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How to Minimize Cross Contamination of Components Assembled into Wafer Process Chambers During Wet Cleans

by | Jan 13, 2023

When it comes to running semiconductor processes in vacuum chambers, maintaining equipment uptime is crucial for productivity. However, one major challenge that fabs face is the problem of “glove prints” or ghost prints on components such as liners, quartz rings, lamps, shields, diffusion tubes, ceramics, gas dispersion plates and electrostatic chucks. These prints are caused by the transfer of polymer from gloves worn by operators during handling and installation.

Side by side view of glove print contamination on a silicon electrode.

This type of contamination can lead to several issues, including failure of the process, high post PM particle counts, and poor mean time between wet cleans. These issues are particularly concerning in fabs running sub 14nm geometries, where even small amounts of contamination can have a significant impact on the process.

To address this challenge, Foamtec has developed MiraGLOVE, which is constructed from the same microfiber fabric used for the MiraWIPE, the wiper of choice in the most advanced wafer fabs. MiraGLOVE has been adopted at leading foundries to prevent ghost print contamination on process chamber components. The microfiber fabric used in MiraGLOVE is engineered to be highly absorbent and durable, making it the perfect choice for preventing contamination in semiconductor processes.

Ghost prints transferred cleanroom gloves to high intensity RTP Lamps are a major cause of lamp failure during wafer processing. MiraGLOVE’s microfiber fabric is laundered to eliminate transfer of metallics and organics to wafer contact surfaces.

In addition to preventing contamination, MiraGLOVE also helps to maintain equipment uptime by reducing the need for unscheduled downtime. This is because the glove is less likely to transfer polymer to the parts, which means that process by-product will not peel off the area contaminated by the glove. This in turn means that fabs can run more efficiently and with less downtime, ultimately boosting productivity.

Process by-product peeling is a significant cause of unscheduled wet cleans in CVD and diffusion.

In conclusion, sourcing a glove that transfers less polymer to the parts is essential for maintaining equipment uptime in semiconductor processes. MiraGLOVE is an excellent choice for fabs looking to prevent ghost print contamination and maintain equipment uptime. With its microfiber fabric construction and high absorbency, MiraGLOVE is an ideal solution for semiconductor processes in vacuum chambers.

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