Solving the Particle Puzzle in Sub-7nm Fabs: How PolyCHECK Helps Metrology Teams Trace the Source
by Foamtec WCC | Mar 28, 2025 | particle identification, Semiconductor
As device geometries shrink below 7nm, the number of in-line metrology steps per wafer has dramatically increased, introducing more frequent tool contact and more opportunities for particle contamination. Every unidentified particle excursion risks false defect calls,...
Reducing Vacuum Leaks and Improving Equipment Uptime with Foamtec ScrubBELTS, MiraWIPE, and MiraSWAB
by Foamtec WCC | Feb 25, 2025 | Swabs, vacuum chamber cleaning
In wafer fabrication, high-vacuum (hi-vac) systems are essential for etching and deposition process steps. However, even minor vacuum leaks can lead to process disruptions, wafer defects, and costly downtime. These leaks often originate from degraded seals, particle...
Maximizing Ion Implanter Performance with Foamtec’s UltraSOLV, Diamond ScrubPADS, and MiraWIPE Cleaning Solutions
by Foamtec WCC | Jan 3, 2025 | vacuum chamber cleaning
Ion implanters are critical tools in semiconductor manufacturing, but their complexity makes preventive maintenance (PM) time-intensive. Wafer fab equipment engineers must optimize PM practices to maintain high tool performance and meet production demands. Current...
Boosting Wafer Starts in Space-Constrained Fabs with Foamtec’s UltraSOLV ScrubPADS
by Foamtec WCC | Dec 30, 2024 | vacuum chamber cleaning
As semiconductor manufacturing demand grows, many wafer fabs face a critical challenge: maximizing wafer starts without expanding cleanroom space. With facility expansion often cost-prohibitive or impractical, fabs must focus on optimizing existing resources. One...