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Semiconductor manufacturing places huge demands on engineers to maximize productivity and control particle related defects. Foamtec's range of Vacuum Chamber Cleaning Products enable advanced 200MM and 300MM Fabs to maximize tool uptime while reducing post PM particle levels.
Semiconductor Manufacturers running older wafer fabs can achieve much higher levels of productivity by reducing PM times, extending MTBC and reducing Tech labor inputs.
Since 1997 Wafer Fab Equipment and Process Engineers responsible for Etch, EPI, CVD, PVD, RTP, Implant, PECVD, Photo/track, Strip, Diffusion and CMP tools have adopted our Vacuum Chamber Cleaning Products to improve equipment PM procedures. Vacuum Chamber Cleaning Products and Procedures have been designed to eliminate the following PM Problems:
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ScotchBrite Related Particle and Metal Contamination
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Commercial sand paper related contamination
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H2O2 related safety and recovery time issues
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Non Absorbent clean room wiper related Post PM residue
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