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SMT (Surface Mount Technology)
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| Chip on Board (COB) |
UltraSORB® Wipers allow for thorough removal of solder paste even from 0206 sized squared off apertures without risk of fiber contamination or ESD events
Please see the UltraSORB® Datasheet for more information.
See comparison photos of aperture cleaning. Stencil Cleaning Comparison
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| Chip on Glass (COG) |
UltraSORB® Wipers allow for thorough removal of solder paste even from 0206 sized squared off apertures without risk of fiber contamination or ESD events
Please see the UltraSORB® Datasheet for more information.
See comparison photos of aperture cleaning. Stencil Cleaning Comparison
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| Chip on Flex (COF) |
UltraSORB® Wipers allow for thorough removal of solder paste even from 0206 sized squared off apertures without risk of fiber contamination or ESD events.
Please see the UltraSORB® Datasheet for more information.
See comparison photos of aperture cleaning. Stencil Cleaning Comparison
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| ESD Safe Wipers |
With the advent of bare die handling, control of ESD events has taken on a more critical nature. UltraSORB® offers Class 100 cleanliness, sponge-like absorbency and static dissipative performance, making it ideal for fine mil Stencil Printing, COB, COF, and COG printing as well as wafer bombing operations. UltraSORB® Wiper Datasheet. |
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If Class 10 cleanliness is needed, use UltraSOLV® Wipers. |
| ESD Safe Swabs |
If tools are required for precise cleaning of surface mount assemblies, 1800 Series ESD Safe Swabs and 1900 and 1900X ESD Safe Series Swabs offer cleanliness, ESD Safety, and superior absorbency of flexes, resins and epoxies. |
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