HT5790S-25

MiraWIPE’s high strength fabric, durable sealed border and proprietary washing process is designed for the most demanding equipment cleaning applications in sub-28nm wafer fabs, where surfaces must be free of residue and particulate contamination. Ideal for removing stubbornly adhered particles and stains on wafer contact and high vacuum chambers. The ultrasonic, wide-sealed border reduces fiber generation during heavy duty wiping procedures. The proprietary washing process ensures compatibility with ISO Class 3-5 clean rooms.