Vacuum Chamber Cleaning
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Vacuum Chamber Cleaning Products Enable Much Faster PM's and Reduced Particle Levels
Vacuum Chambers present difficult cleaning problems for equipment engineers and vacuum technicians.
Since 1997 our UltraSOLV® Chamber Cleaning products have enabled Equipment Engineers to quickly and thoroughly remove and clean process deposition from a wide range of vacuum chambers used throughout the Semiconductor, Flat Panel Display, Disk Drive and Optics Industries, by eliminating the use of:
- Scotchbrite®
- Commercial sand paper
- H2O2
- Non Absorbent clean room wipers
With the advent of sub 65 nanometer processing geometries and the cost pressures associated with 300mm fabs Process and Equipment Engineers need assistance improving post PM particle performance and equipment uptime. Likewise with the need to expand solar cell production Photovoltaic Fab Managers need assistance removing stubbornly adhered SiNx process residue from Roth and Rau and Centrotherm CVD tools.
Our worldwide network of Sales Engineers have a proven track record of reducing defect on wafer metrics, reducing 300mm tool Cost of Ownership and speeding up PM’s on PECVD tools in the Solar Cell Industry.
Vacuum Chamber PM Kits are used throughout the world in 200MM and 150MM wafer fabs to improve uptime.
The most difficult to clean Oxide, Nitride and fluorinated glass process residues can be removed more easily from Vacuum Chambers
Vacuum Chamber Process Parameters are Improved:
- Reduced post PM Particle Counts
- Reduction of Cleaning Times
- Reduction of Recovery Times
- Reduction of PM generated Hazardous Waste
- Improved film uniformity in thermal CVD processes
Learn more about our cleaning protocols for the following tools and modules:
Tools:Process Tools:
- CVD Chamber
- Endura
- Etch, Metal and Non-Metal
- HDP Dome
- HDP Chamber
- Implant Chamber
- Implant Parts
- Implant Source
- Plasmatherm Chamber
- PVD
- TxZ
- WxZ
- PECVD
Scotchbrite® is a registered trademark of 3M


