Tokyo Electron RIE Etch

Etch productivity and particle contamination control is ever more important with the advent of Gen 5, Gen 6 and Gen 7 LCD substrate sizes. Foamtec's Vacuum Chamber Cleaning tools enable technicians, for the first time to PM Tokyo Electron RIE process chambers back to a like-new-condition.


Typical Chamber Condition Pre PM	Post PM Condition

RIE Etch processes generate process residue which lead to particle related defects. Current cleaning SOP's do not enable hardened process residue to be removed from the chamber leading to high and inconsistent post PM particle levels, frequent partial cleanings and prolonged chamber recovery times.

Foamtec's Vacuum Chamber cleaning products enable RIE Etch Engineers to completely clean process induced residue from the chamber and do it in a timely manner so that particle defects are better controlled and etch productivity is improved.

To learn more about High Precision PM Techniques that improve the performance of Tokyo Electron RIE etch tools please click here or feel free to contact us