Semiconductor Manufacturing
Foamtec International Contamination Control Division
Reduce Post-PM Particle Adders. Improve First-Pass QUAL. Accelerate Green-to-Green Time.
At advanced nodes (10nm, 7nm, 5nm, and beyond), equipment engineers are under constant pressure to reduce post-PM particle counts, shorten recovery time, and improve tool availability. Even minor contamination events can delay qualification, increase reclean cycles, and disrupt fab throughput.
Foamtec partners with wafer fab equipment engineers to solve the root causes of contamination—not just clean around them.
Our engineered chamber cleaning solutions + proven PM BKMs enable measurable improvements in:
- Post-PM particle adders (reduction at source)
- First-pass QUAL rates (first-time-right cleaning)
- Green-to-green time (faster chamber recovery)
- Mean Time to Clean (MTTC) and technician efficiency
- Elimination of reclean loops and particle excursions
Foamtec combines cleanroom-engineered materials, abrasive technologies, and contamination diagnostics to help fabs achieve repeatable, high-performance PM outcomes.
The Challenge: Why PM Cleaning Still Limits Tool Performance
Most wafer fabs struggle with:
- Residual process by-products (metal, oxide, polymer films) that are difficult to fully remove
- Particle reintroduction during cleaning from traditional wipes or abrasives
- Inconsistent PM execution across shifts and technicians
- Extended qualification cycles due to high particle adders
- Dependence on gettering wafers to recover tools
As device geometries shrink, tolerance for contamination drops dramatically, making PM cleaning one of the largest hidden drivers of yield loss and tool downtime.
The Foamtec Approach: Engineer Better PM Outcomes
1. Remove Contamination at the Source
Engineered foam, microfiber, and abrasive solutions are designed to:
- Break up hardened deposition films and residues
- Capture and retain particles (not redistribute them)
- Eliminate fiber shedding risks from traditional wipers
2. Enable First-Time-Right Cleaning
Foamtec PM solutions help engineers:
- Achieve consistent, repeatable cleaning results
- Reduce technician variability
- Minimize reclean cycles and rework
Result: Higher first-pass QUAL rates and faster tool release
3. Reduce Green-to-Green Time
By improving cleaning effectiveness during PM, fabs can:
- Reduce time spent troubleshooting particle excursions
- Eliminate extended qualification loops
- Decrease reliance on gettering wafers
Result: Faster return to production and improved tool availability
4. Identify Root Cause of Particle Escalations
Foamtec also enables:
- Root cause identification of particle sources
- Detection of fiber contamination, scratch defects, and hotspot events
This allows engineers to move from reactive cleaning → proactive contamination control.
Atomic Layer Deposition (ALD) Chamber Preventive Maintenance Cleaning
- Remove thin-film residues without damaging sensitive surfaces
- Improve post-PM particle performance
Chemical Mechanical Polishing (CMP) Slurry Preventive Maintenance Cleaning
- Remove hardened slurry deposits from Tool interiors & Module walls and floors
- Improve cleanliness of polishing environments
Chemical Vapor Deposition (CVD) Preventive Maintenance Cleaning
- Reduce particle adders and improve uptime
- Enable faster, safer chamber cleaning
Ion Implant Preventive Maintenance Cleaning Applications
- Safely clean dopant residues (As, P, B)
- Eliminate need for aggressive, contamination-prone methods
Plasma Etching Preventive Maintenance Cleaning
- Improve post-wet clean particle control
- Reduce contamination-driven yield loss
Proper Cleaning of O-Ring Grooves to Prevent Scratches and Vacuum Leaks Video
Physical Vapor Deposition (PVD) Preventive Maintenance Cleaning Applications
- Improve Mean Time to Clean (MTTC)
- Reduce cost of ownership while increasing tool availability
MiraWIPE Reflector Preventive Maintenance Cleaning in Rapid Thermal Processing (RTP) Tools
- Clean reflectors with lower risk of scratching or contamination
- Improve optical performance and consistency
About Foamtec WCC
Foamtec's mission is to enable contamination control professionals to improve particle control in clean rooms by solving surface contamination challenges. The Wilshire Contamination Control Division of Foamtec International supplies clean room mops, foam swabs, microfiber swabs, foam wipers, microfiber wipers, UltraSOLV® ScrubPADS to address clean room cleaning and the critical cleaning of process equipment.