Semiconductor Manufacturing

In 300mm wafer fabs, the advent of sub 40nm nodes and 3D memory processes have required ever tighter contamination control measures in order to maintain acceptable yields.

• Equipment engineers are struggling to implement high precision PM’s in order to reduce defects and improve tool availability.

• Process engineers and Eh&S require reductions in VOC’s. [Learn how to reduce VOC's in Wafer Fabs]

• Particles are major contributors to scratch defect, backside contamination and “hot spot” issues and lead to significant reductions in yield, reliability and fab productivity.
[See a Solution]

• 200 and 300 mm fabs often resort to using expensive test wafers as gettering wafers in order qualify tools after wet cleans.

Foamtec, has pioneered innovative UltraSOLV ScrubPADS and MiraWIPES that have enabled dramatic improvements in wet clean procedures and step change reductions in particle levels on wafer processing tools. Foamtec’s Hi Vac qualified abrasives and wipers are production proven on process chambers, end stations, electrostatic chucks and wafer transfer robotics to reduce particle defects, test wafer usage, hazardous solvents and tool downtime.

The Foamtec International Sales/Application Engineering Staff has worked closely with the leading Tool Manufacturers and Equipment Engineers, to develop High Precision PM Procedures that drive improved tool performance and reduced cost of ownership. We have a world wide network of factory trained equipment engineers to help our customers upgrade vacuum chamber pm procedures.






ALD Chamber Cleaning

The Foamtec International Sales/Application Engineering Staff has worked closely with the leading Tool Manufacturers and wafer fab professionals.

CMP Slurry Cleaning

Vacuum Chamber Cleaning Products are designed to give CMP Engineers the ability to improve PM protocols, and give our customers the opportunity to reduce Cost and Mean Time to Clean (MTTC) while improving tool availability.

 

CVD

Chemical Vapor Deposition Vacuum Chambers can be cleaned safely and quickly with less particle adders and improved uptime.Chemical Vapor Deposition PM Kits are available for PECVD, LPCVD, HDP and MOCVD Tools.

Ion Implant

High Precision PM kits enable technicians to quickly and thoroughly clean process residues containing arsenic, phosphorus, and boron without the use of Scotch Brite™ and hydrogen peroxide.

Plasma Etching

Improve Post Wet Clean Particle Control.

Proper Cleaning of O-Ring Grooves

Preventing High Vacuum Leaks due to improper cleaning of O-Ring Grooves.

PVD

Vacuum Chamber Cleaning Products are designed to give PVD Engineers the ability to improve PM protocols, and give our customers the opportunity to reduce Cost and Mean Time to Clean (MTTC) while improving tool availability.

RTP Reflector Cleaning

MiraWIPE® enables the quick removal of stubborn stains from reflectors with much less risk of damage as compared to traditional clean room wipers.