HT5760S

MiraWIPE’s high strength fabric, durable sealed border and proprietary washing process is designed for cleaning small surfaces and critical tooling in sub-28nm wafer fabs and gowning rooms. Ideal for removing stubbornly adhered particles and stains on wafer contact and high vacuum chambers. The ultrasonic, wide-sealed border reduces fiber generation during heavy duty wiping procedures. The proprietary washing process ensures compatibility with ISO Class 3-5 clean rooms.