Wafer scratch defects result in costly rejected die in the semiconductor manufacturing industry across all technology nodes and wafer sizes. Given that scratch defects generate significant yield loss, it is imperative to identify the source of contamination. Scratch...
Complying with EPA New Source Requirements(NSR) make Investing in new wafer fabs or expanding existing sites more costly and complicated. As the following link makes clear plant expansions in non-attainment areas are even more complicated....
Defects in 200mm & 300mm litho modules are a common, yet costly issue. A major source of defects in lithography modules are fibers & particulates including resist particles that have been left in the track. Contamination that migrates to the scanner or stepper...
With the advent of sub 20nm device geometries, wafer fabs face daunting challenges scaling these new nodes to yields that earn acceptable ROI. Ramping production at acceptable yields is imperative due to the much higher equipment costs, especially lithography and...
