Reduce Post-PM Particle Adders and Improve First-Pass QUAL
Maintenance should improve tool performance—not introduce contamination.
Foamtec helps semiconductor fabs reduce post-PM particle adders, improve first-pass qualification, and accelerate green-to-green time.
Why Particle Adders Increase After Preventive Maintenance
After preventive maintenance (PM), many tools experience:
- Increased particle counts
- Failed first-pass QUAL
- Extended recovery time
- Additional cleaning cycles
These “particle adders” often originate from:
- Cleaning materials
- Residue left in the chamber
- Re-deposition during cleaning
- Cross-contamination between tools
Cleaning After PM Is a Major Source of Contamination
While PM is intended to restore tool performance, the cleaning process itself often introduces contamination.
Common gaps include:
- Use of fiber-shedding wipes
- Ineffective residue removal
- Lack of controlled cleaning hierarchy
- No strategy to prevent re-deposition
Where Post-PM Particle Adders Come From
- Fiber shedding from wipes and *Scotch-Brite™
- Residue and deposition left in chamber
- Agglomerated material re-deposited
- Inefficient cleaning methods
- Cross-contamination from tools or materials
- Inconsistent operator technique
- *Scotch-Brite™ is a trademark of 3M Corporation
A Controlled Approach to Post-PM Cleaning
Remove Residue → Capture Particles → Prevent Re-Deposition → Reduce Adders → Improve QUAL
Foamtec helps semiconductor manufacturers reduce post-PM contamination by:
- Using non-shedding materials
- Removing residue and by-products effectively
- Preventing re-deposition during cleaning
- Standardizing cleaning methods
Solutions for Post-PM Particle Reduction
Low-Particle, Non-Shedding Cleaning Materials
Eliminate fiber contamination introduced during cleaning.
Residue & By-Product Removal Systems
Remove polymerized deposition and process residues.
Re-Deposition Prevention
Capture and retain removed material to prevent spreading contamination.
Impact on Fab Performance
- Improved first-pass QUAL rates
- Reduced particle adders after PM
- Faster green-to-green time
- Reduced re-cleaning and downtime
- Improved tool availability
- Reduced wafer defects
Where Post-PM Particle Reduction Matters Most
- Etch tools
- PVD systems
- CVD chambers
- Electrostatic chucks (ESCs)
- Process kits and hardware
- Vacuum chambers
Reduce Adders at the Source—Cleaning
Foamtec solutions are designed to eliminate contamination introduced during maintenance, improving downstream tool performance.
Frequently Asked Questions About Post-PM Particle Adders
Why do particle levels increase after PM?
Because cleaning processes can introduce particles, residue, or fibers into the chamber.
What are particle adders?
Particles introduced into the process after maintenance or cleaning.
How do you improve first-pass QUAL?
By reducing contamination introduced during cleaning and improving removal of residues.
What causes failed QUAL after PM?
Residual contamination, fiber shedding, and re-deposition during cleaning.
How do you reduce green-to-green time?
By reducing post-PM contamination and minimizing re-cleaning cycles.
About Foamtec WCC
Foamtec's mission is to enable contamination control professionals to improve particle control in clean rooms by solving surface contamination challenges. The Wilshire Contamination Control Division of Foamtec International supplies clean room mops, foam swabs, microfiber swabs, foam wipers, microfiber wipers, UltraSOLV® ScrubPADS to address clean room cleaning and the critical cleaning of process equipment.