using the same technique described above (UNLOAD ScrubPAD AS NECESSARY), concentrating on the areas of heavier deposition buildup and hard to reach areas throughout the top plate (See Fig 8) | |||
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Fig 8: 360 Grit Diamond ScrubPAD scrubbing top plate |
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| Step 13: | Pending size of top plate, have second technician follow the same steps using a second FT901 ErgoSCRUB® with HT4536DC3 360 Grit Diamond ScrubDISK® and/or HT4536D 360 Grit Diamond ScrubPAD in order to minimize time of scrub (See Fig 9) | |||
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Fig 9: Two technicians scrubbing TOK Top Plate |
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| Step 14: | When deposition has been sufficiently removed from top plate, rinse out UltraSOLV® Sponge with fresh DI water and re-wipe the entire top plate in preparation for FINAL WIPE PROCEDURE |
| Step 13: | When deposition has been sufficiently removed throughout entire Quantum–X™ process chamber, rinse out UltraSOLV® Sponge with fresh DI water and re-wipe the entire Quantum–X™ Process Chamber in preparation for FINAL WIPE PROCEDURE (See Fig 12 & 13) | ||
| FINAL WIPE PROCEDURE: | ||
IMPORTANT NOTE |
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| THE USE OF HT5790S MiraWIPES® DURING THE FINAL WIPE PORTION OF THE PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM TOK TOP PLATE | ||
| Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 10a & 10b) | ||
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Fig 10a: Current fab wiper after completely wiping the top plate |
Fig 10b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper |
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MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY |
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| Step 15: | Fold an HT5790S MiraWIPE® into quarters, apply IPA throughout wiper and proceed to wipe entire TOK Photo Top Plate |
| Step 16: | Repeat as necessary with remaining MiraWIPES® to effectively wipe down TOK Photo Top Plate |
