STS Plasma Etching
STS Plasma etch users face challenging equipment maintenance issues as the process induced residue is very hard to completely clean using Scotch-Brite™ abrasive hand pads. As a result most STS Plasma etch PM's are characterized by prolonged scrubbing routines and recovery times. In addition extensive seasoning is required to control particle contamination.
Foamtec's Vacuum Chamber Cleaning Products makes these PM related issues a thing of the past.
|STS RIE Etch tools Cleaned With Foamtec High Precision PM Kits Can Be Returned to Like New Condition in Much Less Time|
|Traditional Cleaning SOP's Leave Process Residue Causing Long Recovery Times and Create Scotch-Brite™ Related Particle Issues||Foamtec's Vacuum Chamber Cleaning Kits Eliminate Scotch-Brite™ and Return Chambers to Like New Condition|
STS Plasma Etch Engineers can realize much faster PM's, shorter recovery times and reduced particle issues. Foamtec's High Precision PM Techniques and Vacuum Chamber PM kits enable significant improvements in STS Plasma etch productivity. To learn more please contact us.
Scotch-Brite™ is a trademark of 3M Corporation