Cleaning Critical Surfaces in Cleanrooms
Compound Semiconductor Cleaning Applications
Compound Semiconductor and substrate fabs must integrate Environmental Health and Safety(EHS) requirements into contamination control procedures used to maintain equipment & cleanrooms.
Various III-V particulates are generated in process modules such as CMP, MOCVD, Implant & Plasma Etch which require PM & Housekeeping procedures to leave equipment and cleanroom surfaces free of toxic materials.
PharmaSAT enables housekeeping staff to dramatically improve cleanroom cleanliness and reduce trace amounts of toxic dust on floors, walls and other vertical surfaces.
Process chamber PM procedures expose maintenance techs to GaN, GaAs, InP and other III-V materials so "wet cleans" must be designed to minimize airborne particle generation and technician exposure to the chamber.
Foamtec’s High Precision Maintenance techniques utilizing ScrubPADS, UltraSOLV Sponges and MiraWIPE or MiraSAT enable MOCVD, MOVPE, III-V Plasma Etch, Sputter tools and Ion Implant enable wet cleans to be far more efficient & safe.
Plasma-Therma Etch
Plasma-Therm Reactive Ion Etch Equipment can be cleaned much more quickly with Reduced Post PM Particles
STS Etch
STS Plasma etch users face challenging equipment maintenance issues.