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UltraSORB®
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| Description |
UltraSORB® is a highly absorbent wiper that combines excellent ESD characteristics with Class 100 cleanliness. Due to its sponge-like wiping capability, fiber-free construction and ability to resist shedding of particles due to abrasion, it is the perfect choice for Stencil, Thick Film Screen and Medical Device wiping applications. It's unique pore structure allows for controlled solvent transfer to screen and metal masks to aid in the removal of solder paste, conductive adhesives and thick film inks. Ideal for cleaning metal masks used to print LTCC components, capacitors, EL, and Plasma Display Panels. Due to its ability to conform to metal meshed masks, UltraSORB® enables excess paste to be thoroughly removed while minimizing abrasion to the emulsion.
| Application Advantages |
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High density construction and sponge-like properties make it ideal for particle sensitive metal mask cleaning operations. |
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Open-cell, soft foam structure allows for soft wiping to protect screen emulsions. |
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Excellent abrasion resistance and fluid retention enables fiber-free wiping of Thick Film screens, pad printers and hot molds. |
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Will not interfere with the curing of elastomers, platinum cured silicones or adhesives. |
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Allows for thorough removal of solder paste, conductive epoxies and viscous underfill materials from stencil face and apertures via under stencil wiping. |
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Uniform application of solvent to achieve "kill" ratios on aseptic surfaces. |
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Excellent abrasion resistance to reduce particle generation in-use. |
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Static dissipative to minimize the risk of ESD events. |
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Pyrogen-free for Medical Device wipe-down. |
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100% Fiber - Free. |
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Sponge-like qualities allow screens, stencils, blenders, mixers and mills to be wiped clean with far less cost, cross-contamination and generation of hazardous waste. |
| Part Numbers |
| Part No. | Dimensions | Part No. | Dimensions |
| HT4644 | .109" x 4" x 4" | HT4690 | .062" x 9" x 9" |
| HT4666 | .109" x 6" x 6" | HT4694 | .046" x 9" x 9" |
| HT4669 | .109" x 6" x 9 " | HT4699 | .109" x 9" x 9" |
| Cleanliness |
| Particles >.5�/m2 | <10,000,000/m2 | |||||
| TNVRs | ||||||
| DI H2O <.01 g/m2 | IPA <.1g/m2 | Methanol <.05 g/m2 | ||||
| Ions in DI H2O | ||||||
| Chloride < 10 ppm | Sodium < 1 ppm | Potassium < 1 ppm | ||||
Device histories, on all lot numbers, maintained to provide traceability back to raw material components. |
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| ESD Performance |
| Surface Resistance | 1.7 x 109 |
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| Volume Resistance | 1.1 x 1010 |
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| Electrostatic Delay | ± 5 kv to ± 10 volts |
< 1.5 seconds |
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All measurements performed at 50% RH |
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| Fiber Generation Comparison |
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| UltraSORB® Wiper Out-of-the-Bag |
Standard Non-woven Wiper |
UltraSORB® Wiper After Use on SMT |
Standard Non-woven Wiper |
| Methods of Use |
To maximize usage of Wiper: |
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| a) Use with IPA Solvent: Apply a thin stripe of IPA, using a needle-nosed squeeze bottle, to the area just behind the rounded fold. Do not over wet Wiper. |
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| b) Use with DI Water: Fully saturate by applying a quarter-sized amount of DI Water to the center of an unfolded Wiper, wring to ensure proper absorption, repeat until completely wetted. |
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Step 1: Quarter-fold Wiper after wetting with DI Water. For use with IPA, quarter-fold prior to wetting. |
Step 2: With all four fingers on top and the thumb on the underside of the Wiper, pull it across the surface of the tool using very light pressure. |
