Redefining PM Procedures for Electrostatic Chucks to Improve Post PM Particle Performance and Increase Service Life
by Foamtec | Mar 22, 2023 | cleanroom cleaning, cleanroom wipes, foreign particle contamination, particle control
In wafer fabs, cleaning electrostatic chucks (ESCs) and wafer pedestals is crucial in vacuum chamber PMs. The ESCs are susceptible to scratch damage, so traditional cleaning tools like *Scotch-Brite™ are not recommended. Instead, customers have adopted ceramic blades...
How Advanced Cleanroom Wipers can Reduce Random Defects in Wafer Fabs
by Foamtec | Mar 14, 2023 | cleanroom cleaning, cleanroom wipes, foreign particle contamination, particle control, particle identification, Wipers
The semiconductor industry has revolutionized how we live and work by enabling technological advancements. The fabrication process of chips for automotive, RF, aerospace and medical applications requires extreme precision and cleanliness to ensure high yields and...
Improving Vacuum Chamber Cleanliness by Removing Particles Entrapped in Lift Pin Ports
by Foamtec | Feb 16, 2023 | cleanroom cleaning, cleanroom swabs, foreign particle contamination, particle control, Swabs
As semiconductor technology advances, the need for cleanliness in wafer fabs becomes more and more critical. With geometries becoming smaller and smaller, any particle or contamination can cause serious issues. Eliminating particle contamination entrapped in Lift-off...
How to Reduce PM Times and Improve Post PM Particle Levels in E-beam Evaporators
by Foamtec | Jan 19, 2023 | cleanroom cleaning, foreign particle contamination, particle control
Electron-Beam evaporation (E-Beam evaporation) and Ion assisted e-beam evaporation are widely used techniques for depositing dense thin films or metals and dielectrics. However, to ensure high-purity films, it is essential to carefully consider the items used to...