Select Page

The Persistent Threat: Lift Pin Port Contamination in AMAT Endura PVD Chambers

by | Jun 25, 2024

In the fast-paced world of wafer fabrication, AMAT Endura PVD tool engineers constantly strive to optimize tool uptime, minimize post-PM particle levels, and reduce defectivity. One often-overlooked area that can significantly impact these critical metrics is lift pin port contamination on the Minimum Contact Area (MCA) electrostatic chuck within AMAT Endura Physical Vapor Deposition (PVD) chambers. Cleaning the lift pin ports has become even more critical with each technology node advancement but has always been challenging.

Here’s why lift pin port contamination in the MCA electrostatic chuck can impede AMAT Endura PVD performance:

  • The Uptime Killer: Lift pinholes act as hidden reservoirs for particles. During operation, the movement of the lift pins can dislodge these trapped contaminants, leading to particle excursions within the chamber. These excursions disrupt thin film deposition and potentially damage wafers, resulting in scrapped products and unscheduled preventative maintenance (PM) to address the contamination. This translates to reduced tool uptime and lost production time.
  • The Particle Persistence Problem: Traditional cleaning methods for lift pin ports often have limitations. Standard swabs are either too large or too small. If too small, they will not make good contact with the lift pinhole’s inner diameter (ID), requiring multiple passes and increasing cleaning time. Conversely, overly large swabs risk getting stuck and causing further complications. These limitations can lead to incomplete cleaning, allowing particles to remain lodged within the lift pin ports. Over time, these residual particles contribute to elevated post-PM particle levels, jeopardizing the cleanliness of subsequent wafer batches.
  • The Detached Swab Head Nightmare: Beyond incomplete cleaning, some traditional swabs are susceptible to head detachment during cleaning due to their fabrication methods. A detached swab head lodged in a lift pin port can cause significant downtime while technicians remove it, further impacting production efficiency and potentially causing additional chamber contamination.



The HT1527FC PVD Lift Pin Hole Swab: A Targeted Solution for Uptime and Yield

The HT1527FC PVD lift pinhole swab offers a powerful solution, helping engineers achieve optimal AMAT Endura PVD performance and improved defectivity rates. Here’s how it makes a difference:

  • Precise Fit and Superior Cleaning: The swab is meticulously designed to make good contact with the entire ID of lift pin holes throughout the AMAT Endura chamber. This ensures thorough cleaning and particle capture, minimizing the risk of missing contaminants and subsequent particle excursions.
  • Reinforced Head for Safe and Efficient Cleaning: The swab head is reinforced to prevent detachment during cleaning, eliminating the risk of a detached head causing extended downtime and potential contamination.
  • Reduced Cleaning Time and Risk: The appropriate size and design allow for effective cleaning in a single pass, saving valuable time and minimizing the risk of human error associated with multiple swab usage.



Incorporating the HT1527FC swab into your cleaning SOP ensures clean lift pin ports and minimizes particle contamination within your AMAT Endura chambers. This translates to:

  • Increased Tool Uptime: Reduced particle excursions and the need for unscheduled PMs lead to more efficient tool utilization and higher overall productivity.
  • Lower Post-PM Particle Levels: Superior cleaning ensures minimal particle carryover, contributing to consistently low post-PM particle counts and a cleaner deposition environment.
  • Improved Defectivity Rates: By minimizing particle contamination, the HT1527FC swab helps reduce defects on your wafers, ultimately leading to higher yields and better-quality products.

Keeping your AMAT Endura PVD chamber clean starts with the right tools. The HT1527FC PVD lift pinhole swab addresses the shortcomings of traditional methods, ensuring optimal performance, protecting your valuable wafers from contamination, and empowering engineers to achieve superior process results.